电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

CDR01BP560BJZM

产品描述Ceramic Capacitor, Multilayer, Ceramic, 100V, 5% +Tol, 5% -Tol, BP, 30ppm/Cel TC, 0.000056uF, Surface Mount, 0805, CHIP
产品类别无源元件    电容器   
文件大小1MB,共10页
制造商KEMET(基美)
官网地址http://www.kemet.com
下载文档 详细参数 全文预览

CDR01BP560BJZM概述

Ceramic Capacitor, Multilayer, Ceramic, 100V, 5% +Tol, 5% -Tol, BP, 30ppm/Cel TC, 0.000056uF, Surface Mount, 0805, CHIP

CDR01BP560BJZM规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
包装说明, 0805
Reach Compliance Codenot_compliant
ECCN代码EAR99
电容0.000056 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度0.98 mm
JESD-609代码e0
长度2.03 mm
制造商序列号CDR01
安装特点SURFACE MOUNT
多层Yes
负容差5%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
封装形式SMT
包装方法BULK; BULK CASSETTE; TR, EMBOSSED PLASTIC, 7 INCH
正容差5%
额定(直流)电压(URdc)100 V
参考标准MIL-PRF-55681
系列C(SIZE)P
尺寸代码0805
表面贴装YES
温度特性代码BP
温度系数30ppm/Cel ppm/°C
端子面层Tin/Lead (Sn70Pb30) - with Nickel (Ni) barrier
端子形状WRAPAROUND
宽度1.27 mm
Base Number Matches1

