SPACE-PHY +5V Dual MIL-STD-1553
Transceiver/Transformer Device
Product Brief
Models: BU-67432F030L
SPACE-PHY is a completely integrated MIL-STD-1553 physical layer in a single package, including dual transceivers
and transformers, suitable for connection to IP incorporated in an FPGA or custom MIL-STD-1553 protocol ASIC.
Key Features
•
Dual-Redundant, Side-by-Side, MIL-STD-1553
Transceiver/Transformer Combo
Benefits
•
Compact Ceramic Flatpack Package
-
1 in. x 1 in. x 0.25 in.
(25.4 mm x 25.4 mm x 6.35 mm)
•
Small Size Saves Space
•
Replaces Two Transceivers and Two Transformers
•
Single Package Simplifies Layout
•
Improved Reliability (MTBF) with Single Package
•
Radiation Specifications
-
Total Dose: 100 krads
-
Latchup Immunity: 85.4 MeV-cm²/mg
-
Contact Factory for Radiation Reports and Test
Conditions
Applications
•
Dual Tap Secondaries
-
Secondaries' Center Taps Brought Out
•
MIL-PRF-38534
•
Launch Vehicles
•
Military Satellites
•
Research Satellites
•
International Space Station
•
Commercial Telecommunication Satellite
Quick Specs
POWER DISSIPATION
(50% Utilization)
MIN
-
TYP
0.75 W
MAX
1.06 W
THERMAL
Operating Temperature
Storage Temperature
MIN
-55 °C
-55 °C
TYP
-
-
MAX
+125 °C
+150 °C
BU-67432F030L-XXXX
For more information:
www.ddc-web.com/BU-67432F
© 2013 Data Device Corporation. All trademarks are the property of their respective owners.
Printed on recycled paper.
Overview
Hybrid Screening for High Reliability
Visual screening for space grade hybrids includes rigorous
inspection for damaged die and wires, stray particles, and
contamination. Additional screening procedures for space
hybrids include:
• 100% Non-destructive wire bond pull (Standard)
• Condition "A" Visual Inspection (Standard)
• Particle Impact Noise Detection (PIND) testing with the
use of getter material (Optional)
• Radiographic (X-ray) Inspection (Optional)
• 320-hour burn-in (Standard) {burn-in for Class H devices is
160 hours}
• Destructive Physical Analysis (DPA) testing (Optional)
DDC offers other optional services such as Pre-Cap Source
Inspection, One Lot Date Code, Solder Dip, Variables Test
Data, Element Evaluation/SEM Inspection, Configuration
Control, and Program Management.
By combining DDC’S long history of producing high
reliability microelectronics with its Class K DLA Certification,
DDC’S MIL-STD-1553 space level products become the true
Hi-Rel solution. DDC’s ability to integrate a full MIL-STD-1553
space-grade physical layer into a single
package results in a cost-effective, small size, low power,
high performance and high reliability solutions for all
MIL-STD-1553 space level requirements.
Ordering Information
BU-67432F030L-XXXX
Supplemental Process Requirements:
S
= Pre-Cap Source Inspection
L
= 100% Pull Test
Q
= 100% Pull Test and Pre-Cap Source
Inspection
K
= One Lot Data Code
W
= One Lot Data Code and Pre-Cap
Source Inspection
Y
= One Lot Date Code and 100% Pull Test
Z
= One Lot Date Code, Pre-Cap Source
Inspection and 100% Pull Test
Blank
= None of the Above
Other Criteria:
0
= No X-Ray
1
= X-Ray
Process Requirements:
0
= Standard DDC Processing, no Burn-in
1
= MIL-PRF-38534 Compliant (notes 1, 3)
2
= B (note 2)
3
= MIL-PRF-38534 Compliant (notes 1, 3)
with PIND Testing
4
= MIL-PRF-38534 Compliant (notes 1, 3)
with Solder Dip
5
= MIL-PRF-38534 Compliant (notes 1, 3)
with PIND Testing and Solder Dip
6
= B (note 2) with PIND Testing
7
= B (note 2) with Solder Dip
8
= B (note 2) with PIND Testing and Solder
Dip, no Burn-In
Temperature Grade/Data Requirements
1
= -55°C to +125°C
4
= -55°C to +125°C with Variables Test Data
Package:
F
= Flat Pack
G
= Gull Leads (Above "Process
Requirements" must include solder dip)
Notes:
1.
Standard processing on this device includes 320 hours of burn-in.
2.
Standard DDC Processing, with 160 hour burn-in and full temperature (-55°C to
3.
MIL-PRF-38534 product grading is designated with the following dash numbers:
Class H is a -11XX, 13XX, 14XX, 15XX, 41XX, 43XX, 44XX, 45XX
These products contain tin-lead solder finish as applicable to solder dip
requirements.
+125°C) test.
Mechanical Outline
Lead Pitch =
0.050 ±0.005
1.01
MAX.
0.850
±0.008
36 leads,
Lead Width = 18 per side
0.015 ±0.002
Block Diagram
VCCA (+5V_CHA)
1:2.5
1:0.179
5V
Transceiver
TX_DATA_A_IN
TX_DATA_A_L_IN
TXINH_A_IN
RX_DATA_A_OUT
RX_DATA_A_L_OUT
RX_STROBE_A_IN
1553BUS_A_DC-P
1553BUS_A_XC-P
1553BUS_A_CT
1553BUS_A_XC-N
1553BUS_A_DC-N
DIGITAL GROUND
1.01 MAX.
0.25
MAX
0.100 0.035
±0.005 ±0.005
0.50 MAX
Lead
thickness =
0.010 ±0.002
NOTES:
1. this is a preliminary drawing. Dimensions indicated as “MAX’ will
not be exceeded, but all dimensions are subject to change.
2. All dimension are in inches.
VCCA (+5V_CHB)
1:2.5
1:0.179
5V
Transceiver
ANALOG GROUND
TX_DATA_B_IN
TX_DATA_B_L_IN
TXINH_B_IN
RX_DATA_B_OUT
RX_DATA_B_L_OUT
RX_STROBE_B_IN
1553BUS_B_DC-P
1553BUS_B_XC-P
1553BUS_B_CT
1553BUS_B_XC-N
1553BUS_B_DC-N
ST
®
ERED
DATA DEVICE CORPORATION
REGISTERED TO:
ISO 9001:2008, AS9100C:2009-01
EN9100:2009, JIS Q9100:2009
FILE NO. 10001296 ASH09
The information in this Product Brief is believed to be accurate; however, no responsibility
is assumed by Data Device Corporation for its use, and no license or rights are granted
by implication or otherwise in connection therewith. Specifications are subject to change
without notice.
FI
RM
U
For ordering assistance and technical support,
Call:
1-800-DDC-5757 for North America
(631) 567-5700 for International
E-Mail:
service@ddc-web.com
Visit:
www.ddc-web.com
Headquarters, N.Y., U.S.A -
Tel: (631) 567-5600, Fax: (631) 567-7358
United Kingdom -
Tel: +44-(0)1635-811140, Fax: +44-(0)1635-32264
France -
Tel: +33-(0)1-41-16-3424, Fax: +33-(0)1-41-16-3425
Germany -
Tel: +49-(0)89-1500 -12-11, Fax:+49(0)89-1500 12-22
Asia -
Tel: +65-6489-4801
Data Device Corporation
Data Device Corporation
www.ddc-web.com
REG
I
2
PB-BU-67432F-1
4/13
FPGA/CPLD
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