OTP ROM, 4KX8, 45ns, TTL, CDIP24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | DIP, DIP24,.6 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 45 ns |
| JESD-30 代码 | R-XDIP-T24 |
| JESD-609代码 | e0 |
| 内存密度 | 32768 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 端子数量 | 24 |
| 字数 | 4096 words |
| 字数代码 | 4000 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 4KX8 |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 82HS321/BJA | N82S321N-B | 82HS321/BKA | S82HS321F/883B | S82HS321F/883C | S82S321F/883B | S82S321F/883C | |
|---|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 4KX8, 45ns, TTL, CDIP24 | OTP ROM, 4KX8, 70ns, TTL, PDIP24 | OTP ROM, 4KX8, 45ns, TTL, CDFP24 | OTP ROM, 4KX8, 60ns, TTL, CDIP24 | OTP ROM, 4KX8, 60ns, TTL, CDIP24 | OTP ROM, 4KX8, 80ns, TTL, CDIP24 | OTP ROM, 4KX8, 80ns, TTL, CDIP24 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP24,.6 | DIP, DIP24,.6 | DFP, FL24,.4 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 45 ns | 70 ns | 45 ns | 60 ns | 60 ns | 80 ns | 80 ns |
| JESD-30 代码 | R-XDIP-T24 | R-PDIP-T24 | R-XDFP-F24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 字数 | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
| 字数代码 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 |
| 最高工作温度 | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | DFP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP24,.6 | DIP24,.6 | FL24,.4 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | NO | NO | NO | NO |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class C | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class C |
| Objectid | - | - | - | 101292031 | 101292037 | 101292034 | 101292040 |
| ECCN代码 | - | - | - | EAR99 | EAR99 | EAR99 | EAR99 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
