SES Series
Low Capacitance ESD Protector Array
SES5VSC70-6U
ROHS
Description
SES5VSC70-6U are surge rated diode arrays designed to protect high speed data interfaces. This device has been
specifically designed to protect sensitive components which are connected to data and transmission lines from
overvoltage caused by ESD
transients).
The unique design incorporates surge rated, low capacitance
steering diodes and a TVS diode in a single package. During
transient conditions, the steering diodes direct the transient to
either the positive side of the power supply line or to ground. The
internal TVS diode prevents over-voltage on the power line,
protecting any downstream components.
The low capacitance array configuration allows the user to
protect four high-speed data or transmission lines. The low
inductance construction minimizes voltage overshoot during high
current surges. This device is optimized for ESD protection of
portable electronics. They may be used to meet the ESD
immunity requirements of IEC 61000-4-2, Level 4 (±15kV air,
±
8kV contact discharge).
(electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast
Feature
Array of surge rated diodes with internal TVS Diode
SC-70-6 Package
Protects up to four I/O lines & power line
Low capacitance (<2pF) for high-speed interfaces
No insertion loss to 2.0GHz
Low leakage current and clamping voltage
Low operating voltage: 5.0V
Solid-state silicon-avalanche technology
Transient protection for data lines to IEC 61000-4-2(ESD)
±15KV(air),
±8KV(contact);
IEC 61000-4-4 (EFT) 40A (5/50ns)
Applications
USB 2.0
USB OTG
Monitors and Flat Panel Displays
Displays Digital Visual Interface (DVI)
High-Definition Multimedia Interface (HDMI)
Gigabit Ethernet
SIM Ports
IEEE 1394 Firewire Ports
ESD Protector
1
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SES Series
Low Capacitance ESD Protector Array
SES5VSC70-6U
ROHS
Electrical characteristics per line@25℃(unless otherwise specified)
Parameter
Reverse stand-off voltage
Reverse Breakdown voltage
Reverse Leakage Current
Clamping Voltage
Clamping Voltage
note1
Symbol
V
RWM
V
BR
I
R
V
C
V
C
Conditions
Pin 5 to 2
I
t
= 1mA Pin 5 to 2
V
RWM
= 5V T=25℃ Pin 5 to 2
I
PP
= 1A t
P
= 8/20μs
Any pin to 2
I
PP
= 6A t
P
= 8/20μs
Any pin to 2
V
R
=0V f = 1MHz
Any I/O pin to pin 2
V
R
=0V f = 1MHz
Between I/O pins
Min.
6
Typ.
Max.
5
2
15
25
Units
V
V
μA
V
V
pF
pF
2
1
Junction Capacitance
C
j
Note 1: I/O pins are pin 1, 3, 4, and 6
Absolute maximum rating @25℃
Rating
Peak Pulse Power (t
p
=8/20μs)
Peak Pulse Current (t
p
=8/20μs)
Operating Temperature
Storage Temperature
Symbol
P
pp
I
PP
T
J
T
STG
Value
150
6
-55 to +150
-55 to +150
Units
W
A
℃
℃
Typical Characteristics
ESD Protector
2
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SES Series
Low Capacitance ESD Protector Array
SES5VSC70-6U
ROHS
Typical Characteristics
ESD Protector
3
www.goodark.com
SES Series
Low Capacitance ESD Protector Array
SES5VSC70-6U
ROHS
Application Information
Device Connection Options for Protection of Four High-Speed Data Lines
This device is designed to protect data lines by clamping them to a fixed reference. When the voltage on the protected line
exceeds the reference voltage the steering diodes are forward biased, conducting the transient current away from the
sensitive circuitry. Data lines are connected at pins 1, 3, 4 and 6. Pin 2 should be connected directly to a ground plane. The
path length is kept as short as possible to minimize parasitic inductance. The positive reference is connected at pin 5. The
options for connecting the positive reference are as follows:
1. To protect data lines and the power line, connect pin 5 directly to the positive supply rail (V
CC
). In this configuration the data
lines are referenced to the supply voltage. The internal TVS diode prevents over-voltage on the supply rail.
2. In applications where the supply rail does not exit the system, the internal TVS may be used as the reference. In this case,
pin 5 is not connected. The steering diodes will begin to conduct when the voltage on the protected line exceeds the working
voltage of the TVS (plus one diode drop).
3. In applications where complete supply isolation is desired, the internal TVS is again used as the reference and V
CC
is
connected to one of the I/O inputs. An example of this configuration is the protection of a SIM port. The Clock, Reset, I/O, and
VCC lines are connected at pins 1, 3, 4, and 6. Pin 2 is connected to ground and pin 5 is not connected.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of
100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is
placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore,
these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free
compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.
ESD Protector
4
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SES Series
Low Capacitance ESD Protector Array
SES5VSC70-6U
ROHS
Product dimension and pad size
Revision
ESD Protector
Date
5
Changes
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