74AVCH16T245 - 16-bit dual supply translating transceiver with configurable voltage translation; 3-state BGA 56-Pin
参数名称 | 属性值 |
Brand Name | Nexperia |
零件包装代码 | BGA |
包装说明 | VFBGA, BGA56,6X10,25 |
针数 | 56 |
制造商包装代码 | SOT702-1 |
控制类型 | COMMON CONTROL |
计数方向 | BIDIRECTIONAL |
系列 | AVC |
JESD-30 代码 | R-PBGA-B56 |
JESD-609代码 | e0 |
长度 | 7 mm |
负载电容(CL) | 15 pF |
逻辑集成电路类型 | BUS TRANSCEIVER |
最大I(ol) | 0.006 A |
湿度敏感等级 | 2 |
位数 | 8 |
功能数量 | 2 |
端口数量 | 2 |
端子数量 | 56 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | VFBGA |
封装等效代码 | BGA56,6X10,25 |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
包装方法 | TRAY |
峰值回流温度(摄氏度) | 240 |
电源 | 1.2/3.3 V |
Prop。Delay @ Nom-Sup | 10.2 ns |
传播延迟(tpd) | 10.2 ns |
认证状态 | Not Qualified |
座面最大高度 | 1 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 0.8 V |
标称供电电压 (Vsup) | 1.1 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | BALL |
端子节距 | 0.65 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
翻译 | 0.8/3.3V&0.8/3.3V |
宽度 | 4.5 mm |
Base Number Matches | 1 |
74AVCH16T245EV,551 | 74AVCH16T245DGG,11 | 74AVCH16T245DGG:51 | 74AVCH16T245DGG,51 | 74AVCH16T245EV,557 | |
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描述 | 74AVCH16T245 - 16-bit dual supply translating transceiver with configurable voltage translation; 3-state BGA 56-Pin | 74AVCH16T245 - 16-bit dual supply translating transceiver with configurable voltage translation; 3-state TSSOP 48-Pin | 74AVCH16T245 - 16-bit dual supply translating transceiver with configurable voltage translation; 3-state TSSOP 48-Pin | 74AVCH16T245 - 16-bit dual supply translating transceiver with configurable voltage translation; 3-state TSSOP 48-Pin | 74AVCH16T245 - 16-bit dual supply translating transceiver with configurable voltage translation; 3-state BGA 56-Pin |
Brand Name | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
零件包装代码 | BGA | TSSOP | TSSOP | TSSOP | BGA |
包装说明 | VFBGA, BGA56,6X10,25 | 6.10 MM, PLASTIC, MO-153, SOT362-1, TSSOP-48 | TSSOP, | 6.10 MM, PLASTIC, MO-153, SOT362-1, TSSOP-48 | VFBGA, BGA56,6X10,25 |
针数 | 56 | 48 | 48 | 48 | 56 |
制造商包装代码 | SOT702-1 | SOT362-1 | SOT362-1 | SOT362-1 | SOT702-1 |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |
系列 | AVC | AVC | AVC | - | AVC |
JESD-30 代码 | R-PBGA-B56 | R-PDSO-G48 | R-PDSO-G48 | - | R-PBGA-B56 |
JESD-609代码 | e0 | e4 | - | - | e0 |
长度 | 7 mm | 12.5 mm | 12.5 mm | - | 7 mm |
逻辑集成电路类型 | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | - | BUS TRANSCEIVER |
湿度敏感等级 | 2 | 1 | - | - | 2 |
位数 | 8 | 8 | 8 | - | 8 |
功能数量 | 2 | 2 | 2 | - | 2 |
端口数量 | 2 | 2 | 2 | - | 2 |
端子数量 | 56 | 48 | 48 | - | 56 |
最高工作温度 | 125 °C | 125 °C | 125 °C | - | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | - | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
封装代码 | VFBGA | TSSOP | TSSOP | - | VFBGA |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 240 | NOT SPECIFIED | NOT SPECIFIED | - | 240 |
传播延迟(tpd) | 10.2 ns | 10.2 ns | 10.2 ns | - | 10.2 ns |
座面最大高度 | 1 mm | 1.2 mm | 1.2 mm | - | 1 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V |
最小供电电压 (Vsup) | 0.8 V | 0.8 V | 0.8 V | - | 0.8 V |
标称供电电压 (Vsup) | 1.1 V | 1.1 V | 1.2 V | - | 1.1 V |
表面贴装 | YES | YES | YES | - | YES |
技术 | CMOS | CMOS | CMOS | - | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE |
端子面层 | Tin/Lead (Sn/Pb) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | Tin/Lead (Sn/Pb) |
端子形式 | BALL | GULL WING | GULL WING | - | BALL |
端子节距 | 0.65 mm | 0.5 mm | 0.5 mm | - | 0.65 mm |
端子位置 | BOTTOM | DUAL | DUAL | - | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
宽度 | 4.5 mm | 6.1 mm | 6.1 mm | - | 4.5 mm |
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