NCP5395
Product Preview
2/3/4-Phase Controller with
On Board Gate Drivers for
CPU Applications
The NCP5395 provides up to a four−phase buck solution which
combines differential voltage sensing, differential phase current
sensing, adaptive voltage positioning, and on board gate drivers.
Dual−edge pulse−width modulation (PWM) combined with inductor
current sensing reduces system cost by providing the fastest initial
response to dynamic load events. Dual−edge multiphase modulation
reduces the total bulk and ceramic output capacitance required to meet
transient regulation specifications.
The on board gate drivers includes adaptive non overlap and power
saving operation. A high performance operational error amplifier is
provided to simplify compensation of the system. Patented Dynamic
Reference Injection further simplifies loop compensation by
eliminating the need to compromise between closed−loop transient
response and Dynamic V
ID
performance.
Features
http://onsemi.com
1 48
QFN48
CASE 485K
PLASTIC
MARKING DIAGRAM
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Meets Intel’s VR11.1 Specifications
Meets AMD 6 Bit Code Specifications
Dual−edge PWM for Fastest Initial Response to Transient Loading
High Performance Operational Error Amplifier
Internal Soft Start
Dynamic Reference Injection (Patent #US07057381)
DAC Range from 0.5 V to 1.6 V
DAC Feed Forward Function (Patient Pending)
±0.5%
DAC Voltage Accuracy from 1.0 V to 1.6 V
True Differential Remote Voltage Sensing Amplifier
Phase−to−Phase Current Balancing
“Lossless” Differential Inductor Current Sensing
Differential Current Sense Amplifiers for Each Phase
Adaptive Voltage Positioning (AVP)
Oscillator Frequency Range of 125 kHz
−
1 MHz
Latched Over Voltage Protection (OVP)
Guaranteed Startup into Pre−Charged Loads
Threshold Sensitive Enable Pin for VTT Sensing
Power Good Output with Internal Delays
Thermally Compensated Current Monitoring
Thermal Shutdown Protection
Adaptive−Non−Overlap Gate Drive Circuit
Output Disable Control Turn Off of Both Phase Pair MOSFETs
This is a Pb−Free Device
NCP5395
AWLYYWWG
A
WL
YY
WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
VBST3
TG3
SWN3
DRVON
BST2
TG2
SWN2
BG2
VCCP
SWN1
TG1
BST1
AGND
Down−bonded to
Exposed Flag
BG1
G4
VRRDY
EN
CS1N
CS1P
CS2N
CS2P
CS3N
CS3P
CS4N
CS4P
IMON
VSP
VSN
DIFFOUT
COMP
VFB
VDRP
VDFB
CSSUM
DAC
GND
VCC
Package
QFN48
(Pb−Free)
Shipping
†
2500/Tape & Reel
Publication Order Number:
NCP5395/D
48
1
BG3
PSI
VID0
VID1
VID2
VID3
VID4
VID5
VID6
VID7/AMD
ROSC
ILIM
ORDERING INFORMATION
Device
NCP5395MNR2G
Applications
•
Desktop Processors
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2008
July, 2008
−
Rev. P5
1
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