Datasheet> 器件分类 > 存储> 存储> HY5DU12422BLF-M

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HY5DU12422BLF-M: 产品描述DDR DRAM, 128MX4, 0.75ns, CMOS, PBGA60, FBGA-60; 产品类别存储存储; 文件大小341KB，共35页; 制造商SK Hynix(海力士); 官网地址http://www.hynix.com/eng/

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HY5DU12422BLF-M概述

DDR DRAM, 128MX4, 0.75ns, CMOS, PBGA60, FBGA-60

HY5DU12422BLF-M规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	SK Hynix(海力士)
零件包装代码	BGA
包装说明	TBGA, BGA60,9X12,40/32
针数	60
Reach Compliance Code	compliant
ECCN代码	EAR99
访问模式	FOUR BANK PAGE BURST
最长访问时间	0.75 ns
其他特性	AUTO/SELF REFRESH
最大时钟频率 (fCLK)	133 MHz
I/O 类型	COMMON
交错的突发长度	2,4,8
JESD-30 代码	R-PBGA-B60
长度	16 mm
内存密度	536870912 bit
内存集成电路类型	DDR DRAM
内存宽度	4
功能数量	1
端口数量	1
端子数量	60
字数	134217728 words
字数代码	128000000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	128MX4
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	TBGA
封装等效代码	BGA60,9X12,40/32
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	2.5 V
认证状态	Not Qualified
刷新周期	8192
座面最大高度	1.17 mm
自我刷新	YES
连续突发长度	2,4,8
最大待机电流	0.01 A
最大压摆率	0.38 mA
最大供电电压 (Vsup)	2.7 V
最小供电电压 (Vsup)	2.3 V
标称供电电压 (Vsup)	2.5 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	8 mm

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HY5DU12422B(L)F

HY5DU12822B(L)F

HY5DU121622B(L)F

512Mb DDR SDRAM

HY5DU12422B(L)F

HY5DU12822B(L)F

HY5DU121622B(L)F

This document is a general product description and is subject to change without notice. Hynix semiconductor does not assume

any responsibility for use of circuits described. No patent licenses are implied.

Rev 0.1 / Aug. 2003

HY5DU12422B(L)F

HY5DU12822B(L)F

HY5DU121622B(L)F

PIN DESCRIPTION

CK, /CK

TYPE

Input

DESCRIPTION

Clock: CK and /CK are differential clock inputs. All address and control input signals are

sampled on the crossing of the positive edge of CK and negative edge of /CK. Output

(read) data is referenced to the crossings of CK and /CK (both directions of crossing).

Clock Enable: CKE HIGH activates, and CKE LOW deactivates internal clock signals, and

device input buffers and output drivers. Taking CKE LOW provides PRECHARGE POWER

DOWN and SELF REFRESH operation (all banks idle), or ACTIVE POWER DOWN (row

ACTIVE in any bank). CKE is synchronous for POWER DOWN entry and exit, and for SELF

REFRESH entry. CKE is asynchronous for SELF REFRESH exit, and for output disable. CKE

must be maintained high throughout READ and WRITE accesses. Input buffers, excluding

CK, /CK and CKE are disabled during POWER DOWN. Input buffers, excluding CKE are

disabled during SELF REFRESH. CKE is an SSTL_2 input, but will detect an LVCMOS LOW

level after Vdd is applied.

Chip Select : Enables or disables all inputs except CK, /CK, CKE, DQS and DM. All com-

mands are masked when CS is registered high. CS provides for external bank selection on

systems with multiple banks. CS is considered part of the command code.

Bank Address Inputs: BA0 and BA1 define to which bank an ACTIVE, Read, Write or PRE-

CHARGE command is being applied.

