HCT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDIP16
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 系列 | HCT |
| JESD-30 代码 | R-PDIP-T16 |
| 长度 | 19.305 mm |
| 负载电容（CL） | 50 pF |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 43 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| SN74HCT139N-00 | SN74HCT139DBLE | SN74HCT139N-10 | SN74HCT139PWLE | SN74HCT139DWR-00 | SN74HCT139DW-00 | |
|---|---|---|---|---|---|---|
| 描述 | HCT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDIP16 | Dual 2-Line To 4-Line Decoders/Demultiplexers 16-SSOP -40 to 85 | HCT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDIP16 | Dual 2-Line To 4-Line Decoders/Demultiplexers 16-TSSOP -40 to 85 | HCT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDSO16 | HCT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDSO16 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | DIP, | SSOP, SSOP16,.3 | DIP, | TSSOP, TSSOP16,.25 | SOP, | SOP, |
| Reach Compliance Code | unknown | not_compliant | unknown | not_compliant | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 系列 | HCT | HCT | HCT | HCT | HCT | HCT |
| JESD-30 代码 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| 长度 | 19.305 mm | 6.2 mm | 19.305 mm | 5 mm | 10.3 mm | 10.3 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SSOP | DIP | TSSOP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
| 传播延迟（tpd） | 43 ns | 43 ns | 43 ns | 43 ns | 43 ns | 43 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 2 mm | 5.08 mm | 1.2 mm | 2.65 mm | 2.65 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 0.65 mm | 2.54 mm | 0.65 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 5.3 mm | 7.62 mm | 4.4 mm | 7.5 mm | 7.5 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
| 逻辑集成电路类型 | - | OTHER DECODER/DRIVER | - | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
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