Flash Module, 2MX8, 150ns
参数名称 | 属性值 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最长访问时间 | 150 ns |
备用内存宽度 | 16 |
JESD-30 代码 | R-XDMA-G50 |
内存密度 | 16777216 bit |
内存集成电路类型 | FLASH MODULE |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 50 |
字数 | 2097152 words |
字数代码 | 2000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 2MX8 |
输出特性 | 3-STATE |
封装主体材料 | UNSPECIFIED |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
并行/串行 | PARALLEL |
编程电压 | 12 V |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | GULL WING |
端子位置 | DUAL |
类型 | NOR TYPE |
Base Number Matches | 1 |
DPZ1MS16X-15C | DPZ1MS16-15C | DPZ1MS16X-25C | DPZ1MS16-25C | DPZ1MS16X-20C | DPZ1MS16-20C | |
---|---|---|---|---|---|---|
描述 | Flash Module, 2MX8, 150ns | Flash Module, 2MX8, 150ns | Flash Module, 2MX8, 250ns | Flash Module, 2MX8, 250ns | Flash Module, 2MX8, 200ns | Flash Module, 2MX8, 200ns |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 150 ns | 150 ns | 250 ns | 250 ns | 200 ns | 200 ns |
备用内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
JESD-30 代码 | R-XDMA-G50 | R-XDMA-T50 | R-XDMA-G50 | R-XDMA-T50 | R-XDMA-G50 | R-XDMA-T50 |
内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bi |
内存集成电路类型 | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 50 | 50 | 50 | 50 | 50 | 50 |
字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
编程电压 | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
厂商名称 | - | B&B Electronics Manufacturing Company | B&B Electronics Manufacturing Company | B&B Electronics Manufacturing Company | B&B Electronics Manufacturing Company | B&B Electronics Manufacturing Company |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved