Agilent
HCPL-0720/7720 and HCPL-0721/7721
40 ns Propagation Delay,
CMOS Optocoupler
Data Sheet
Features
• +5 V CMOS compatibility
• 20 ns maximum prop. delay skew
• High speed: 25 MBd
• 40 ns max. prop. delay
• 10 kV/µs minimum common mode
rejection
• –40 to 85°C temperature range
• Safety and regulatory approvals
UL recognized
3750 V rms for 1 min. per
UL 1577
CSA component acceptance
notice #5
IEC/EN/DIN EN 60747-5-2
– V
IORM
= 630 Vpeak for
HCPL-772X option 060
– V
IORM
= 560 Vpeak for
HCPL-072X option 060
Applications
• Digital fieldbus isolation: CC-Link,
DeviceNet, Profibus, SDS
• AC plasma display panel level
shifting
• Multiplexed data transmission
• Computer peripheral interface
• Microprocessor system interface
Description
Available in either an 8-pin DIP or
SO-8 package style respectively, the
HCPL-772X or HCPL-072X
optocouplers utilize the latest
CMOS IC technology to achieve
outstanding performance with very
low power consumption. The
HCPL-772X/072X require only two
bypass capacitors for complete
CMOS compatability.
Basic building blocks of the
HCPL-772X/072X are a CMOS
LED driver IC, a high speed LED
and a CMOS detector IC. A CMOS
logic input signal controls the
LED driver IC which supplies
current to the LED. The detector
IC incorporates an integrated
photodiode, a high-speed
transimpedance amplifier, and a
voltage comparator with an
output driver.
Functional Diagram
TRUTH TABLE
(POSITIVE LOGIC)
V
I
, INPUT
V
I
2
I
O
*
3
LED1
GND
1
4
SHIELD
5
GND
2
6
V
O
7
NC*
H
L
LED1
OFF
ON
V
O
, OUTPUT
H
L
**V
DD1
1
8
V
DD2
**
* Pin 3 is the anode of the internal LED and must be left unconnected for
guaranteed data sheet performance. Pin 7 is not connected internally.
**A 0.1
µF
bypass capacitor must be connected between pins 1 and 4, and
5 and 8.
CAUTION:
It is advised that normal static precautions be taken in handling and assembly of this
component to prevent damage and/or degradation which may be induced by ESD.
Selection Guide
8-Pin DIP
(300 Mil)
HCPL-7721
HCPL-7720
Small Outline
SO-8
HCPL-0721
HCPL-0720
Data Rate
25 MB
25 MB
PWD
6 ns
8 ns
Ordering Information
Specify Part Number followed by Option Number (if desired)
Example
HCPL-7720#XXXX
060 = IEC/EN/DIN EN 60747-5-2 Option.
300 = Gull Wing Surface Mount Option (HCPL-7720 only).
500 = Tape and Reel Packaging Option.
XXXE = Lead Free Option.
No Option and Option 300 contain 50 units (HCPL-772X), 100 units (HCPL-072X) per tube.
Option 500 contain 1000 units (HCPL-772X), 1500 units (HCPL-072X) per reel.
Option data sheets available. Contact Agilent sales representative or authorized distributor.
Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July 2001 and lead free option will use “–”
Package Outline Drawing
HCPL-772X 8-Pin DIP Package
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
5
OPTION 060 CODE*
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
DATE CODE
A XXXXV
YYWW
1
1.19 (0.047) MAX.
2
3
4
1.78 (0.070) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
5° TYP.
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
*OPTION 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
2
Package Outline Drawing
HCPL-772X Package with Gull Wing Surface Mount Option 300
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
1.016 (0.040)
6.350 ± 0.25
(0.250 ± 0.010)
10.9 (0.430)
1
2
3
4
1.27 (0.050)
2.0 (0.080)
1.19
(0.047)
MAX.
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
3.56 ± 0.13
(0.140 ± 0.005)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Package Outline Drawing
HCPL-072X Outline Drawing (Small Outline SO-8 Package)
LAND PATTERN RECOMMENDATION
8
7
6
5
3.937 ± 0.127
(0.155 ± 0.005)
XXXV
YWW
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
4
7.49 (0.295)
PIN ONE
1
0.406 ± 0.076
(0.016 ± 0.003)
2
3
1.9 (0.075)
1.270 BSC
(0.050)
0.64 (0.025)
*
5.080 ± 0.127
(0.200 ± 0.005)
7°
45° X
0.432
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
0 ~ 7°
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
0.228 ± 0.025
(0.009 ± 0.001)
*
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
0.305 MIN.
(0.012)
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
3
Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
3°C + 1°C/–0.5°C
30
SEC.
30
SEC.
SOLDERING
TIME
200°C
TEMPERATURE (°C)
200
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Pb-Free IR Profile
t
p
T
p
T
L
260 +0/-5 °C
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
RAMP-DOWN
6 °C/SEC. MAX.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
15 SEC.
TEMPERATURE
T
smax
T
smin
t
s
PREHEAT
60 to 180 SEC.
25
t 25 °C to PEAK
t
L
60 to 150 SEC.
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
Regulatory Information
The HCPL-772X/072X have been
approved by the following
organizations:
UL
Recognized under UL 1577,
component recognition program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01.
(Option 060 only)
4
Insulation and Safety Related Specifications
Parameter
Minimum External Air
Gap (Clearance)
Minimum External
Tracking (Creepage)
Minimum Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative Tracking
Index)
Isolation Group
Symbol
L(I01)
L(I02)
Value
772X
072X
7.1
4.9
7.4
0.08
4.8
0.08
Units
mm
mm
mm
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
CTI
≥175
≥175
Volts
IIIa
IIIa
Material Group (DIN VDE 0110, 1/89,
Table 1)
All Agilent data sheets report the
creepage and clearance inherent
to the optocoupler component
itself. These dimensions are
needed as a starting point for the
equipment designer when
determining the circuit insulation
requirements. However, once
mounted on a printed circuit
board, minimum creepage and
clearance requirements must be
met as specified for individual
equipment standards. For
creepage, the shortest distance
path along the surface of a
printed circuit board between the
solder fillets of the input and
output leads must be considered.
There are recommended
techniques such as grooves and
ribs which may be used on a
printed circuit board to achieve
desired creepage and clearances.
Creepage and clearance distances
will also change depending on
factors such as pollution degree
and insulation level.
5
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