1KX4 STANDARD SRAM, 300ns, CDIP18
| 参数名称 | 属性值 |
| 厂商名称 | Rochester Electronics |
| Reach Compliance Code | unknown |
| 最长访问时间 | 300 ns |
| JESD-30 代码 | R-GDIP-T18 |
| 内存密度 | 4096 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 4 |
| 功能数量 | 1 |
| 端子数量 | 18 |
| 字数 | 1024 words |
| 字数代码 | 1000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 1KX4 |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | SERIAL |
| 认证状态 | MILITARY |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | NOT SPECIFIED |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| Base Number Matches | 1 |

| 8102406VA | 8102402VA | HM1-6514B-9 | HM1-6514S-9 | HM1-6514-9 | |
|---|---|---|---|---|---|
| 描述 | 1KX4 STANDARD SRAM, 300ns, CDIP18 | 1KX4 STANDARD SRAM, 120ns, CDIP18 | Standard SRAM, 1KX4, 200ns, CMOS, CDIP18 | 1KX4 STANDARD SRAM, 120ns, CDIP18 | Standard SRAM, 1KX4, 300ns, CMOS, CDIP18, |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 300 ns | 120 ns | 200 ns | 120 ns | 300 ns |
| JESD-30 代码 | R-GDIP-T18 | R-GDIP-T18 | R-GDIP-T18 | R-GDIP-T18 | R-GDIP-T18 |
| 内存密度 | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 18 | 18 | 18 | 18 |
| 字数 | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
| 字数代码 | 1000 | 1000 | 1000 | 1000 | 1000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 1KX4 | 1KX4 | 1KX4 | 1KX4 | 1KX4 |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 并行/串行 | SERIAL | SERIAL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | MILITARY | MILITARY | Not Qualified | COMMERCIAL | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 端子面层 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | TIN LEAD |
| 其他特性 | - | - | ADDRESS LATCH; LOW POWER STANDBY MODE; TTL COMPATIBLE INPUTS/OUTPUTS | ADDRESS LATCH; LOW POWER STANDBY MODE; TTL COMPATIBLE INPUTS/OUTPUTS | ADDRESS LATCH; LOW POWER STANDBY MODE; TTL COMPATIBLE INPUTS/OUTPUTS |
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