电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

DKS084-51TT

产品描述IC Socket, DIP84, 84 Contact(s),
产品类别连接器    插座   
文件大小1MB,共4页
制造商Advanced Interconnections Corp
下载文档 详细参数 全文预览

DKS084-51TT概述

IC Socket, DIP84, 84 Contact(s),

DKS084-51TT规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
Reach Compliance Codecompliant
ECCN代码EAR99
联系完成配合TIN LEAD OVER NICKEL
联系完成终止Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
触点材料BERYLLIUM COPPER/COPPER ALLOY
设备插槽类型IC SOCKET
使用的设备类型DIP84
外壳材料POLYIMIDE
JESD-609代码e0
触点数84
Base Number Matches1

文档预览

下载PDF文档
ADVANCED
®
INTERCONNECTIONS
®
Board to Board
Interconnections
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850 / 401-823-5200 • Fax 401-823-8723 • Email advintcorp@aol.com • Internet http://www.advintcorp.com
.100" (2.54 mm) Pitch Board to Board Interconnections
NB/LNB - Single Row
Molded Female
DRS - Dual Row
Molded Female
NA - Single Row
Molded Male
DRA - Dual Row
Molded Male
KSS - Single Row
Peel-A-Way
®
Female
DKS - Dual Row
Peel-A-Way
®
Female
NEW PHOTO
Low Profile
Board to Board
KSA - Single Row
Peel-A-Way
®
Male
DKA - Dual Row
Peel-A-Way
®
Male
Features:
!
High reliability method of
interconnecting.
!
Reliable mechanical support.
!
Complete flexibility. If the board to
board spacing you need is not shown
on pages 54 - 55 , consult factory.
Terminals and Contacts:
Terminal: Brass - Copper Alloy 360,
ASTM-B-16
Contact: Beryllium Copper - Copper
Alloy 172, ASTM-B-194
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Body Material:
Molded -
Glass filled thermoplastic
Polyester (P
.B.T.) U.L. Rated 94V-O,
-60
°
C to 140
°
C (-76
°
F to 284
°
F)
High Temp Molded
- High temp. glass
filled thermoplastic, U.L. Rated 94V-O,
-60
°
C to 260
°
C (-76
°
F to 500
°
F)
Peel-A-Way
®
- Polyimide Film - Temp.
range -269
°
C to 400
°
C(-452
°
F to 752
°
F)
Page 52
How To Order
Single and Dual RowFemale
NB
010
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See page 53 for available
terminal types.
Body Type
NB/LNB - Single Row Molded
HNB/HLNB - Single Row High Temp Molded
KSS - Single Row Peel-A-Way
®
DRS - Dual Row Molded
HDRS - Dual Row High Temp Molded
DKS - Dual Row Peel-A-Way
®
Number of Pins
NB/LNB - 3 - 32, KSS - 2 - 100
DRS - 20 - 70, DKS - 4 - 200
How To Order
Single and Dual Row Male
NA
Body Type
NA - Single Row Molded
HNA - Single Row High Temp Molded
KSA - Single Row Peel-A-Way
®
DRA - Dual Row Molded
HDRA - Dual Row High Temp Molded
DKA - Dual Row Peel-A-Way
®
010
-68
T
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See page 53 for available
terminal types.
Number of Pins
NA/HNA - 3 - 32, KSA - 2 - 100
DRA/HDRA - 20 - 70, DKA - 4 - 200
Peel-A-Way® covered by patent rights issued and or pending.
inch/(mm)
求救啊,为什么这段程序就是没办法进入中断服务程序
#include "stm32f10x_lib.h" void RCC_Configuration(void); void GPIO_Configuration(void); void NVIC_Configuration(void); void EXIT_Configuration(void); int main(void) { ......
cainana123456 stm32/stm8
~~~请问低频信号叠加在直流系统,信号是怎么走呢?
请问一下,如果加一个低频交流方波信号(大概正负三、四十伏)在一个直流高压系统,低频信号是怎么走的呢?想测量R7两端电压,注Rp、Rn阻值一样和不一样两种情况。241468 ...
木易725 模拟电子
射频信号杂散问题
本帖最后由 silent天狼 于 2014-1-26 13:25 编辑 低功率状态下,发射信号没有杂散,加大功率发射等级(上调4dbm),信号出现杂散现象,是什么回事?...
silent天狼 无线连接
两套EWB实例教程
45297...
wzt FPGA/CPLD
今天下午14:00 有奖直播:恩智浦基于i.MX RT106F的人脸识别技术解决方案
今天下午14:00 有奖直播:恩智浦基于i.MX RT106F的人脸识别技术解决方案 >>点击进入直播 直播时间: 05 月 20 日(周四)下午 14:00-15:30 直播主题: 恩智浦基于i.MX ......
EEWORLD社区 无线连接
PIC和MSP430及C51比较
最近我看了PIC单片机,它速度快,驱动大一些,功耗较低外和C51及MSP430比较还有其它优点吗?...
zhangjun1960 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2140  843  633  2558  502  16  15  59  54  36 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved