Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate Linearly 1.33 mw/˚C
Derate Linearly 6.67 mw/˚C
Electrical absolute maximum ratings are at 25°C
Electrical Characteristics
Parameter
Output Characteristics @ 25°C
Load Current, Continuous
AC/DC Configuration
DC Configuration
Peak Load Current
On-Resistance
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics @ 25°C
Input Control Current
Input Dropout Current
Input Voltage Drop
Reverse Input Current
Common Characteristics @ 25°C
Input to Output Capacitance
Conditions
Symbol
Min
Typ
Max
Units
-
t=10ms
I
L
=50mA
I
L
=80mA
V
L
=250V
I
F
=10mA, V
L
=10V
I
F
=10mA, V
L
=10V
50V; f=1MHz
I
L
=50mA
-
I
F
=10mA
V
R
=5V
-
I
L
I
LPK
R
ON
I
LEAK
T
ON
T
OFF
C
OUT
I
F
I
F
V
F
I
R
C
I/O
-
-
-
-
-
-
-
0.4
0.9
-
-
-
-
50
15
-
-
5
-
-
1.2
-
3
50
80
100
100
30
25
0.125
-
10
-
1.4
10
-
mA
mA
Ω
nA
ms
pF
mA
mA
V
µA
pF
2
www.clare.com
R09
OMA160
PERFORMANCE DATA*
OMA160
Typical LED Forward Voltage Drop
(T
A
= 25°C; I
F
= 10mA
DC
)
N=50
35
30
Device Count (N)
Device Count (N)
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
35
30
25
20
15
10
5
0
42.5
43.5
44.5
45.5
46.5
47.5
Device Count (N)
OMA160
Typical On-resistance Distribution
(T
A
= 25°C; I
L
= 50mA
DC
; I
F
= 10mA
DC
)
N=50
35
30
25
20
15
10
5
0
OMA160
Typical Blocking Voltage Distribution
(T
A
= 25°C)
N=50
367.5
374.5
381.5
388.5
395.5
402.5
LED Forward Voltage Drop (V)
On-resistance (Ω)
Blocking Voltage (V
P
)
25
20
OMA160
Typical I
F
for Switch Operation
(T
A
= 25°C; I
L
= 50mA
DC
)
N=50
25
20
15
10
5
0
OMA160
Typical I
F
for Switch Dropout
(T
A
= 25°C; I
L
= 50mA
DC
)
N=50
30
25
OMA160
Typical Turn-On Time
(T
A
= 25°C; I
L
= 50mA
DC
; I
F
= 10mA
DC
)
N=50
Device Count (N)
Device Count (N)
Device Count (N)
1.625
2.075
2.525
2.975
3.425
3.875
15
10
5
0
20
15
10
5
0
1.625
2.075
2.525
2.975
3.425
3.875
0.05
0.07
0.09
0.11
0.13
0.15
LED Current (mA)
LED Current (mA)
Turn-On (ms)
25
20
15
10
5
0
OMA160
Typical Turn-Off Time
(T
A
= 25°C; I
L
= 50mA
DC
; I
F
= 10mA
DC
)
N=50
0.012
0.017
0.022
0.027
0.032
0.037
100
90
80
70
60
50
40
30
20
10
0
OMA160
Typical Load Current vs. Temperature
0.014
0.012
Leakage (µA)
0.010
0.008
0.006
0.004
0.002
0
OMA160
Typical Leakage vs. Temperature
(Measured across Pins 4 & 6)
Load Current (mA)
Device Count (N)
I
F
=30mA
I
F
=20mA
I
F
=10mA
-40
-20
0
20
40
60
80
100
120
-40
-20
0
20
40
60
80
100
Turn-Off (ms)
Temperature (°C)
Temperature (°C)
400
Blocking Voltage (V
P
)
395
OMA160
Typical Blocking Voltage vs. Temperature
1.50
1.25
1.00
0.75
0.50
0.25
-40
-20
0
20
40
60
80
100
0
-40
OMA160
Typical Turn-On vs. Temperature
(I
L
= 50mA
DC
)
385
380
375
370
365
I
F
= 10mA
I
F
= 20mA
-20
0
20
40
60
80
100
Temperature (°C)
Turn-Off (ms)
Turn-On (ms)
390
0.050
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
OMA160
Typical Turn-Off vs. Temperature
(I
L
= 50mA
DC
; I
F
= 10mA)
-40
-20
0
20
40
60
80
100
Temperature (°C)
Temperature (°C)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our
application department.
