|
PCA9557DBG4 |
PCA9557DBRG4 |
PCA9557DRG4 |
PCA9557DG4 |
BJL36070 |
PCA9557DGVRG4G4 |
PCA9557PWG4 |
PCA9557PWTG4 |
PCA9557RGVRG4 |
PCA9557RGYRG4 |
描述 |
Interface - I/O Expanders Rem 8B I2C & SMBus Low-Pwr I/O Expander |
Interface - I/O Expanders Rem 8B I2C & SMBus Low-Pwr I/O Expander |
Interface - I/O Expanders Rem 8B I2C & SMBus Low-Pwr I/O Expander |
Interface - I/O Expanders Rem 8B I2C & SMBus Low-Pwr I/O Expander |
PowerPact B Circuit Breaker, 70A, 3P, 600Y/347V AC, 25kA at 600Y/347 UL EverLink |
Interface - I/O Expanders Rem 8B I2C & SMBus Low-Pwr I/O Expander |
Interface - I/O Expanders Rem 8B I2C & SMBus Low-Pwr I/O Expander |
Interface - I/O Expanders Rem 8B I2C & SMBus Low-Pwr I/O Expander |
Remote 8-Bit I2C and SMBus Low-Power I/O Expander with Reset and Configuration Registers 16-VQFN -40 to 85 |
Interface - I/O Expanders Rem 8B I2C & SMBus Low-Pwr I/O Expander |
是否无铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
- |
不含铅 |
不含铅 |
不含铅 |
- |
不含铅 |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
- |
符合 |
符合 |
符合 |
符合 |
符合 |
厂商名称 |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
- |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
零件包装代码 |
SOIC |
SOIC |
SOIC |
SOIC |
- |
SOIC |
TSSOP |
TSSOP |
QFN |
QFN |
包装说明 |
SSOP, SSOP16,.3 |
SSOP, SSOP16,.3 |
SOP, SOP16,.25 |
SOP, SOP16,.25 |
- |
TSSOP, TSSOP16,.25,16 |
TSSOP, TSSOP16,.25 |
TSSOP, TSSOP16,.25 |
HVQCCN, LCC16,.16SQ,25 |
HVQCCN, LCC16/20,.14X.16,20 |
针数 |
16 |
16 |
16 |
16 |
- |
16 |
16 |
16 |
16 |
16 |
Reach Compliance Code |
compli |
compli |
compli |
compli |
- |
compli |
compli |
compli |
compli |
compli |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
- |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
JESD-30 代码 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
- |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
S-PQCC-N16 |
R-PQCC-N16 |
JESD-609代码 |
e4 |
e4 |
e4 |
e4 |
- |
e4 |
e4 |
e4 |
e4 |
e4 |
长度 |
6.2 mm |
6.2 mm |
9.9 mm |
9.9 mm |
- |
4.4 mm |
5 mm |
5 mm |
4 mm |
4 mm |
湿度敏感等级 |
1 |
1 |
1 |
1 |
- |
1 |
1 |
1 |
2 |
2 |
位数 |
8 |
8 |
8 |
8 |
- |
8 |
8 |
8 |
8 |
8 |
I/O 线路数量 |
8 |
8 |
8 |
8 |
- |
8 |
8 |
8 |
8 |
8 |
端口数量 |
1 |
1 |
1 |
1 |
- |
1 |
1 |
1 |
1 |
1 |
端子数量 |
16 |
16 |
16 |
16 |
- |
16 |
16 |
16 |
16 |
16 |
最高工作温度 |
85 °C |
85 °C |
85 °C |
85 °C |
- |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
- |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
SSOP |
SSOP |
SOP |
SOP |
- |
TSSOP |
TSSOP |
TSSOP |
HVQCCN |
HVQCCN |
封装等效代码 |
SSOP16,.3 |
SSOP16,.3 |
SOP16,.25 |
SOP16,.25 |
- |
TSSOP16,.25,16 |
TSSOP16,.25 |
TSSOP16,.25 |
LCC16,.16SQ,25 |
LCC16/20,.14X.16,20 |
封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
SQUARE |
RECTANGULAR |
封装形式 |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
260 |
- |
260 |
260 |
260 |
260 |
260 |
电源 |
2.5/5 V |
2.5/5 V |
2.5/5 V |
2.5/5 V |
- |
2.5/5 V |
2.5/5 V |
2.5/5 V |
2.5/5 V |
2.5/5 V |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
2 mm |
2 mm |
1.75 mm |
1.75 mm |
- |
1.2 mm |
1.2 mm |
1.2 mm |
1 mm |
1 mm |
最大供电电压 |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
- |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
最小供电电压 |
2.3 V |
2.3 V |
2.3 V |
2.3 V |
- |
2.3 V |
2.3 V |
2.3 V |
2.3 V |
2.3 V |
标称供电电压 |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
- |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
表面贴装 |
YES |
YES |
YES |
YES |
- |
YES |
YES |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
- |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
- |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
- |
GULL WING |
GULL WING |
GULL WING |
NO LEAD |
NO LEAD |
端子节距 |
0.65 mm |
0.65 mm |
1.27 mm |
1.27 mm |
- |
0.4 mm |
0.65 mm |
0.65 mm |
0.65 mm |
0.5 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
- |
DUAL |
DUAL |
DUAL |
QUAD |
QUAD |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
5.3 mm |
5.3 mm |
3.9 mm |
3.9 mm |
- |
3.6 mm |
4.4 mm |
4.4 mm |
4 mm |
3.5 mm |
uPs/uCs/外围集成电路类型 |
PARALLEL IO PORT, GENERAL PURPOSE |
PARALLEL IO PORT, GENERAL PURPOSE |
PARALLEL IO PORT, GENERAL PURPOSE |
PARALLEL IO PORT, GENERAL PURPOSE |
- |
PARALLEL IO PORT, GENERAL PURPOSE |
PARALLEL IO PORT, GENERAL PURPOSE |
PARALLEL IO PORT, GENERAL PURPOSE |
PARALLEL IO PORT, GENERAL PURPOSE |
PARALLEL IO PORT, GENERAL PURPOSE |