TO-220 & TO-218 & TO-247 Heat Sinks
BW38, BW50, BW63
Wide extruded heat sink with unequal channel
Air Velocity—Feet Per Minute
400
200
600
800
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
Grease
&
Epoxy
page112
Mounting
Kits
page 99
0
100
Mounting Surface Temp
Rise Above Ambient—°C
80
60
40
20
0
0
BW38
BW50
BW63
8
6
4
2
0
4
8
12
16
Heat Dissipated—Watts
20
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
1000
10
ø 3.6
(0.144)
"A"
21.60
(0.850)
Wide extruded heat sink with
unequal channel widths
on front
and back can accommodate a TO-220,
TO-218, or TO-247 device. Includes two
solderable mounting pins which permit
vertical mounting and eliminate stress
on device leads. Available in three heights.
Versions without hole use clip 6801 (sold
separately) to attach device. See page 97
for clip information.
25.40
(1.000)
34.90
(1.375)
4.00
2.60
(0.101) (0.157)
12.70
(0.500)
2.00
(0.079)
25.40
(1.000)
ORDERING INFORMATION
Part Number
BW38-2G
BW38-4G
BW50-2G
BW50-4G
BW63-2G
BW63-4G
Description
Extruded heat sink with unequal channel widths front and back
With device mounting hole
Extruded heat sink with unequal channel widths front and back
With device mounting hole
Extruded heat sink with unequal channel widths front and back
With device mounting hole
“A” Dim
38.00 (1.496)
38.00 (1.496)
50.00 (1.968)
50.00 (1.968)
63.00 (2.480)
63.00 (2.480)
Dia of PCB
Plated Thru
Holes Hole for Pins
No
Yes
No
Yes
No
Yes
3.00 (0.118)
3.00 (0.118)
3.00 (0.118)
3.00 (0.118)
3.00 (0.118)
3.00 (0.118)
Material: Aluminum
Finish: Black Anodize
5130, 5131, 5132, 5133
Extruded heat sink with radial fins
0
100
Mounting Surface Temp
Rise Above Ambient—°C
80
60
40
20
0
0
51300X
51310X
2
4
6
Heat Dissipated—Watts
8
10
"B"
Air Velocity—Feet Per Minute
400
600
800
200
Air Velocity—Feet Per Minute
400
600
800
1000
10
8
6
4
2
0
17.48
(0.688)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Grease
&
Epoxy
page112
Mounting
Kits
page 99
"C"
"A"
80
60
40
20
0
0
2
4
6
Heat Dissipated—Watts
8
10
4
3
2
1
0
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Mounting Surface Temp
Rise Above Ambient—°C
Extruded heat sink with radial fins
feature equal channel widths
on
both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in four heights
for TO-220,TO-218, and TO-247 devices.
2x 3.96
(0.156)
"E"
25.40
(1.000)
1.57
(0.062)
0
100
200
1000
5
3.18
(0.125)
2x ø 2.37
(0.093)
12.70
(0.500)
"D"
34.92
(1.375)
Dia of PCB
Plated Thru
Hole for Pins
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
Material: Aluminum
Finish: Black Anodize
51320X
51330X
ORDERING INFORMATION
Part Number
513001B02500G
513002B02500G
513101B02500G
513102B02500G
513201B02500G
513202B02500G
513301B02500G
513302B02500G
Device
TO-218, TO-247
TO-220
TO-218, TO-247
TO-220
TO-218, TO-247
TO-220
TO-218, TO-247
TO-220
“A” Dim
25.40 (1.000)
25.40 (1.000)
38.10 (1.500)
38.10 (1.500)
50.80 (2.000)
50.80 (2.000)
63.50 (2.500)
63.50 (2.500)
“B” Dim
21.59 (0.850)
18.29 (0.720)
21.59 (0.850)
18.29 (0.720)
21.59 (0.850)
18.29 (0.720)
21.59 (0.850)
18.29 (0.720)
“C” Dim
3.66 (0.144)
3.17 (0.125)
3.66 (0.144)
3.17 (0.125)
3.66 (0.144)
3.17 (0.125)
3.66 (0.144)
3.17 (0.125)
“D” Dim
17.02 (0.670)
15.88 (0.625)
17.02 (0.670)
15.88 (0.625)
17.02 (0.670)
15.88 (0.625)
17.02 (0.670)
15.88 (0.625)
“E” Dim
13.72 (0.540)
11.10 (0.437)
13.72 (0.540)
11.10 (0.437)
13.72 (0.540)
11.10 (0.437)
13.72 (0.540)
11.10 (0.437)
For additional options see page 83
58
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