4000/14000/40000 SERIES, TRIPLE 3-INPUT OR GATE, PDIP14, PLASTIC, SOT-27-1, DIP-14
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| 系列 | 4000/14000/40000 |
| JESD-30 代码 | R-PDIP-T14 |
| JESD-609代码 | e4 |
| 长度 | 19.025 mm |
| 逻辑集成电路类型 | OR GATE |
| 功能数量 | 3 |
| 输入次数 | 3 |
| 端子数量 | 14 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT APPLICABLE |
| 传播延迟（tpd） | 130 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.2 mm |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT APPLICABLE |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 933324280652 | 933373050652 | 933373050653 | HEF4075BP,652 | HEF4075BT,653 | HEF4075BP | HEF4075BT | HEF4075BT-T | HEF4075BD | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 4000/14000/40000 SERIES, TRIPLE 3-INPUT OR GATE, PDIP14, PLASTIC, SOT-27-1, DIP-14 | 4000/14000/40000 SERIES, TRIPLE 3-INPUT OR GATE, PDSO14, PLASTIC, SOT-108-1, SO-14 | 4000/14000/40000 SERIES, TRIPLE 3-INPUT OR GATE, PDSO14, PLASTIC, SOT-108-1, SO-14 | IC GATE OR 3CH 3-INP 14DIP | IC GATE OR 3CH 3-INP 14SO | 4000/14000/40000 SERIES, TRIPLE 3-INPUT OR GATE, PDIP14, PLASTIC, SOT-27-1, DIP-14 | 4000/14000/40000 SERIES, TRIPLE 3-INPUT OR GATE, PDSO14, PLASTIC, SOT-108-1, SO-14 | 4000/14000/40000 SERIES, TRIPLE 3-INPUT OR GATE, PDSO14, PLASTIC, SOT-108-1, SO-14 | IC 4000/14000/40000 SERIES, TRIPLE 3-INPUT OR GATE, CDIP14, SOT-73, CERDIP-14, Gate |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | DIP | SOIC | SOIC | DIP | SOIC | DIP | SOIC | SOIC | DIP |
| 包装说明 | DIP, | SOP, | SOP, | DIP, DIP14,.3 | SOP, SOP14,.25 | DIP, DIP14,.3 | SOP, SOP14,.25 | SOP, | DIP, DIP14,.3 |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | compliant | compliant | compliant | compliant | unknown | unknown |
| 系列 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
| JESD-30 代码 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | R-PDSO-G14 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-GDIP-T14 |
| 逻辑集成电路类型 | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE |
| 功能数量 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 输入次数 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | SOP | SOP | DIP | SOP | DIP | SOP | SOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 传播延迟（tpd） | 130 ns | 130 ns | 130 ns | 130 ns | 130 ns | 130 ns | 130 ns | 130 ns | 130 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.2 mm | 1.75 mm | 1.75 mm | 4.2 mm | 1.75 mm | 4.2 mm | 1.75 mm | 1.75 mm | 5.08 mm |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | YES | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 3.9 mm | 3.9 mm | 7.62 mm | 3.9 mm | 7.62 mm | 3.9 mm | 3.9 mm | 7.62 mm |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | - | - | 不含铅 | 不含铅 | - | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - | - |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | - |
| 长度 | 19.025 mm | 8.65 mm | 8.65 mm | 19.025 mm | 8.65 mm | 19.025 mm | 8.65 mm | 8.65 mm | - |
| 峰值回流温度（摄氏度） | NOT APPLICABLE | 260 | 260 | 260 | 260 | NOT APPLICABLE | 260 | - | - |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - |
| 处于峰值回流温度下的最长时间 | NOT APPLICABLE | 30 | 30 | 30 | 30 | NOT APPLICABLE | 30 | - | - |
| 负载电容（CL） | - | - | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 最大I（ol） | - | - | - | 0.00036 A | 0.00036 A | 0.00036 A | 0.00036 A | - | 0.00036 A |
| 最高工作温度 | - | - | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装等效代码 | - | - | - | DIP14,.3 | SOP14,.25 | DIP14,.3 | SOP14,.25 | - | DIP14,.3 |
| 电源 | - | - | - | 5/15 V | 5/15 V | 5/15 V | 5/15 V | - | 5/15 V |
| Prop。Delay @ Nom-Sup | - | - | - | 130 ns | 130 ns | 130 ns | 130 ns | - | 130 ns |
| 施密特触发器 | - | - | - | NO | NO | NO | NO | - | NO |
| 最大供电电压 (Vsup) | - | - | - | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 最小供电电压 (Vsup) | - | - | - | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 温度等级 | - | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
DSP 与 ARM 处理器
微控制器 MCU
电机驱动控制（Motor Control）
Silicon Labs 开发套件评测专区
RF/无线
微控制器 MCU
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
