IC OCTAL, PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, CDIP24, 1.280 X 0.300 INCH, CERDIP-24, Digital to Analog Converter
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 24 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.2.C |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY |
| 输入格式 | PARALLEL, 8 BITS |
| JESD-30 代码 | R-GDIP-T24 |
| JESD-609代码 | e0 |
| 标称负供电电压 | -5 V |
| 位数 | 8 |
| 功能数量 | 8 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大压摆率 | 22 mA |
| 标称供电电压 | 15 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn63Pb37) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8866302LC | 5962-88663023A | 5962-8866301LX | 5962-88663023B | 5962-8866302LA | 5962-88663013A | 5962-8866301LA | 5962-8866302LB | 5962-88663023C | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC OCTAL, PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, CDIP24, 1.280 X 0.300 INCH, CERDIP-24, Digital to Analog Converter | IC OCTAL, PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, CQCC28, CERAMIC, LCC-28, Digital to Analog Converter | IC OCTAL, PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, CDIP24, 1.280 X 0.300 INCH, CERDIP-24, Digital to Analog Converter | IC OCTAL, PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, CQCC28, CERAMIC, LCC-28, Digital to Analog Converter | OCTAL, PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, CDIP24, 1.280 X 0.300 INCH, CERDIP-24 | IC OCTAL, PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, CQCC28, CERAMIC, LCC-28, Digital to Analog Converter | IC OCTAL, PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, CDIP24, 1.280 X 0.300 INCH, CERDIP-24, Digital to Analog Converter | IC OCTAL, PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, CDIP24, 1.280 X 0.300 INCH, CERDIP-24, Digital to Analog Converter | IC OCTAL, PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, CQCC28, CERAMIC, LCC-28, Digital to Analog Converter |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | QLCC | DIP | QLCC | DIP | QLCC | DIP | DIP | QLCC |
| 包装说明 | DIP, | CERAMIC, LCC-28 | 1.280 X 0.300 INCH, CERDIP-24 | QCCN, | DIP, DIP24,.3 | CERAMIC, LCC-28 | 1.280 X 0.300 INCH, CERDIP-24 | 1.280 X 0.300 INCH, CERDIP-24 | QCCN, |
| 针数 | 24 | 28 | 24 | 28 | 24 | 28 | 24 | 24 | 28 |
| Reach Compliance Code | not_compliant | not_compliant | compliant | compliant | not_compliant | not_compliant | compliant | not_compliant | compliant |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| 输入格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| JESD-30 代码 | R-GDIP-T24 | S-CQCC-N28 | R-GDIP-T24 | S-CQCC-N28 | R-GDIP-T24 | S-CQCC-N28 | R-GDIP-T24 | R-GDIP-T24 | S-CQCC-N28 |
| 标称负供电电压 | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 24 | 28 | 24 | 28 | 24 | 28 | 24 | 24 | 28 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | QCCN | DIP | QCCN | DIP | QCCN | DIP | DIP | QCCN |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 220 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 220 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Qualified | Not Qualified | Not Qualified | Qualified | Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 2.54 mm | 5.08 mm | 2.54 mm | 5.08 mm | 2.54 mm | 5.08 mm | 5.08 mm | 2.54 mm |
| 最大压摆率 | 22 mA | 22 mA | 22 mA | 22 mA | 22 mA | 22 mA | 22 mA | 22 mA | 22 mA |
| 标称供电电压 | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | YES | NO | YES | NO | YES | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 11.43 mm | 7.62 mm | 11.43 mm | 7.62 mm | 11.43 mm | 7.62 mm | 7.62 mm | 11.43 mm |
| 是否无铅 | 含铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | - | 含铅 | 含铅 |
| 厂商名称 | ADI(亚德诺半导体) | - | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 | e0 | e0 | - |
| 端子面层 | Tin/Lead (Sn63Pb37) | TIN LEAD | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn63Pb37) | TIN LEAD | TIN LEAD | Tin/Lead (Sn63Pb37) | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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