REVISION
NOTES:
1.
C
REPRESENTS A CRITICAL DIMENSION.
ASSEMBLY OPERATION
2. MAXIMUM ALLOWABLE BOW: .005 [0.13]IN/IN.
3. MAXIMUM PIN VARIATIONS BETWEEN ANY
TWO PINS: .010 [0.25].
FILL T-1M6-XX-XX-2
4. MINIMUM TERMINAL PUSHOUT FORCE: 2 LBS.
FILL HTMS-50-X
5. MAXIMUM PIN ROTATION IN BODY: 2°.
6. MAXIMUM CUT FLASH .010 [0.25].
7. TUBE POSITIONS -07 THRU -50. POSITIONS -01
THRU -06 ARE TO BE LAYER PACKAGED.
8. FOR -D, USE DWM-50-D WHEN RAN ON BOARD
STACKER AUTOMATION, HTMS-50-D FOR ALL
OTHER PROCESSES. FOR -S, USE HTMS-50-S.
9. FOR -L, -S & -G PLATING, GOLD WILL BE ON CONTACT AREA.
CRITICAL DIMENSION INSPECTION INSTRUCTION
TABLE
IN-PROCESS INSPECTION
HDWM-XX-XX-XX-X-XXX-XXX
NO OF POS
(-01 THRU -50)
OPTION
POLARIZING SPECIFICATION
XXX INDICATES POS. TO BE OMITTED
(SEE FIG 1 AND 2)
BOARD SPACE
-XXX: BOARD SPACE
MAX = "L" - .120[3.05]
BODY SPECIFICATION
-S: SINGLE (USE HTMS-50-S)
-D: DOUBLE (USE HTMS-50-D)
C1, C3
C2
02
LEAD STYLE
SEE TABLE 1
PLATING SPECIFICATION
-G: 10µ" SELECTIVE GOLD IN CONTACT AREA,
3µ" SELECTIVE GOLD ON TAIL.
-T: MATTE TIN ON ENTIRE PIN.
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL.
-TM: MATTE TIN ON ENTIRE PIN.
-SM: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL.
-L: 10µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL.
01 03
C
NO OF POS X .050[1.27]
.018 0.46 REF
C1-B-DC
[
+.002[0.05]
-.010[0.25]
]
CONTACT
AREA
2 MAX SWAY
(EITHER DIRECTION)
.100 2.54 REF
03 02 01
.096 2.44 REF
.196 4.98 REF
.000 0.00 MIN
(SEE NOTE 3)
(SEE NOTE 8)
-XXX±.008[0.20]
BOARD SPACE OPTION
(.200[5.08] MIN)
(MAX = "L" - .120[3.05])
C
C2-B-DC
"L"
REF
.100 2.54
REF (TYP)
C3-B,I-DC
C
.120±.008 3.05±0.20
.050 1.27
(TYP)
2 MAX SWAY
(EITHER DIRECTION)
HTMS-50-D
.020 0.51 REF
(DOUBLE BODY SPECIFICATION)
FIG 1
(SEE NOTE 5)
T-IM6-XX-XX-2
HTMS-50-S
(SINGLE BODY SPECIFICATION)
(DIFFERENT AS SHOWN, OTHERWISE SAME AS FIG 1)
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
FIG 2
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
.XX: .01 [.3]
2
.XXX: .005 [.13]
.XXXX: .0020 [.051]
ANGLES
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail: info@SAMTEC.com
code: 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
DO NOT SCALE DRAWING
INSULATOR:
LCP, UL 94 VO, COLOR: BLACK
TERMINAL: PHOS BRONZE
SHEET SCALE: 12:1
HI TEMP BOARD SPACING MICRO STRIPS
HDWM-XX-XX-XX-X-XXX-XXX
F:\dwg\sw\exisprod\Assembly\050\HDWM-XX-XX-XX-X-XXX-XXX-ASM.SLDDRW
BY:
G REIDINGER 08/03/1992
SHEET
1
OF
1
NXP MCU
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