Address Inputs: Provide the row address for ACTIVE commands, and the column address

and AUTO PRECHARGE bit for READ/WRITE commands, to select one location out of the

memory array in the respective bank. A10 is sampled during a precharge command to

determine whether the PRECHARGE applies to one bank (A10 LOW) or all banks (A10

HIGH). If only one bank is to be precharged, the bank is selected by BA0, BA1. The

address inputs also provide the op code during a MODE REGISTER SET command. BA0

and BA1 define which mode register is loaded during the MODE REGISTER SET command

(MRS or EMRS).

Command Inputs: /RAS, /CAS and /WE (along with /CS) define the command being

entered.

Input Data Mask: DM is an input mask signal for write data. Input data is masked when

DM is sampled HIGH along with that input data during a WRITE access. DM is sampled

on both edges of DQS. Although DM pins are input only, the DM loading matches the DQ

and DQS loading. For the x16, LDM corresponds to the data on DQ0-Q7; UDM corre-

sponds to the data on DQ8-Q15.

Data Strobe: Output with read data, input with write data. Edge aligned with read data,

centered in write data. Used to capture write data. For the x16, LDQS corresponds to the

data on DQ0-Q7; UDQS corresponds to the data on DQ8-Q15.

Data input / output pin : Data bus

Power supply for internal circuits and input buffers.

Power supply for output buffers for noise immunity.

Reference voltage for inputs for SSTL interface.

No connection.

CKE

Input

/CS

Input

BA0, BA1

Input

A0 ~ A12

Input

/RAS, /CAS, /WE

Input

(LDM,UDM)

Input

DQS

(LDQS,UDQS)

DDQ

SSQ

REF

I/O

Supply

Rev. 0.1 / Aug. 2003

HY5DU12422BLF-M相似产品对比

	HY5DU12422BLF-M	HY5DU121622BF-M	HY5DU12822BLF-M	HY5DU121622BLF-M
描述	DDR DRAM, 128MX4, 0.75ns, CMOS, PBGA60, FBGA-60	DDR DRAM, 32MX16, 0.75ns, CMOS, PBGA60, FBGA-60	DDR DRAM, 64MX8, 0.75ns, CMOS, PBGA60, FBGA-60	DDR DRAM, 32MX16, 0.75ns, CMOS, PBGA60, FBGA-60
是否Rohs认证	不符合	不符合	不符合	不符合
厂商名称	SK Hynix(海力士)	SK Hynix(海力士)	SK Hynix(海力士)	SK Hynix(海力士)
零件包装代码	BGA	BGA	BGA	BGA
包装说明	TBGA, BGA60,9X12,40/32	TBGA,	TBGA, BGA60,9X12,40/32	TBGA,
针数	60	60	60	60
Reach Compliance Code	compliant	unknown	unknown	unknow
ECCN代码	EAR99	EAR99	EAR99	EAR99
访问模式	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
最长访问时间	0.75 ns	0.75 ns	0.75 ns	0.75 ns
其他特性	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 代码	R-PBGA-B60	R-PBGA-B60	R-PBGA-B60	R-PBGA-B60
长度	16 mm	16 mm	16 mm	16 mm
内存密度	536870912 bit	536870912 bit	536870912 bit	536870912 bi
内存集成电路类型	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
内存宽度	4	16	8	16
功能数量	1	1	1	1
端口数量	1	1	1	1
端子数量	60	60	60	60
字数	134217728 words	33554432 words	67108864 words	33554432 words
字数代码	128000000	32000000	64000000	32000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C
组织	128MX4	32MX16	64MX8	32MX16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TBGA	TBGA	TBGA	TBGA
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.17 mm	1.17 mm	1.17 mm	1.17 mm
自我刷新	YES	YES	YES	YES
最大供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V
最小供电电压 (Vsup)	2.3 V	2.3 V	2.3 V	2.3 V
标称供电电压 (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V
表面贴装	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	BALL	BALL	BALL	BALL
端子节距	1 mm	1 mm	1 mm	1 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	8 mm	8 mm	8 mm	8 mm

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器件捷径: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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