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IDT70125S25J

产品描述Dual-Port SRAM, 2KX9, 25ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52
产品类别存储    存储   
文件大小182KB,共15页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT70125S25J概述

Dual-Port SRAM, 2KX9, 25ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52

IDT70125S25J规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码LCC
包装说明0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52
针数52
Reach Compliance Codenot_compliant
ECCN代码EAR99
最长访问时间25 ns
其他特性INTERRUPT FLAG; AUTOMATIC POWER-DOWN
I/O 类型COMMON
JESD-30 代码S-PQCC-J52
JESD-609代码e0
长度19.1262 mm
内存密度18432 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度9
湿度敏感等级3
功能数量1
端口数量2
端子数量52
字数2048 words
字数代码2000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织2KX9
输出特性3-STATE
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码QCCJ
封装等效代码LDCC52,.8SQ
封装形状SQUARE
封装形式CHIP CARRIER
并行/串行PARALLEL
峰值回流温度(摄氏度)225
电源5 V
认证状态Not Qualified
座面最大高度4.57 mm
最大待机电流0.015 A
最小待机电流2 V
最大压摆率0.26 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式J BEND
端子节距1.27 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度19.1262 mm
Base Number Matches1

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HIGH-SPEED
2K x 9 DUAL-PORT
STATIC RAM
WITH BUSY & INTERRUPT
Features
x
x
x
x
x
x
x
IDT70121S/L
IDT70125S/L
x
x
x
x
High-speed access
– Commercial: 25/35/45/55ns (max.)
Low-power operation
– IDT70121/70125S
Active: 675mW (typ.)
Standby: 5mW (typ.)
– IDT70121/70125L
Active: 675mW (typ.)
Standby: 1mW (typ.)
Fully asychronous operation from either port
MASTER IDT70121 easily expands data bus width to 18 bits or more
using SLAVE IDT70125 chip
On-chip port arbitration logic (IDT70121 only)
BUSY
output flag on Master;
BUSY
input on Slave
INT
flag for port-to-port communication
Battery backup operation—2V data retention
TTL-compatible, signal 5V (±10%) power supply
Available in 52-pin PLCC
Industrial temperature range (–40°C to +85°C) is available for
selected speeds
Description
The IDT70121/IDT70125 are high-speed 2K x 9 Dual-Port Static
RAMs. The IDT70121 is designed to be used as a stand-alone 9-bit Dual-
Port RAM or as a “MASTER” Dual-Port RAM together with the IDT70125
“SLAVE” Dual-Port in 18-bit-or-more word width systems. Using the IDT
MASTER/SLAVE Dual-Port RAM approach in 18-bit-or-wider memory
system applications results in full-speed, error-free operation without the
need for additional discrete logic.
Functional Block Diagram
OE
L
CE
L
R/W
L
OE
R
CE
R
R/W
R
I/O
0L
- I/O
8L
I/O
Control
BUSY
L
A
10L
A
0L
(1,2)
I/O
0R
-I/O
8R
I/O
Control
BUSY
R
Address
Decoder
11
(1,2)
MEMORY
ARRAY
11
Address
Decoder
A
10R
A
0R
CE
L
OE
L
R/W
L
ARBITRATION
INTERRUPT
LOGIC
CE
R
OE
R
R/W
R
INT
L
(2)
INT
R
2654 drw 01
(2)
NOTES:
1. 70121 (MASTER):
BUSY
is non-tri-stated push-pull output.
70125 (SLAVE):
BUSY
is input.
2.
INT
is totem-pole output.
JUNE 1999
1
©1998 Integrated Device Technology, Inc.
DSC 2654/8

IDT70125S25J相似产品对比

IDT70125S25J IDT70125L55J IDT70121L45J IDT70121S35J IDT70121S45J IDT70125L25J
描述 Dual-Port SRAM, 2KX9, 25ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 Dual-Port SRAM, 2KX9, 55ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 Dual-Port SRAM, 2KX9, 45ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 Dual-Port SRAM, 2KX9, 35ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 Dual-Port SRAM, 2KX9, 45ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 Dual-Port SRAM, 2KX9, 25ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52
是否无铅 含铅 含铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 LCC LCC LCC LCC LCC LCC
包装说明 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52
针数 52 52 52 52 52 52
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 25 ns 55 ns 45 ns 35 ns 45 ns 25 ns
其他特性 INTERRUPT FLAG; AUTOMATIC POWER-DOWN INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP INTERRUPT FLAG; AUTOMATIC POWER-DOWN INTERRUPT FLAG; AUTOMATIC POWER-DOWN INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP
I/O 类型 COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 S-PQCC-J52 S-PQCC-J52 S-PQCC-J52 S-PQCC-J52 S-PQCC-J52 S-PQCC-J52
JESD-609代码 e0 e0 e0 e0 e0 e0
长度 19.1262 mm 19.1262 mm 19.1262 mm 19.1262 mm 19.1262 mm 19.1262 mm
内存密度 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 9 9 9 9 9 9
湿度敏感等级 3 3 1 3 1 3
功能数量 1 1 1 1 1 1
端口数量 2 2 2 2 2 2
端子数量 52 52 52 52 52 52
字数 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words
字数代码 2000 2000 2000 2000 2000 2000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 2KX9 2KX9 2KX9 2KX9 2KX9 2KX9
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
可输出 YES YES YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 QCCJ QCCJ QCCJ QCCJ QCCJ QCCJ
封装等效代码 LDCC52,.8SQ LDCC52,.8SQ LDCC52,.8SQ LDCC52,.8SQ LDCC52,.8SQ LDCC52,.8SQ
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 225 225 225 225 225 225
电源 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 4.57 mm 4.57 mm 4.57 mm 4.57 mm 4.57 mm 4.57 mm
最大待机电流 0.015 A 0.015 A 0.005 A 0.015 A 0.015 A 0.015 A
最小待机电流 2 V 2 V 2 V 2 V 2 V 2 V
最大压摆率 0.26 mA 0.2 mA 0.205 mA 0.25 mA 0.245 mA 0.22 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
端子形式 J BEND J BEND J BEND J BEND J BEND J BEND
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 30 30 30 30 30 30
宽度 19.1262 mm 19.1262 mm 19.1262 mm 19.1262 mm 19.1262 mm 19.1262 mm

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