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79C0832XPQK-20: 产品描述EEPROM Module, 256KX32, 200ns, Parallel, CMOS, QFP-96; 产品类别存储存储; 文件大小473KB，共19页; 制造商Maxwell_Technologies_Inc.

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79C0832XPQK-20概述

EEPROM Module, 256KX32, 200ns, Parallel, CMOS, QFP-96

79C0832XPQK-20规格参数

参数名称	属性值
厂商名称	Maxwell_Technologies_Inc.
零件包装代码	QFP
包装说明	QFF, TPAK96,3SQ
针数	96
Reach Compliance Code	compliant
ECCN代码	3A001.A.2.C
最长访问时间	200 ns
数据轮询	YES
JESD-30 代码	S-XQFP-F96
长度	43.3578 mm
内存密度	8388608 bit
内存集成电路类型	EEPROM MODULE
内存宽度	32
功能数量	1
端子数量	96
字数	262144 words
字数代码	256000
工作模式	ASYNCHRONOUS
最高工作温度	125 °C
最低工作温度	-55 °C
组织	256KX32
封装主体材料	UNSPECIFIED
封装代码	QFF
封装等效代码	TPAK96,3SQ
封装形状	SQUARE
封装形式	FLATPACK
页面大小	128 words
并行/串行	PARALLEL
电源	5 V
编程电压	5 V
认证状态	Not Qualified
就绪/忙碌	YES
筛选级别	38535V;38534K;883S
座面最大高度	6.223 mm
最大待机电流	0.00008 A
最大压摆率	0.225 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子形式	FLAT
端子节距	1.27 mm
端子位置	QUAD
切换位	NO
总剂量	100k Rad(Si) V
宽度	43.3578 mm
最长写入周期时间 (tWC)	10 ms
写保护	HARDWARE/SOFTWARE
Base Number Matches	1

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79C0832

8 Megabit (256K x 32-Bit)

EEPROM MCM

Memory

EATURES

•

256k x 32-bit EEPROM MCM

-P

® radiation-hardened against natural

space radiation

Total dose hardness:

- >100 krad (Si)

- Dependent upon orbit

Excellent Single event effects

- SEL

> 120 MeV/mg/cm

- SEU > 90 MeV/mg/cm

read mode

- SEU = 18 MeV/mg/cm

write mode

High endurance

- 10,000 cycles/byte (Page Programming Mode)

- 10 year data retention

Page Write Mode: 1 to 8 X 128 byte page

High Speed:

- 150 and 200 ns maximum access times

Automatic programming

- 10 ms automatic Page/Byte write

Low power dissipation

- 160 mW/MHz active current

- 880 µ W standby current

ESCRIPTION

Maxwell Technologies’ 79C0832 multi-chip module (MCM)

memory features a greater than 100 krad (Si) total dose toler-

ance, dependent upon orbit. Using Maxwell Technologies’ pat-

ented radiation-hardened R

-P

® MCM packaging

technology, the 79C0832 is the first radiation-hardened 8

megabit MCM EEPROM for space application. The 79C0832

uses eight 1 Megabit high speed CMOS die to yield an 8

megabit product. The 79C0832 is capable of in-system electri-

cal byte and page programmability. It has a 128 x 8 byte page

programming function to make its erase and write operations

faster. It also features Data Polling and a Ready/Busy signal to

indicate the completion of erase and programming operations.

In the 79C0832, hardware data protection is provided with the

RES pin, in addition to noise protection on the WE signal and

write inhibit on power on and off. Software data protection is

implemented using the JEDEC optional standard algorithm.

