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IS61LPS25618A-250B3I

产品描述256KX18 CACHE SRAM, 2.6ns, PBGA165, 15 X 13 MM, TF-BGA-165
产品类别存储    存储   
文件大小320KB,共26页
制造商ABLIC
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IS61LPS25618A-250B3I概述

256KX18 CACHE SRAM, 2.6ns, PBGA165, 15 X 13 MM, TF-BGA-165

IS61LPS25618A-250B3I规格参数

参数名称属性值
厂商名称ABLIC
零件包装代码BGA
包装说明TBGA,
针数165
Reach Compliance Codeunknown
最长访问时间2.6 ns
其他特性PIPELINED ARCHITECTURE
JESD-30 代码R-PBGA-B165
长度15 mm
内存密度4718592 bit
内存集成电路类型CACHE SRAM
内存宽度18
功能数量1
端子数量165
字数262144 words
字数代码256000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织256KX18
封装主体材料PLASTIC/EPOXY
封装代码TBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, THIN PROFILE
并行/串行PARALLEL
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式BALL
端子节距1 mm
端子位置BOTTOM
宽度13 mm

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IS61(64)LPS12832A
IS61(64)LPS12836A IS61(64)VPS12836A
IS61(64)LPS25618A IS61(64)VPS25618A
128K x 32, 128K x 36, 256K x 18
4 Mb SYNCHRONOUS PIPELINED,
SINGLE CYCLE DESELECT STATIC RAM
FEATURES
• Internal self-timed write cycle
• Individual Byte Write Control and Global Write
• Clock controlled, registered address, data and
control
• Burst sequence control using MODE input
• Three chip enable option for simple depth
expansion and address pipelining
• Common data inputs and data outputs
• Auto Power-down during deselect
• Single cycle deselect
• Snooze MODE for reduced-power standby
• Power Supply
LPS: V
DD
3.3V + 5%, V
DDQ
3.3V/2.5V + 5%
VPS: V
DD
2.5V + 5%, V
DDQ
2.5V + 5%
• JEDEC 100-Pin TQFP, 119-ball PBGA, and
165-ball PBGA packages
• Automotive temperature available
• Lead Free available
JANUARY 2010
DESCRIPTION
The
ISSI
IS61(64)LPS12832A, IS61(64)LPS/VPS12836A
and IS61(64)LPS/VPS25618A are high-speed, low-power
synchronous static RAMs designed to provide burstable,
high-performance memory for communication and network-
ing applications. The IS61(64)LPS12832A is organized as
131,072 words by 32 bits. The IS61(64)LPS/VPS12836A
is organized as 131,072 words by 36 bits. The IS61(64)LPS/
VPS25618A is organized as 262,144 words by 18 bits.
Fabricated with
ISSI
's advanced CMOS technology, the
device integrates a 2-bit burst counter, high-speed SRAM
core, and high-drive capability outputs into a single mono-
lithic circuit. All synchronous inputs pass through regis-
ters controlled by a positive-edge-triggered single clock
input.
Write cycles are internally self-timed and are initiated by
the rising edge of the clock input. Write cycles can be one
to four bytes wide as controlled by the write control inputs.
Separate byte enables allow individual bytes to be written.
The byte write operation is performed by using the byte
write enable (BWE) input combined with one or more
individual byte write signals (BWx). In addition, Global
Write (GW) is available for writing all bytes at one time,
regardless of the byte write controls.
Bursts can be initiated with either
ADSP
(Address Status
Processor) or
ADSC
(Address Status Cache Controller)
input pins. Subsequent burst addresses can be generated
internally and controlled by the
ADV
(burst address
advance) input pin.
The mode pin is used to select the burst sequence order,
Linear burst is achieved when this pin is tied LOW.
Interleave burst is achieved when this pin is tied HIGH or
left floating.
FAST ACCESS TIME
Symbol
t
KQ
t
KC
Parameter
Clock Access Time
Cycle Time
Frequency
250
2.6
4
250
200
3.1
5
200
Units
ns
ns
MHz
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability
arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any
published information and before placing orders for products.
Integrated Silicon Solution, Inc.
Rev. H
01/07/2010
1
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