IC Socket, DIP14, 14 Contact(s),
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
联系完成配合 | GOLD OVER NICKEL |
联系完成终止 | Gold (Au) - with Nickel (Ni) barrier |
触点材料 | BERYLLIUM COPPER/COPPER ALLOY |
设备插槽类型 | IC SOCKET |
使用的设备类型 | DIP14 |
外壳材料 | POLYBUTYLENE TEREPHTHALATE-POLYESTER |
JESD-609代码 | e4 |
触点数 | 14 |
Base Number Matches | 1 |
RDL314-031MG | RDL308-370MG | RDL308-031MG | RDL316-031MG | RDL320-370MG | |
---|---|---|---|---|---|
描述 | IC Socket, DIP14, 14 Contact(s), | IC Socket, DIP8, 8 Contact(s), ROHS COMPLIANT | IC Socket, DIP8, 8 Contact(s), | IC Socket, DIP16, 16 Contact(s), | IC Socket, DIP20, 20 Contact(s), ROHS COMPLIANT |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
联系完成配合 | GOLD OVER NICKEL | GOLD OVER NICKEL | GOLD OVER NICKEL | GOLD OVER NICKEL | GOLD OVER NICKEL |
联系完成终止 | Gold (Au) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier | Gold (Au) - with Nickel (Ni) barrier | Gold (Au) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier |
触点材料 | BERYLLIUM COPPER/COPPER ALLOY | BERYLLIUM COPPER | BERYLLIUM COPPER/COPPER ALLOY | BERYLLIUM COPPER/COPPER ALLOY | BERYLLIUM COPPER |
设备插槽类型 | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET |
使用的设备类型 | DIP14 | DIP8 | DIP8 | DIP16 | DIP20 |
外壳材料 | POLYBUTYLENE TEREPHTHALATE-POLYESTER | LIQUID CRYSTAL POLYMER | POLYBUTYLENE TEREPHTHALATE-POLYESTER | POLYBUTYLENE TEREPHTHALATE-POLYESTER | LIQUID CRYSTAL POLYMER |
JESD-609代码 | e4 | e3 | e4 | e4 | e3 |
触点数 | 14 | 8 | 8 | 16 | 20 |
Base Number Matches | 1 | 1 | 1 | - | - |
厂商名称 | - | Advanced Interconnections Corp | Advanced Interconnections Corp | Advanced Interconnections Corp | Advanced Interconnections Corp |
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