HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDIP20
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| 其他特性 | BROADSIDE VERSION OF 533 |
| 系列 | HC/UH |
| JESD-30 代码 | R-PDIP-T20 |
| 长度 | 24.325 mm |
| 负载电容（CL） | 150 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 57 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| SN74HC563N-00 | SN74HC563N-10 | SN74HC563DW-00 | SN74HC563DWR-00 | |
|---|---|---|---|---|
| 描述 | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDIP20 | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDIP20 | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDSO20 | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDSO20 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 其他特性 | BROADSIDE VERSION OF 533 | BROADSIDE VERSION OF 533 | BROADSIDE VERSION OF 533 | BROADSIDE VERSION OF 533 |
| 系列 | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | R-PDIP-T20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 |
| 长度 | 24.325 mm | 24.325 mm | 12.8 mm | 12.8 mm |
| 负载电容（CL） | 150 pF | 150 pF | 150 pF | 150 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 传播延迟（tpd） | 57 ns | 57 ns | 57 ns | 57 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 2.65 mm | 2.65 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 7.62 mm | 7.5 mm | 7.5 mm |
| 包装说明 | DIP, | DIP, | SOP, | - |
| Base Number Matches | 1 | 1 | 1 | - |
FPGA/CPLD
聊聊、笑笑、闹闹
stm32/stm8
聊聊、笑笑、闹闹
TI技术论坛
嵌入式系统
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
