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72281L20TFG

产品描述FIFO, 64KX9, 12ns, Synchronous, CMOS, PQFP64, GREEN, STQFP-64
产品类别存储    存储   
文件大小227KB,共26页
制造商IDT (Integrated Device Technology)
标准  
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72281L20TFG概述

FIFO, 64KX9, 12ns, Synchronous, CMOS, PQFP64, GREEN, STQFP-64

72281L20TFG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明LFQFP, QFP64,.47SQ,20
针数64
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间12 ns
其他特性RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH
最大时钟频率 (fCLK)50 MHz
周期时间20 ns
JESD-30 代码S-PQFP-G64
JESD-609代码e3
长度10 mm
内存密度589824 bit
内存集成电路类型OTHER FIFO
内存宽度9
湿度敏感等级3
功能数量1
端子数量64
字数65536 words
字数代码64000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织64KX9
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装等效代码QFP64,.47SQ,20
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源5 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.02 A
最大压摆率0.08 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Matte Tin (Sn) - annealed
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度10 mm
Base Number Matches1

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CMOS SuperSync FIFO™
65,536 x 9
131,072 x 9
FEATURES:
IDT72281
IDT72291
Choose among the following memory organizations:
IDT72281
65,536 x 9
IDT72291
131,072 x 9
Pin-compatible with the IDT72261LA/72271LA SuperSync FIFOs
10ns read/write cycle time (6.5ns access time)
Fixed, low first word data latency time
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable
settings
Retransmit operation with fixed, low first word data
latency time
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag
can default to one of two preselected offsets
Program partial flags by either serial or parallel means
Select IDT Standard timing (using
EF
and
FF
flags) or First
Word Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
Easily expandable in depth and width
Independent Read and Write clocks (permit reading and writing
simultaneously)
Available in the 64-pin Thin Quad Flat Pack (TQFP) and the 64-
pin Slim Thin Quad Flat Pack (STQFP)
High-performance submicron CMOS technology
Industrial temperature range (-40°C to +85°C) is available
DESCRIPTION:
The IDT72281/72291 are exceptionally deep, high speed, CMOS First-In-
First-Out (FIFO) memories with clocked read and write controls. These FIFOs
offer numerous improvements over previous SuperSync FIFOs, including the
following:
The limitation of the frequency of one clock input with respect to the other has
been removed. The Frequency Select pin (FS) has been removed, thus
it is no longer necessary to select which of the two clock inputs, RCLK or
WCLK, is running at the higher frequency.
The period required by the retransmit operation is now fixed and short.
The first word data latency period, from the time the first word is written to an
empty FIFO to the time it can be read, is now fixed and short. (The variable
clock cycle counting delay associated with the latency period found on
previous SuperSync devices has been eliminated on this SuperSync family.)
SuperSync FIFOs are particularly appropriate for network, video, telecom-
munications, data communications and other applications that need to buffer
large amounts of data.
FUNCTIONAL BLOCK DIAGRAM
WEN
WCLK
D
0
-D
8
LD SEN
INPUT REGISTER
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
WRITE CONTROL
LOGIC
RAM ARRAY
65,536 x 9
131,072 x 9
FLAG
LOGIC
WRITE POINTER
READ POINTER
READ
CONTROL
LOGIC
OUTPUT REGISTER
MRS
PRS
RT
RESET
LOGIC
RCLK
REN
OE
Q
0
-Q
8
4675 drw01
IDT, IDT logo are registered trademarks of Integrated Device Technology, Inc. The SuperSync FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©
2009
JANUARY 2009
DSC-4675/4
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.