Maxwell Technologies' patented R

-P

® packaging technol-

ogy incorporates radiation shielding in the microcircuit pack-

age. It eliminates the need for box shielding while providing

the required radiation shielding for a lifetime in orbit or space

mission. In a GEO orbit, R

-P

provides greater than 100

krad (Si) radiation dose tolerance. This product is available

with screening up to Maxwell Technologies self-defined Class

•

01.10.05 Rev 14

All data sheets are subject to change without notice

(858) 503-3300 - Fax: (858) 503-3301 - www.maxwell.com

79C0832XPQK-20相似产品对比

	79C0832XPQK-20	79C0832XPQE-15	79C0832XPQE-20	79C0832XPQH-15	79C0832XPQH-20	79C0832XPQI-15	79C0832XPQI-20	79C0832XPQK-15
描述	EEPROM Module, 256KX32, 200ns, Parallel, CMOS, QFP-96	EEPROM Module, 256KX32, 150ns, Parallel, CMOS, QFP-96	EEPROM Module, 256KX32, 200ns, Parallel, CMOS, QFP-96	EEPROM Module, 256KX32, 150ns, Parallel, CMOS, QFP-96	EEPROM Module, 256KX32, 200ns, Parallel, CMOS, QFP-96	EEPROM Module, 256KX32, 150ns, Parallel, CMOS, QFP-96	EEPROM Module, 256KX32, 200ns, Parallel, CMOS, QFP-96	EEPROM Module, 256KX32, 150ns, Parallel, CMOS, QFP-96
厂商名称	Maxwell_Technologies_Inc.	Maxwell_Technologies_Inc.	Maxwell_Technologies_Inc.	Maxwell_Technologies_Inc.	Maxwell_Technologies_Inc.	Maxwell_Technologies_Inc.	Maxwell_Technologies_Inc.	Maxwell_Technologies_Inc.
零件包装代码	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP
包装说明	QFF, TPAK96,3SQ	QFF, TPAK96,3SQ	QFF, TPAK96,3SQ	QFF, TPAK96,3SQ	QFF, TPAK96,3SQ	QFF, TPAK96,3SQ	QFF, TPAK96,3SQ	QFF, TPAK96,3SQ
针数	96	96	96	96	96	96	96	96
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
最长访问时间	200 ns	150 ns	200 ns	150 ns	200 ns	150 ns	200 ns	150 ns
数据轮询	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	S-XQFP-F96	S-XQFP-F96	S-XQFP-F96	S-XQFP-F96	S-XQFP-F96	S-XQFP-F96	S-XQFP-F96	S-XQFP-F96
长度	43.3578 mm	43.3578 mm	43.3578 mm	43.3578 mm	43.3578 mm	43.3578 mm	43.3578 mm	43.3578 mm
内存密度	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit
内存集成电路类型	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE
内存宽度	32	32	32	32	32	32	32	32
功能数量	1	1	1	1	1	1	1	1
端子数量	96	96	96	96	96	96	96	96
字数	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
字数代码	256000	256000	256000	256000	256000	256000	256000	256000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
组织	256KX32	256KX32	256KX32	256KX32	256KX32	256KX32	256KX32	256KX32
封装主体材料	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
封装代码	QFF	QFF	QFF	QFF	QFF	QFF	QFF	QFF
封装等效代码	TPAK96,3SQ	TPAK96,3SQ	TPAK96,3SQ	TPAK96,3SQ	TPAK96,3SQ	TPAK96,3SQ	TPAK96,3SQ	TPAK96,3SQ
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK
页面大小	128 words	512 words	512 words	128 words	128 words	128 words	128 words	128 words
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
电源	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
编程电压	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
就绪/忙碌	YES	YES	YES	YES	YES	YES	YES	YES
座面最大高度	6.223 mm	6.223 mm	6.223 mm	6.223 mm	6.223 mm	6.223 mm	6.223 mm	6.223 mm
最大待机电流	0.00008 A	0.00008 A	0.00008 A	0.00008 A	0.00008 A	0.00008 A	0.00008 A	0.00008 A
最大压摆率	0.225 mA	0.225 mA	0.225 mA	0.225 mA	0.225 mA	0.225 mA	0.225 mA	0.225 mA
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
端子形式	FLAT	FLAT	FLAT	FLAT	FLAT	FLAT	FLAT	FLAT
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
切换位	NO	NO	NO	NO	NO	NO	NO	NO
宽度	43.3578 mm	43.3578 mm	43.3578 mm	43.3578 mm	43.3578 mm	43.3578 mm	43.3578 mm	43.3578 mm
最长写入周期时间 (tWC)	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms
Base Number Matches	1	1	1	1	1	1	1	1
总剂量	100k Rad(Si) V	-	-	100k Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V
写保护	HARDWARE/SOFTWARE	-	-	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE

79C0832XPQK-20

79C0832XPQK-20概述

79C0832XPQK-20规格参数

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