IC,COUNTER,UP,8-BIT BINARY,LS-TTL,DIP,24PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DIP, DIP24,.3 |
| Reach Compliance Code | unknown |
| 计数方向 | UP |
| JESD-30 代码 | R-PDIP-T24 |
| JESD-609代码 | e0 |
| 负载/预设输入 | YES |
| 逻辑集成电路类型 | BINARY COUNTER |
| 最大频率@ Nom-Sup | 12500000 Hz |
| 工作模式 | SYNCHRONOUS |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| DM74LS461N/A+ | DM74LS461J/A+ | DM74LS461J/B+ | DM74LS461N/B+ | DM54LS461J/883B | DM54LS461J/883C | DM54LS461J/883 | |
|---|---|---|---|---|---|---|---|
| 描述 | IC,COUNTER,UP,8-BIT BINARY,LS-TTL,DIP,24PIN,PLASTIC | IC,COUNTER,UP,8-BIT BINARY,LS-TTL,DIP,24PIN,CERAMIC | IC,COUNTER,UP,8-BIT BINARY,LS-TTL,DIP,24PIN,CERAMIC | IC,COUNTER,UP,8-BIT BINARY,LS-TTL,DIP,24PIN,PLASTIC | IC,COUNTER,UP,8-BIT BINARY,LS-TTL,DIP,24PIN,CERAMIC | IC,COUNTER,UP,8-BIT BINARY,LS-TTL,DIP,24PIN,CERAMIC | LS SERIES, SYN POSITIVE EDGE TRIGGERED 8-BIT UP BINARY COUNTER, CDIP24, SKINNY, CERAMIC, DIP-24 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| 计数方向 | UP | UP | UP | UP | UP | UP | UP |
| JESD-30 代码 | R-PDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-PDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-GDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 负载/预设输入 | YES | YES | YES | YES | YES | YES | YES |
| 逻辑集成电路类型 | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 最大频率@ Nom-Sup | 12500000 Hz | 12500000 Hz | 12500000 Hz | 12500000 Hz | 10500000 Hz | 10500000 Hz | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - | - |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
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