72281L20TFG相似产品对比

72281L20TFG 72281L20TFGI 72291L20PFG 72291L20PFGI 72291L20TFG 72291L20TFGI 72281L20PFG 72281L20PFGI
描述 FIFO, 64KX9, 12ns, Synchronous, CMOS, PQFP64, GREEN, STQFP-64 FIFO, 64KX9, 12ns, Synchronous, CMOS, PQFP64, GREEN, STQFP-64 FIFO, 128KX9, 12ns, Synchronous, CMOS, PQFP64, GREEN, PLASTIC, TQFP-64 FIFO, 128KX9, 12ns, Synchronous, CMOS, PQFP64 FIFO, 128KX9, 12ns, Synchronous, CMOS, PQFP64, GREEN, STQFP-64 FIFO, 128KX9, 12ns, Synchronous, CMOS, PQFP64, GREEN, STQFP-64 FIFO, 64KX9, 12ns, Synchronous, CMOS, PQFP64, GREEN, PLASTIC, TQFP-64 FIFO, 64KX9, 12ns, Synchronous, CMOS, PQFP64
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
包装说明 LFQFP, QFP64,.47SQ,20 LFQFP, QFP64,.47SQ,20 LQFP, QFP64,.63SQ,32 QFP, QFP64,.63SQ,32 LFQFP, QFP64,.47SQ,20 LFQFP, QFP64,.47SQ,20 LQFP, QFP64,.63SQ,32 QFP, QFP64,.63SQ,32
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 12 ns 12 ns 12 ns 12 ns 12 ns 12 ns 12 ns 12 ns
最大时钟频率 (fCLK) 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz
周期时间 20 ns 20 ns 20 ns 20 ns 20 ns 20 ns 20 ns 20 ns
JESD-30 代码 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64
JESD-609代码 e3 e3 e3 e3 e3 e3 e3 e3
内存密度 589824 bit 589824 bit 1179648 bit 1179648 bit 1179648 bit 1179648 bit 589824 bit 589824 bit
内存集成电路类型 OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
内存宽度 9 9 9 9 9 9 9 9
湿度敏感等级 3 3 3 3 3 3 3 3
功能数量 1 1 1 1 1 1 1 1
端子数量 64 64 64 64 64 64 64 64
字数 65536 words 65536 words 131072 words 131072 words 131072 words 131072 words 65536 words 65536 words
字数代码 64000 64000 128000 128000 128000 128000 64000 64000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 85 °C 70 °C 85 °C 70 °C 85 °C 70 °C 85 °C
组织 64KX9 64KX9 128KX9 128KX9 128KX9 128KX9 64KX9 64KX9
可输出 YES YES YES YES YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP LFQFP LQFP QFP LFQFP LFQFP LQFP QFP
封装等效代码 QFP64,.47SQ,20 QFP64,.47SQ,20 QFP64,.63SQ,32 QFP64,.63SQ,32 QFP64,.47SQ,20 QFP64,.47SQ,20 QFP64,.63SQ,32 QFP64,.63SQ,32
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE FLATPACK FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE FLATPACK
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260 260 260 260 260 260 260
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大待机电流 0.02 A 0.02 A 0.02 A 0.02 A 0.02 A 0.02 A 0.02 A 0.02 A
最大压摆率 0.08 mA 0.08 mA 0.08 mA 0.08 mA 0.08 mA 0.08 mA 0.08 mA 0.08 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
端子面层 Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) Matte Tin (Sn)
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 0.8 mm 0.8 mm 0.5 mm 0.5 mm 0.8 mm 0.8 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 30 30 30 30 30 30 30 30
Base Number Matches 1 1 1 1 1 1 1 1
零件包装代码 QFP QFP QFP - QFP QFP QFP -
针数 64 64 64 - 64 64 64 -
其他特性 RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH - RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH -
长度 10 mm 10 mm 14 mm - 10 mm 10 mm 14 mm -
座面最大高度 1.6 mm 1.6 mm 1.6 mm - 1.6 mm 1.6 mm 1.6 mm -
宽度 10 mm 10 mm 14 mm - 10 mm 10 mm 14 mm -
Is Samacsys - - N N N N N N

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