文档预览

下载PDF文档
CERAMIC CHIP/MIL-PRF-55681
CAPACITOR OUTLINE DRAWINGS
BW
DIMENSIONS—MILLIMETERS AND (INCHES)
STYLE
KEMET
SIZE
CODE
T
L
W
MIN.
MAX.
BW
CDR01
CDR02
CDR03
CDR04
CDR05
CDR06
CDR31
CDR32
CDR33
CDR34
CDR35
C0805
C1805
C1808
C1812
C1825
C2225
C0805
C1206
C1210
C1812
C1825
2.03 ±.38 (.080 ±.015)
4.57 ±.38 (.180 ±.015)
4.57 ±.38 (.180 ±.015)
4.57 ±.38 (.180 ±.015)
+.51
+.020
4.57
.180
–.38
–.015
5.72 ±.51 (.225 ±.020)
2.00 ±.20 (.078 ±.008)
3.20 ±.20 (.125 ±.008)
3.20 ±.25 (.125 ±.010)
4.50 ±.25 (.176 ±.010)
4.50 ±.30 (.176 ±.012)
(
)
1.27 ±.38 (.050 ±.015)
1.27 ±.38 (.050 ±.015)
2.03 ±.38 (.080 ±.015)
3.18 ±.38 (.125 ±.015)
+.51
+.020
6.35
.250
–.38
–.015
6.35 ±.51 (.250 ±.020)
1.25 ±.20 (.049 ±.008)
1.60 ±.20 (.062 ±.008)
2.50 ±.25 (.098 ±.010)
3.20 ±.25 (.125 ±.010)
6.40 ±.30 (.250 ±.012)
.56 (.022)
.56 (.022)
.56 (.022)
.56 (.022)
.51 (.020)
.51 (.020)
1.40 (.055)
1.40 (.055)
2.03 (.080)
2.03 (.080)
2.03 (.080)
2.03 (.080)
1.30 (.051)
1.30 (.051)
1.50 (.059)
1.50 (.059)
1.50 (.059)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.50 ± 0.20 (.020 ±.008)
.50 ± 0.20 (.020 ±.008)
.50 ± 0.25 (.020 ±.010)
.50 ± 0.25 (.020 ±.010)
.50 ± 0.30 (.020 ±.012)
(
)
Note:
For MIL-C55681 “S” Endmet, the length, width and thickness positive tolerances (including bandwidth) cited above are allowed to increase by the following
amounts:
Length
Width
Length
CDR01
0.51MM (.020)
0.38MM (.015)
CDR02-06
0.64MM (.025)
0.38MM (.015)
CDR31-35
0.60MM (.023)
0.30MM (.012)
MIL-PRF-55681 PART NUMBER ORDERING INFORMATION
CDR01
B P
101 B K
Z
M
STYLE & SIZE CODE
STYLE
C — Ceramic
D — Dielectric, Fixed Chip
R — Established Reliability
FAILURE RATE LEVEL
(%/1000 hrs.)
TERMINATION FINISH
S — Solder Coated, Final
(SolderGuard I)
U — Base Metalization—
Barrier Metal—Solder
Coated
(SolderGuard I)
W — Base Metalization—
Barrier Metal—Tinned
Tin or (Tin/Lead Alloy)
SolderGuard II
Y — Base Metalization
Barrier Metal—Tinned
(100% Tin)
Solderguard II
RATED TEMPERATURE
–55°C to +125°C
DIELECTRICS
P —± 30 PPM/°C—WITH OR WITHOUT VOLTAGE
X —± 15%—without voltage
+ 15%, –25%—with voltage
CAPACITANCE
Expressed in picofarads (pF).
First 2 digits represent significant figures and the last digit specifies the number of zeros to follow.
(Use 9 for 1.0 through 9.9pF. Example: 2.2pF = 229)
CAPACITANCE TOLERANCE
B
C
D
F
±.1 pF ±.25 pF ±.5 pF ±1%
J
±5%
K
M
±10% ±20%
Z – Base metallization -
barrier metal-tinned (tin/lead
alloy, with a min. of 4% lead)
RATED VOLTAGE
A — 50; B — 100
KEMET/MIL-PRF-55681 PART NUMBER EQUIVALENTS
C 0805
P 101 K
1 G M
L
CERAMIC
SIZE CODE
See Table Above
END METALIZATION
L — 70Sn/30Pb Plated (Military codes Z,W,U )
C— 100% Tin Plated (Military code Y)
H – Sn60 Coated (Military code S)
SPECIFICATION
P -MIL-PRF-55681 = CDR01-CDR06
N-MIL-PRF-55681 = CDR31-CDR35
FAILURE RATE
(%/1,000 hrs.)
R — 0.01
S — 0.001
M — 1.0
P — 0.1
CAPACITANCE CODE
Expressed in picofarads (pF).
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 thru 9.9 pF. Example: 2.2 pF –229)
VOLTAGE TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G — BP (C0G/NP0) (±30 PPM/°C)
X — BX (±15% Without Voltage
+15% -25% With Voltage)
CAPACITANCE TOLERANCE
B
C
D
F
J
K
M
±
.1 pF
±
.25 pF
±
.5 pF
±
1%
±
5%
±
10%
±
20%
VOLTAGE
1 — 100V, 5 — 50V
*
Part Number Example: C0805P101K1GML
(14 digits - no spaces)
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
87
Ceramic Surface Mount
M — 1.0
P — 0.1
R — 0.01
S — 0.001
stm32pwm控制舵机程序
谁有啊,求助,跪求,只要能让它从一个角度转到另一个角度就行 谢谢了,有的邮箱993789565@qq。com...
的订单 stm32/stm8
SEED-EXP430F5529上缺少的LED背光元件TPS75105DSKR
SEED-EXP430F5529上缺少的LED背光元件U5是TPS75105DSKR SON(DSK)封装。TI有这个样片可申请,不知焊上去LED背光就可用了? 112701...
nwcheroes TI技术论坛
浙江省第二届大学生电子设计竞赛
本帖最后由 paulhyde 于 2014-9-15 09:15 编辑 浙江省教育厅 浙科竞〔2008〕6号关于举行浙江省第二届大学生电子设计竞赛的通知 各有关高校: 为促进我省高校电子信息类专业和课程的建设 ......
薛成 电子竞赛
郁闷,遇到串口打印信息的奇怪问题,请大家帮忙解答一下。谢谢!
这几天真是霉运当头。 打篮球伤到手指,发个串口帖子也是无人回答。自己解决加入串口打印信息也碰到了郁闷的事情。 刚开始,我只想把C:\WINCE500\PUBLIC\COMMON\OAK\DRIVERS\SERIAL\COM_MDD2 ......
参考一下 嵌入式系统
嵌入式软件工程师
工作职责: 1.从事嵌入式、单片机等产品的开发; 2.完成软件系统代码的实现,编写代码注释和开发文档; 3.辅助进行系统的功能定义,程序设计; 4.根据设计文档或需 ......
xxx29 工作这点儿事
赢京东卡 室内空气隐患大作战——英飞凌XENSIV™PAS CO2传感器
原本以为,呼吸是件小事。但PM2.5来了,新冠病毒来了,甲醛也来了,自由呼吸一下子成了最奢侈的事。 与上述这些空气隐患相比,超标的CO2更像是一个隐形的杀手,当室内CO2浓度超过1000 ppm时 ......
EEWORLD社区 综合技术交流

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1257  1494  1199  2341  2889  36  2  6  24  35 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved