CABGA-52, Reel
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | CABGA |
| 包装说明 | ROHS COMPLIANT, PLASTIC, MO-205, M0-225, VFBGA-52 |
| 针数 | 52 |
| 制造商包装代码 | BVG52 |
| Reach Compliance Code | compliant |
| Samacsys Description | CHIP ARRAY BGA 4.5MM X 7MM X 0.65MM PITC |
| 系列 | 98ULPA |
| 输入调节 | DIFFERENTIAL |
| JESD-30 代码 | R-PBGA-B52 |
| JESD-609代码 | e1 |
| 长度 | 7 mm |
| 逻辑集成电路类型 | PLL BASED CLOCK DRIVER |
| 最大I（ol） | 0.009 A |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 反相输出次数 | |
| 端子数量 | 52 |
| 实输出次数 | 10 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFBGA |
| 封装等效代码 | BGA52,6X10,25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.8 V |
| 认证状态 | Not Qualified |
| Same Edge Skew-Max（tskwd） | 0.04 ns |
| 座面最大高度 | 1.31 mm |
| 最大供电电压 (Vsup) | 1.9 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.65 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 4.5 mm |
| 最小 fmax | 410 MHz |
| Base Number Matches | 1 |
| 98ULPA877AHLFT | 98ULPA877AHLF | 98ULPA877AKLFT | 98ULPA877AKLF | 98ULPA877AKILF | 98ULPA877AH | 98ULPA877AHI | |
|---|---|---|---|---|---|---|---|
| 描述 | CABGA-52, Reel | CABGA-52, Tray | VFQFPN-40, Reel | VFQFPN-40, Tray | VFQFPN-40, Tray | CABGA-52, Tray | CABGA-52, Tray |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 不符合 | 不符合 |
| 零件包装代码 | CABGA | CABGA | VFQFPN | VFQFPN | VFQFPN | CABGA | CABGA |
| 包装说明 | ROHS COMPLIANT, PLASTIC, MO-205, M0-225, VFBGA-52 | LFBGA, | ROHS COMPLIANT, PLASTIC, MLF-40 | MLF-40 | MLF-40 | LFBGA, | LFBGA, |
| 针数 | 52 | 52 | 40 | 40 | 40 | 52 | 52 |
| 制造商包装代码 | BVG52 | BVG52 | NLG40P1 | NLG40P1 | NLG40P1 | BV52 | BV52 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | _compli | _compli |
| 系列 | 98ULPA | 98ULPA | 98ULPA | 98ULPA | 98ULPA | 98ULPA | 98ULPA |
| 输入调节 | DIFFERENTIAL | DIFFERENTIAL MUX | DIFFERENTIAL | DIFFERENTIAL MUX | DIFFERENTIAL MUX | DIFFERENTIAL MUX | DIFFERENTIAL MUX |
| JESD-30 代码 | R-PBGA-B52 | R-PBGA-B52 | S-PQCC-N40 | S-PQCC-N40 | S-PQCC-N40 | R-PBGA-B52 | R-PBGA-B52 |
| JESD-609代码 | e1 | e1 | e3 | e3 | e3 | e0 | e0 |
| 长度 | 7 mm | 7 mm | 6 mm | 6 mm | 6 mm | 7 mm | 7 mm |
| 逻辑集成电路类型 | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 52 | 52 | 40 | 40 | 40 | 52 | 52 |
| 实输出次数 | 10 | 20 | 10 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | LFBGA | HVQCCN | HVQCCN | HVQCCN | LFBGA | LFBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 225 | 225 |
| Same Edge Skew-Max（tskwd） | 0.04 ns | 0.04 ns | 0.04 ns | 0.04 ns | 0.04 ns | 0.04 ns | 0.04 ns |
| 座面最大高度 | 1.31 mm | 1.31 mm | 1 mm | 1 mm | 1 mm | 1.31 mm | 1.31 mm |
| 最大供电电压 (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) |
| 端子形式 | BALL | BALL | NO LEAD | NO LEAD | NO LEAD | BALL | BALL |
| 端子节距 | 0.65 mm | 0.65 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.65 mm | 0.65 mm |
| 端子位置 | BOTTOM | BOTTOM | QUAD | QUAD | QUAD | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 4.5 mm | 4.5 mm | 6 mm | 6 mm | 6 mm | 4.5 mm | 4.5 mm |
| 厂商名称 | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Samacsys Description | CHIP ARRAY BGA 4.5MM X 7MM X 0.65MM PITC | - | VFQFP-N 6.0 X 6.0 X 0.9 MM - NO LEAD | VFQFP-N 6.0 X 6.0 X 0.9 MM - NO LEAD | VFQFP-N 6.0 X 6.0 X 0.9 MM - NO LEAD | - | - |
| ECCN代码 | - | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
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