R09
www.clare.com
3
OMA160
PERFORMANCE DATA*
OMA160
Typical LED Forward Voltage Drop
vs. Temperature
OMA160
Typical Turn-On vs. LED Forward Current
(I
L
= 50mA
DC
)
OMA160
Typical Turn-Off vs. LED Forward Current
(I
L
= 50mA
DC
)
LED Forward Voltage Drop (V)
1.8
1.6
0.18
0.16
0.14
Turn-On (ms)
0.040
0.035
1.4
1.2
1.0
0.8
Turn-Off (ms)
0
5
10
15
20
25
30
35
40
45
50
0.12
0.10
0.08
0.06
0.04
0.02
0
0.030
0.025
0.020
0.015
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
-40
-20
0
20
40
60
80
100
120
0
Temperature (°C)
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
LED Forward Current (mA)
70
60
On-resistance (Ω)
OMA160
Typical On-resistance vs. Temperature
(I
L
= 50mA
DC
; I
F
= mA
DC
)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
OMA160
Typical I
F
for Switch Operation
vs. Temperature
(I
L
= 50mA
DC
)
LED Current (mA)
40
30
20
10
0
-40
-20
0
20
40
60
80
100
LED Current (mA)
50
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
OMA160
Typical I
F
for Switch Dropout
vs. Temperature
-40
-20
0
20
40
60
80
100
Temperature (°C)
-40
-20
0
20
40
60
80
100
Temperature (°C)
Temperature (°C)
50
40
30
20
10
0
-10
-20
-30
-40
-50
OMA160
Typical Load Current vs. Load Voltage
(T
A
= 25°C; I
F
= 10mA
DC
)
0.45
0.40
Load Current (A)
0.35
0.30
0.25
0.20
0.15
0.10
0.05
OMA160
Energy Rating Curve
Load Current (mA)
-3
-2
-1
0
1
2
3
0
10µs 100µs 1ms 10ms 100ms
Time
1s
10s 100s
Load Voltage (V)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our
application department.
4
www.clare.com
R09
OMA160
Manufacturing Information
Soldering
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Recommended soldering processes are limited to
260ºC component body temperature for 10 seconds.
Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
2002/95/EC
RoHS
e
3
MECHANICAL DIMENSIONS
6-Pin DIP Through Hole (Standard)
7.620 ± 0.254
(0.300 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002)
8.382 ± 0.381
(0.330 ± 0.015)
PC Board Pattern
(Top View)
2.540 ± 0.127
6-0.800 DIA. (0.100 ± 0.005)
(6-0.031 DIA.)
7.620 ± 0.127
(0.300 ± 0.005)
7.239 TYP
(0.285 TYP)
6.350 ± 0.127
(0.250 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
0.254 TYP
(0.010 TYP)
9.144 ± 0.508
(0.360 ± 0.020)
2.540 ± 0.127
(0.100 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
6-Pin Surface Mount (“S” Suffix)
7.620 ± 0.254
(0.300 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002)
0.254 ± 0.0127
(0.010 ± 0.0005)
4.445 ± 0.127
(0.175 ± 0.005)
0.635 ± 0.127
(0.025 ± 0.005)
8.382 ± 0.381
(0.330 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
PC Board Pattern
(Top View)
2.540 ± 0.127
(0.100 ± 0.005)
8.305 ± 0.127
(0.327 ± 0.005)
1.905 ± 0.127
(0.075 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.499 ± 0.127
(0.059 ± 0.005)
Tape and Reel Packaging for Surface Mount Package
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
1
6
W = 16.30 MAX
(0.642 MAX)
B
0
= 10.10
(0.398)
Top Cover
Tape
Embossment Carrier
K
0
= 4.90
(0.193)
P = 12.00
(0.472)
A
0
= 10.10
(0.398)
Embossment
K
1
= 3.80
(0.150)
Dimensions:
mm
(inches)
User Direction of Feed
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product
descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no
liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement
of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended
to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to
discontinue or make changes to its products at any time without notice.
便携式医疗设备的特殊性决定了它们应该是对用户友好的、必须工作在无菌环境下，并且空间占用小、耗能低。 同时，便携式医疗设备还需要足够的计算能力以便处理医疗数据，能够连接到无线或有线接口以便记录和发送数据。从设计人员的角度考虑，上述需求需要低功耗的单片机（MCU）和数字信号控制器（Digital Signal Controller，DSC）。 正是有了嵌入式处理器，设计人员才有可能设...[详细]
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