OTP ROM, 512KX16, 150ns, CMOS, PQCC44, PLASTIC, LCC-44
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | LCC |
| 包装说明 | QCCJ, LDCC44,.7SQ |
| 针数 | 44 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 150 ns |
| 其他特性 | CONFIGURABLE AS 512K X 16; TTL COMPATIBLE I/O |
| 备用内存宽度 | 8 |
| I/O 类型 | COMMON |
| JESD-30 代码 | S-PQCC-J44 |
| JESD-609代码 | e0 |
| 长度 | 16.5862 mm |
| 内存密度 | 8388608 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 16 |
| 湿度敏感等级 | 2 |
| 功能数量 | 1 |
| 端子数量 | 44 |
| 字数 | 524288 words |
| 字数代码 | 512000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 512KX16 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC44,.7SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.57 mm |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.05 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 16.5862 mm |
| Base Number Matches | 1 |
| AT27C800-15JI | AT27C800-15JC | AT27C800-12JC | AT27C800-10JC | AT27C800-10JI | AT27C800-12JI | |
|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 512KX16, 150ns, CMOS, PQCC44, PLASTIC, LCC-44 | OTP ROM, 512KX16, 150ns, CMOS, PQCC44, PLASTIC, LCC-44 | OTP ROM, 512KX16, 120ns, CMOS, PQCC44, PLASTIC, LCC-44 | OTP ROM, 512KX16, 100ns, CMOS, PQCC44, PLASTIC, LCC-44 | OTP ROM, 512KX16, 100ns, CMOS, PQCC44, PLASTIC, LCC-44 | OTP ROM, 512KX16, 120ns, CMOS, PQCC44, PLASTIC, LCC-44 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| 零件包装代码 | LCC | LCC | LCC | LCC | LCC | LCC |
| 包装说明 | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ |
| 针数 | 44 | 44 | 44 | 44 | 44 | 44 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 150 ns | 150 ns | 120 ns | 100 ns | 100 ns | 120 ns |
| 其他特性 | CONFIGURABLE AS 512K X 16; TTL COMPATIBLE I/O | CONFIGURABLE AS 512K X 16; TTL COMPATIBLE I/O | CONFIGURABLE AS 512K X 16; TTL COMPATIBLE I/O | CONFIGURABLE AS 512K X 16; TTL COMPATIBLE I/O | CONFIGURABLE AS 512K X 16; TTL COMPATIBLE I/O | CONFIGURABLE AS 512K X 16; TTL COMPATIBLE I/O |
| 备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm |
| 内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| 湿度敏感等级 | 2 | 2 | 2 | 2 | 2 | 2 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 44 | 44 | 44 | 44 | 44 | 44 |
| 字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C |
| 组织 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
| 封装等效代码 | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 225 | 225 | 225 | 225 | 225 | 225 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm |
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