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70V9189L12PF8

产品描述Dual-Port SRAM, 64KX9, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
产品类别存储    存储   
文件大小305KB,共17页
制造商IDT (Integrated Device Technology)
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70V9189L12PF8概述

Dual-Port SRAM, 64KX9, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100

70V9189L12PF8规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
针数100
Reach Compliance Codenot_compliant
ECCN代码EAR99
最长访问时间25 ns
其他特性FLOW THROUGH OR PIPELINED ARCHITECTURE
I/O 类型COMMON
JESD-30 代码S-PQFP-G100
JESD-609代码e0
长度14 mm
内存密度589824 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度9
湿度敏感等级3
功能数量1
端口数量2
端子数量100
字数65536 words
字数代码64000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织64KX9
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装等效代码QFP100,.63SQ,20
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
电源3.3 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.003 A
最小待机电流3 V
最大压摆率0.23 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
宽度14 mm
Base Number Matches1

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HIGH-SPEED 3.3V 64/32K x 9
SYNCHRONOUS PIPELINED
DUAL-PORT STATIC RAM
Features:
IDT70V9189/79L
True Dual-Ported memory cells which allow simultaneous
access of the same memory location
High-speed clock to data access
– Commercial: 6.5/7.5/9/12ns (max.)
– Industrial: 9ns (max.)
Low-power operation
– IDT70V9189/79L
Active: 500mW (typ.)
Standby: 1.5mW (typ.)
Flow-Through or Pipelined output mode on either port via
the
FT/PIPE
pins
Counter enable and reset features
Dual chip enables allow for depth expansion without
additional logic
Full synchronous operation on both ports
– 4ns setup to clock and 0ns hold on all control, data, and
address inputs
– Data input, address, and control registers
– Fast 6.5ns clock to data out in the Pipelined output mode
– Self-timed write allows fast cycle time
– 10ns cycle time, 100MHz operation in Pipelined output mode
LVTTL- compatible, single 3.3V (±0.3V) power supply
Industrial temperature range (–40°C to +85°C) is
available for selected speeds
Available in a 100-pin Thin Quad Flatpack (TQFP)
Functional Block Diagram
R/W
OE
L
CE
0L
CE
1L
R/W
R
OE
R
CE
0R
CE
1R
1
0
0/1
1
0
0/1
FT/PIPE
L
0/1
1
0
0
1
0/1
FT/PIPE
R
,
I/O
0L
- I/O
8L
I/O
Control
I/O
Control
I/O
0R
- I/O
8R
A
15L
(1)
A
0L
CLK
L
ADS
L
CNTEN
L
CNTRST
L
Counter/
Address
Reg.
MEMORY
ARRAY
Counter/
Address
Reg.
A
15R
(1)
A
0R
CLK
R
ADS
R
CNTEN
R
CNTRST
R
4860 drw 01
NOTE:
1. A
15
X
is a NC for IDT70V9179.
FEBRUARY 2004
1
©2004 Integrated Device Technology, Inc.
DSC-4860/3

70V9189L12PF8相似产品对比

70V9189L12PF8 70V9189L9PFI8 70V9189L9PF8 70V9189L7PF8
描述 Dual-Port SRAM, 64KX9, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Dual-Port SRAM, 64KX9, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Dual-Port SRAM, 64KX9, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Dual-Port SRAM, 64KX9, 18ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
是否Rohs认证 不符合 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 QFP QFP QFP QFP
包装说明 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
针数 100 100 100 100
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B
最长访问时间 25 ns 20 ns 20 ns 18 ns
其他特性 FLOW THROUGH OR PIPELINED ARCHITECTURE FLOW THROUGH OR PIPELINED ARCHITECTURE FLOW THROUGH OR PIPELINED ARCHITECTURE FLOW THROUGH OR PIPELINED ARCHITECTURE
I/O 类型 COMMON COMMON COMMON COMMON
JESD-30 代码 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100
JESD-609代码 e0 e0 e0 e0
长度 14 mm 14 mm 14 mm 14 mm
内存密度 589824 bit 589824 bit 589824 bit 589824 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 9 9 9 9
湿度敏感等级 3 3 3 3
功能数量 1 1 1 1
端口数量 2 2 2 2
端子数量 100 100 100 100
字数 65536 words 65536 words 65536 words 65536 words
字数代码 64000 64000 64000 64000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 85 °C 70 °C 70 °C
组织 64KX9 64KX9 64KX9 64KX9
输出特性 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP LFQFP LFQFP LFQFP
封装等效代码 QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20
封装形状 SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
电源 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm 1.6 mm
最大待机电流 0.003 A 0.006 A 0.003 A 0.003 A
最小待机电流 3 V 3 V 3 V 3 V
最大压摆率 0.23 mA 0.28 mA 0.26 mA 0.31 mA
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
端子形式 GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 QUAD QUAD QUAD QUAD
宽度 14 mm 14 mm 14 mm 14 mm
Base Number Matches 1 1 1 1

 
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