IC LVC/LCX/Z SERIES, DUAL POSITIVE EDGE TRIGGERED J-KBAR FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16, PLASTIC, TSSOP1-16, FF/Latch
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | TSSOP |
| 包装说明 | PLASTIC, TSSOP1-16 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e4 |
| 长度 | 5 mm |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | J-KBAR FLIP-FLOP |
| 最大频率@ Nom-Sup | 150000000 Hz |
| 最大I(ol) | 0.024 A |
| 湿度敏感等级 | 1 |
| 位数 | 2 |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Sup | 7.5 ns |
| 传播延迟(tpd) | 7.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 4.4 mm |
| 最小 fmax | 225 MHz |

| 74LVC109PW | 74LVC109PW,118 | 74LVC109PW,112 | 74LVC109D,118 | 74LVC109DB,112 | 74LVC109DB,118 | 74LVC109D | |
|---|---|---|---|---|---|---|---|
| 描述 | IC LVC/LCX/Z SERIES, DUAL POSITIVE EDGE TRIGGERED J-KBAR FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16, PLASTIC, TSSOP1-16, FF/Latch | IC FF JK TYPE DUAL 1BIT 16TSSOP | IC FF JK TYPE DUAL 1BIT 16TSSOP | IC FF JK TYPE DUAL 1BIT 16SO | IC FF JK TYPE DUAL 1BIT 16SSOP | IC FF JK TYPE DUAL 1BIT 16SSOP | IC LVC/LCX/Z SERIES, DUAL POSITIVE EDGE TRIGGERED J-KBAR FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16, PLASTIC, SO-16, FF/Latch |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | TSSOP | TSSOP | TSSOP | SOP | SSOP1 | SSOP1 | SOIC |
| 包装说明 | PLASTIC, TSSOP1-16 | TSSOP, TSSOP16,.25 | TSSOP, TSSOP16,.25 | PLASTIC, SO-16 | PLASTIC, SSOP2-16 | PLASTIC, SSOP2-16 | SOP, SOP16,.25 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 5 mm | 5 mm | 5 mm | 9.9 mm | 6.2 mm | 6.2 mm | 9.9 mm |
| 负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | TSSOP | SOP | SSOP | SSOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 传播延迟(tpd) | 7.5 ns | 8.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.75 mm | 2 mm | 2 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 4.4 mm | 4.4 mm | 4.4 mm | 3.9 mm | 5.3 mm | 5.3 mm | 3.9 mm |
| 最小 fmax | 225 MHz | 150 MHz | 225 MHz | 225 MHz | 225 MHz | 225 MHz | 225 MHz |
| 最大频率@ Nom-Sup | 150000000 Hz | 150000000 Hz | 150000000 Hz | - | 150000000 Hz | - | 150000000 Hz |
| 最大I(ol) | 0.024 A | 0.024 A | 0.024 A | - | 0.024 A | - | 0.024 A |
| 封装等效代码 | TSSOP16,.25 | TSSOP16,.25 | TSSOP16,.25 | - | SSOP16,.3 | - | SOP16,.25 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | - | 3.3 V |
| Prop。Delay @ Nom-Sup | 7.5 ns | 7.5 ns | 7.5 ns | - | 7.5 ns | - | 7.5 ns |
| Brand Name | - | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | - |
| 制造商包装代码 | - | SOT403-1 | SOT403-1 | SOT109-1 | SOT338-1 | SOT338-1 | - |
| Is Samacsys | - | N | N | N | N | N | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - |
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