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Datasheet> 器件分类 > 存储> 存储> AM70PDL129BDH66FS

AM70PDL129BDH66FS: 产品描述Memory Circuit, 8MX16, CMOS, PBGA93, 13 X 9 MM, FBGA-93; 产品类别存储存储; 文件大小2MB，共128页; 制造商SPANSION; 官网地址http://www.spansion.com/; 标准

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AM70PDL129BDH66FS概述

Memory Circuit, 8MX16, CMOS, PBGA93, 13 X 9 MM, FBGA-93

AM70PDL129BDH66FS规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	SPANSION
零件包装代码	BGA
包装说明	LFBGA,
针数	93
Reach Compliance Code	compliant
其他特性	PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16; DATA STORAGE FLASH IS ORGANIZED AS 8M X 16
JESD-30 代码	R-PBGA-B93
JESD-609代码	e1
长度	13 mm
内存密度	134217728 bit
内存集成电路类型	MEMORY CIRCUIT
内存宽度	16
功能数量	1
端子数量	93
字数	8388608 words
字数代码	8000000
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	8MX16
封装主体材料	PLASTIC/EPOXY
封装代码	LFBGA
封装形状	RECTANGULAR
封装形式	GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260
认证状态	Not Qualified
座面最大高度	1.4 mm
最大供电电压 (Vsup)	3.3 V
最小供电电压 (Vsup)	2.7 V
标称供电电压 (Vsup)	3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	TIN SILVER COPPER
端子形式	BALL
端子节距	0.8 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	40
宽度	9 mm
Base Number Matches	1

AM70PDL129BDH66FS相似产品对比

	AM70PDL129BDH66FS	AM70PDL127BDH85FT	AM70PDL129BDH85FT	AM70PDL129BDH85FS	AM70PDL129BDH66FT	AM70PDL127BDH85FS	AM70PDL127BDH66FT	AM70PDL127BDH66FS
描述	Memory Circuit, 8MX16, CMOS, PBGA93, 13 X 9 MM, FBGA-93	Memory Circuit, 8MX16, CMOS, PBGA93, 13 X 9 MM, FBGA-93	Memory Circuit, 8MX16, CMOS, PBGA93, 13 X 9 MM, FBGA-93	Memory Circuit, 8MX16, CMOS, PBGA93, 13 X 9 MM, FBGA-93	Memory Circuit, 8MX16, CMOS, PBGA93, 13 X 9 MM, FBGA-93	Memory Circuit, 8MX16, CMOS, PBGA93, 13 X 9 MM, FBGA-93	Memory Circuit, 8MX16, CMOS, PBGA93, 13 X 9 MM, FBGA-93	Memory Circuit, 8MX16, CMOS, PBGA93, 13 X 9 MM, FBGA-93
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	LFBGA,	LFBGA,	LFBGA,	LFBGA,	13 X 9 MM, FBGA-93	LFBGA,	LFBGA,	LFBGA,
针数	93	93	93	93	93	93	93	93
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
其他特性	PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16; DATA STORAGE FLASH IS ORGANIZED AS 8M X 16	PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16; DATA STORAGE FLASH IS ORGANIZED AS 8M X 16	PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16; DATA STORAGE FLASH IS ORGANIZED AS 8M X 16	PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16; DATA STORAGE FLASH IS ORGANIZED AS 8M X 16	PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16; DATA STORAGE FLASH IS ORGANIZED AS 8M X 16	PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16; DATA STORAGE FLASH IS ORGANIZED AS 8M X 16	PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16; DATA STORAGE FLASH IS ORGANIZED AS 8M X 16	PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16; DATA STORAGE FLASH IS ORGANIZED AS 8M X 16
JESD-30 代码	R-PBGA-B93	R-PBGA-B93	R-PBGA-B93	R-PBGA-B93	R-PBGA-B93	R-PBGA-B93	R-PBGA-B93	R-PBGA-B93
JESD-609代码	e1	e1	e1	e1	e1	e1	e1	e1
长度	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm
内存密度	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit
内存集成电路类型	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
内存宽度	16	16	16	16	16	16	16	16
功能数量	1	1	1	1	1	1	1	1
端子数量	93	93	93	93	93	93	93	93
字数	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words
字数代码	8000000	8000000	8000000	8000000	8000000	8000000	8000000	8000000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	8MX16	8MX16	8MX16	8MX16	8MX16	8MX16	8MX16	8MX16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260	260	260	260	260	260	260	260
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm
最大供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
最小供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
标称供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	40	40	40	40	40	40	40	40
宽度	9 mm	9 mm	9 mm	9 mm	9 mm	9 mm	9 mm	9 mm
厂商名称	SPANSION	-	SPANSION	SPANSION	SPANSION	SPANSION	SPANSION	SPANSION
Base Number Matches	1	1	1	1	1	-	-	-

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