REVISIONS
LTR
A
DESCRIPTION
Updated boilerplate. Added device types 03 and 04 and CAGE 65342
as a source for those devices. Added package "Y". Updated Table I,
Table IIB, truth table and output load circuits for new device types. -
glg
Added devices 05,06,07, and 08, added parameters and levels
specific to the new devices. Updated boilerplate. ksr
Added devices 09 and 10, added parameters and levels specific to the
new devices. Updated boilerplate. ksr
Added devices 11 and 12, added parameters and levels specific to the
new devices. ksr
DATE (YR-MO-DA)
APPROVED
97-11-20
Raymond Monnin
B
C
D
04-05-25
06-06-06
06-07-07
Raymond Monnin
Raymond Monnin
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
D
15
D
16
D
17
D
18
REV
SHEET
PREPARED BY
Gary L. Gross
CHECKED BY
Jeff Bowling
APPROVED BY
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
Raymond Monnin
DRAWING APPROVAL DATE
96-09-06
REVISION LEVEL
D
D
19
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
10
D
11
D
12
D
13
D
14
STANDARD
MICROCIRCUIT
DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
MICROCIRCUIT, MEMORY,
DIGITAL, CMOS, RADIATION-
HARDENED, 32K x 8-BIT PROM,
MONOLITHIC SILICON
SIZE
CAGE CODE
A
SHEET
67268
1 OF
19
5962-96891
DSCC FORM 2233
APR 97
5962-E531-06
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
│
│
│
Federal
stock class
designator
\
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01 2/
02 2/
03
04
05
06
07
08
09
10
11 2/
12 2/
Generic number
BAEP2568C
BAEP2568T
28F256
28F256
28F256QL
28F256QL
28F256QL
28F256QL
28F256QLE
28F256QLE
BAEP2568C
BAEP2568T
1/
Circuit function
32K X 8-bit radiation hardened PROM (CMOS inputs)
32K X 8-bit radiation hardened PROM (TTL inputs)
32K X 8-bit radiation hardened PROM (TTL inputs)
32K X 8-bit radiation hardened PROM (TTL inputs)
32K X 8-bit radiation hardened PROM (TTL inputs)
32K X 8-bit radiation hardened PROM (TTL inputs)
32K X 8-bit radiation hardened PROM (TTL inputs)
(with extended industrial temperature range -40°C to +125°C)
32K X 8-bit radiation hardened PROM (TTL inputs)
(with extended industrial temperature range -40°C to +125°C)
32K X 8-bit radiation hardened PROM (TTL inputs)
32K X 8-bit radiation hardened PROM (TTL inputs)
(with extended industrial temperature range -40°C to +125°C)
32K X 8-bit radiation hardened PROM (CMOS inputs)
32K X 8-bit radiation hardened PROM (TTL inputs)
Access time
45 ns
45 ns
45 ns
40 ns
45 ns
40 ns
45 ns
40 ns
45 ns
45 ns
50 ns
50 ns
R
│
│
│
RHA
designator
(see 1.2.1)
96891
01
│
│
│
Device
type
(see 1.2.2)
/
Q
│
│
│
Device
class
designator
(see 1.2.3)
Y
│
│
│
Case
outline
(see 1.2.4)
C
│
│
│
Lead
finish
(see 1.2.5)
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level
as follows:
Device class
M
Q or V
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN
class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
1/
2/
Descriptive designator
CDFP3-F28
CDIP2-T28
Terminals
28
28
Package style
Flat pack
Dual-in-line
Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and
will also be listed in QML-38535 and MIL-HDBK-103 (see 6.6 herein).
Device is available in an unprogrammed state only.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-96891
SHEET
D
2
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 3/
Supply voltage range (devices 01, 02, 03, 04, 11, 12) .......................
(devices 05 through 10) ..................................
Voltage on any pin with respect to ground .........................................
Maximum power dissipation (P
D
) .......................................................
Lead temperature (soldering, 10 seconds maximum) ........................
