REVISIONS
LTR
J
DESCRIPTION
Deleted reference to checkerboard pattern in 3.2.2.1. Deleted
footnote reference to how subgroups 7 and 8 are verified in table II.
Added footnote 2 to device types 11RX, 12RX, 13RX, and 14RX.
Removed reference to case outline Y in 6.6, previously replaced with
case outline S. Editorial changes throughout.
Changes in accordance with NOR 5962-R220-96
Boilerplate update, part of 5 year review. REDRAWN ksr
DATE (YR-MO-DA)
1989 DEC 04
APPROVED
M. A. Frye
K
L
1996 SEP 13
2005 JUN 14
William Johnson
Raymond Monnin
REV
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REV
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REV STATUS
OF SHEETS
PMIC N/A
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15
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19
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1
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2
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SHEET
PREPARED BY
James Jamison
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
CHECKED BY
Charles Reusing
APPROVED BY
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
Michael A. Frye
DRAWING APPROVAL DATE
MICROCIRCUIT, MEMORY, DIGITAL,
BIPOLAR, PROGRAMMABLE LOGIC,
MONOLITHIC SILICON
SIZE
CAGE CODE
22 July 1982
REVISION LEVEL
L
A
SHEET
67268
1 OF
19
81036
5962-E637-05
DSCC FORM 2233
APR 97
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
81036
01
R
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01, 07, 11
02, 08, 12
03, 09, 13
04, 10, 14
05
06
Generic number
PAL16L8, L8A, L8A-2
PAL16R8, R8A, R8A-2
PAL16R6, R6A, R6A-2
PAL16R4, R4A, R4A-2
PAL16X4
PAL16A4
Circuit function
16-input 8-output AND-OR invert gate array
16-input 8-output registered AND-OR gate array
16-input 6-output registered AND-OR gate array
16-input 4-output registered AND-OR gate array
16-input 4-output registered AND-OR exclusive OR gate array
16-input 4-output registered and-carry-or exclusive OR gate array
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
R
S
2
Descriptive designator
GDIP1-T20 or CDIP2-T20
GDFP2-F20 or CDFP3-F20
CQCC1-N20
Terminals
20
20
20
Package style
Dual-in-line package
Flat package 1/
Square chip carrier package
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage (platinum-silicide) ..........................................................
Supply voltage (titanium-tungsten) ........................................................
Input voltage range................................................................................
Storage temperature range ...................................................................
Lead temperature (soldering, 10 seconds) ............................................
Thermal resistance, junction-to-case (θ
JC
) 2/........................................
Output voltage applied...........................................................................
Output sink current ...............................................................................
Maximum power dissipation (P
D
) 4/
Device types 01, 02, 03, 04, 05, and 06 ..............................................
Device types 07, 08, 09, and 10 ..........................................................
Device types 11, 12, 13, and 14 ..........................................................
Maximum junction temperature (T
J
).......................................................
-0.5 to +7.0 V dc
-0.5 to +12.0 V dc
-0.5 to +5.5 V dc
-65°C to +150°C
+260°C
See MIL-STD-1835
-0.5 V to VCC maximum dc 3/
100 mA
2.0 W
1.0 W
.5 W
+175°C
1/
2/
3/
4/
Outline letter Y was removed along with corresponding case outline, figure 1 (herein), and replaced with outline letter S with
corresponding case outline F-9 (MIL-STD-1835).
Heat sinking is recommended to reduce the junction temperature.
Except during programming.
Must withstand the added PD due to short circuit test (e.g., I
OS
).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
81036
SHEET
L
2
1.4 Recommended operating conditions.
Supply voltage ..............................................................
Minimum high level input voltage ..................................
Maximum low level input voltage ..................................
Case operating temperature range (T
C
) ........................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
4.5 V dc minimum to 5.5 V dc maximum
2.0 V dc
0.8 V dc
-55°C to +125°C
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.2 Truth table(s). The truth table(s) shall be as specified on figure 2.
3.2.2.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing
shall be as specified on figure 2. When required in groups A, B, or C (see 4.3), the devices shall be programmed by the
manufacturer prior to test. A minimum of 50 percent of the total number of fuses shall be programmed or to any altered item
drawing pattern which includes at least 25 percent of the total number of fuses programmed.
3.2.2.2 Programmed devices. The truth table for programmed devices shall be as specified by an attached altered item
drawing.
3.2.3 Logic diagram(s). The logic diagram(s) shall be as specified on figure 3.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
81036
SHEET
L
3
3.2.4 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in
1.2 herein. In addition, the manufacturer's PIN may also be marked. For programmed devices, the altered item drawing number
shall be added to the marking by the programming activity.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
3.10. Processing options. Since the device is capable of being programmed by either the manufacturer or the user to result
in a wide variety of configurations; two processing options are provided for selection in the contract, using an altered item
drawing.
3.10.1 Unprogrammed device delivered to the user. All testing shall be verified through group A testing as defined in 3.2.2.1
and table II. It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program
configuration.
3.10.2 Manufacturer-programmed device delivered to the user. All testing requirements and quality assurance provisions
herein, including the requirements of the altered item drawing, shall be satisfied by the manufacturer prior to delivery.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method
1015 of MIL-STD-883.
(2) T
A
= +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
81036
SHEET
L
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
T
C
= -55°C to +125°C
unless otherwise specified
V
CC
= 4.5 V, I
I
= -18 mA
V
CC
= 4.5 V, V
IL
= 0.0 V
V
IH
= 3.0 V, I
OH
= -2 mA
V
CC
= 4.5 V, V
IL
= 0.0 V
V
IH
= 3.0 V, I
OL
= 12 mA
1/
1/
V
CC
= 5.5 V, V
I
= 2.4 V
V
CC
= 5.5 V, V
I
= 0.4 V
V
CC
= 5.5 V, V
O
= 0.5 V
3/
V
CC
= 5.5 V, V
I
= 5.5 V
V
CC
= 5.5 V, V
IL
= 0.0 V
V
IH
= 3.0 V, V
O
= 0.4 V 2/
V
CC
= 5.5 V, V
IL
= 0.0 V
V
IH
= 3.0 V, V
O
= W.4 V
2/
V
CC
= 5.5 V
2/
2/
Device
type
All
1-10
11-14
Low level output
voltage
High level input
voltage
Low level input
voltage
High level input
current
Low level input
current
Output short circuit
current
Input Current
Off-state output
current
Off-state output
current
Supply current
V
OL
V
IH
V
IL
I
IH
I
IL
I
OS
I
I
I
OZL
I
OZH
All
All
All
All
All
All
All
All
All
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
-30
2
0.8
40
-0.25
-250
1
-100
100
Group A
subgroups
Min
1, 2, 3
1, 2, 3
2.4
2.3
0.5
V
V
V
µA
mA
mA
mA
µA
µA
Limits
Max
-1.5
V
V
Unit
Input clamp voltage
High level output
voltage
V
IC
V
OH
I
CC
01 - 04,
07 - 10
5
6
11
12 - 14
1, 2, 3
185
225
240
105
95
mA
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
81036
SHEET
L
5
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