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799401-6

产品描述SOCKET, PGA462, IC SOCKET
产品类别连接器    插座   
文件大小124KB,共1页
制造商TE Connectivity(泰科)
官网地址http://www.te.com
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799401-6概述

SOCKET, PGA462, IC SOCKET

799401-6规格参数

参数名称属性值
厂商名称TE Connectivity(泰科)
Reach Compliance Codeunknown
ECCN代码EAR99
其他特性UL94V-0, LOW PROFILE
联系完成配合GOLD FLASH
联系完成终止TIN LEAD OVER NICKEL
设备插槽类型IC SOCKET
使用的设备类型PGA462
JESD-609代码e0
制造商序列号799401
触点数462
Base Number Matches1

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799401-6
T E I nternal N umber: 7 9 9 4 0 1 - 6
Product Highlights:
l
Ultra Low Insertion Force
l
462 Positions
l
PC B Mount Style = Through Hole
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Grid Size = 19x19
l
Grid Spacing = Interstitial: 1.27 x 2.54 mm
View all Features
Obsolete
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Documentation & Additional Information
Product Drawings:
l
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Catalog Pages/Data Sheets:
l
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Product Specifications:
l
None Available
Application Specifications:
l
None Available
Instruction Sheets:
l
None Available
CAD Files:
l
None Available
Additional Information:
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Product Line Information
Related Products:
l
Tooling
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
l
Insertion Force
= Ultra Low
l
Number of Positions
= 462
l
PC B Mount Style = Through Hole
l
Grid Size
= 19x19
l
Grid Spacing (mm [in])
= Interstitial: 1.27 x 2.54 [.050 x .100]
l
C hip C ompatibility
= AMD Athlon™, AMD Duron™
l
Frame Style
= Open
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Sleeve Material = Brass
l
Heat Sink Attachment
= Without
l
Profile
= Low
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Board Standoff = Without
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C omment = 453 contacts
Termination Related Features:
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Termination Post Length (mm [in])
= 3.30 [0.130]
l
Socket Identifier = None
Body Related Features:
l
Assembly Process Feature = None
l
Socket Overall Height (mm [in]) = 3.9 [0.154]
Contact Related Features:
l
C ontact Style
= Stamped + Formed
l
C ontact Base Material
= Phosphor Bronze
l
C ontact Plating, Mating Area, Material = Gold Flash
l
Sleeve Plating = Tin Lead over Nickel
Housing Related Features:
l
Housing C olor = Black
l
Housing Material = Epoxy GF
l
Housing Flammability Rating = UL 94V-0
Industry Standards:
l
RoHS/ELV C ompliance
= Not reviewed for ELV/RoHS compliance
l
Lead Free Solder Processes
= Not reviewed for lead free solder
process
Operation/Application:
l
Application
= Production
Packaging Related Features:
l
Packaging Method = Tube
Other:
l
Brand = AMP
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