Thermal resistance, junction-to-case (Θ
JC
) ........................................
Junction temperature (T
J
)...................................................................
Storage temperature range ................................................................
Temperature under bias (devices 01thru 06, 09, 11, 12) ...................
(devices 07, 08, 10) ...................................
1.4 Recommended operating conditions.
Supply voltage (V
DD
) ..........................................................................
Ground voltage (GND) .......................................................................
Input high voltage (V
IH
), Device 01, 11...............................................
Device 02, 12..............................................
Device 03 through 10..................................
Input Low voltage (V
IL
), Device 01, 11 ...............................................
Device 02 through 10, 12............................
Case operating temperature range (T
C
):
(devices 01, 02, 03, 04, 05, 06, 09, 11, 12).......................................
(devices 07, 08, 10) ...................................
1.5 Radiation features.
+4.5 V dc to +5.5 V dc
0.0 V dc
+3.5 V dc minimum to V
DD
+2.2 V dc minimum to V
DD
+2.4 V dc minimum to V
DD
0.0 V dc to +1.5 V dc maximum
0.0 V dc to +0.8 V dc maximum
-55°C to +125°C
-40°C to +125°C
-0.5 V dc to +7.0 V dc
-0.5 V dc to +6.0 V dc
-0.5 V dc to V
DD
+0.5 V dc
1.5 W
+260°C
See MIL-STD-1835
+175°C
-65°C to +150°C
-55°C to +125°C
-40°C to +125°C
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s):
Device 01, 02, 11, 12 .............................. > 200 KRads(Si)
Device 03, 04, 05, 06, 09 ........................ > 1.0 MRads(Si)
Device 07 and 08, 10 .............................. > 300 KRads(Si)
Single event phenomenon (SEP) effective linear energy
threshold (LET) with no upsets, Device 01, 02, 11, 12 ................
Device 03 and 04 ......................
Device 05,06,07,08, 09, 10 .......
with no latchup Device 05,06,07,08, 09, 10 .......
Neutron irradiation ..........................................................................
1.6 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) .................................... 100 percent
> 120 MEV-cm
2
/mg
> 128 MEV-cm
2
/mg
> 57 MEV-cm
2
/mg
> 110 MEV-cm
2
/mg
1 x 10
14
neutrons/cm
2
4/
3/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
4/ Guaranteed, but not tested.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-96891
SHEET
D
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
www.dodssp.daps.mil
or from the
Standardization Document Order Desk, 700 Robins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of these documents are those cited in the solicitation.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192-00
-
Standard Guide for the Measurement of Single Event Phenomena from
Heavy Ion Irradiation of Semiconductor Devices.
(Applications for copies of ASTM publications should be addressed to:
ASTM International, PO Box C700, 100 Barr
Harbor Drive, West Conshohocken, PA 19428-2959;
http://www.astm.org.)
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
JEDEC Standard EIA/JESD78
-
IC Latch-Up Test.
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington, VA
22201;
http://www.jedec.org.)
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute the
documents. These documents also may be available in or through libraries or other informational services.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless
a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-96891
SHEET
D
4
3.2.3 Truth table(s). The truth table shall be as specified on figure 2.
3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices shall be as specified on figure 2. When required
in screening (see 4.2 herein) or qualification conformance inspection, groups A, B, or C (see 4.4), the devices shall be
programmed by the manufacturer prior to test. A minimum of 50 percent of the total number of cells shall be programmed.
3.2.3.2 Programmed devices. The requirements for supplying programmed devices are not a part of this drawing.
3.2.4 AC test circuit. The ac test circuit shall be as specified on figure 3.
3.2.5 Read cycle waveforms. The read cycle waveforms shall be as specified on figure 4.
3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 5.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and
herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 42 (see MIL-PRF-38535, appendix A).
3.10.1 Unprogrammed device delivered to the user. All testing shall be verified through group A testing as defined in 3.2.3.1
and table I. It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program
configuration.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-96891
SHEET
D
5
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