Comparator, 1 Func, 3000uV Offset-Max, 6.5ns Response Time, BIPolar, CDIP8, CERDIP-8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | CERDIP-8 |
| Reach Compliance Code | unknown |
| 放大器类型 | COMPARATOR |
| 最大平均偏置电流 (IIB) | 16 µA |
| 25C 时的最大偏置电流 (IIB) | 16 µA |
| 最大输入失调电压 | 3000 µV |
| JESD-30 代码 | R-GDIP-T8 |
| JESD-609代码 | e0 |
| 负供电电压上限 | -6 V |
| 标称负供电电压 (Vsup) | -5.2 V |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出类型 | OPEN-EMITTER |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 5,-5.2 V |
| 认证状态 | Not Qualified |
| 标称响应时间 | 6.5 ns |
| 供电电压上限 | 6.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| Base Number Matches | 1 |
| CMP08BZ | CMP08NBC | CMP08FZ | CMP08BZ/883 | CMP08BZ/883C | CMP08FS | |
|---|---|---|---|---|---|---|
| 描述 | Comparator, 1 Func, 3000uV Offset-Max, 6.5ns Response Time, BIPolar, CDIP8, CERDIP-8 | Comparator, 1 Func, 2200uV Offset-Max, BIPolar, | Comparator, 1 Func, 2500uV Offset-Max, 6.5ns Response Time, BIPolar, CDIP8, CERDIP-8 | Comparator, 1 Func, 3000uV Offset-Max, 6.5ns Response Time, BIPolar, CDIP8, CERDIP-8 | Comparator, 3000uV Offset-Max, 6.5ns Response Time, BIPolar, CDIP8, | Comparator, 1 Func, 2500uV Offset-Max, 6.5ns Response Time, BIPolar, PDSO8, SO-8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 放大器类型 | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR |
| 25C 时的最大偏置电流 (IIB) | 16 µA | 10 µA | 13 µA | 16 µA | 16 µA | 13 µA |
| 最大输入失调电压 | 3000 µV | 2200 µV | 2500 µV | 3000 µV | 3000 µV | 2500 µV |
| 最高工作温度 | 125 °C | 25 °C | 85 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | 25 °C | -40 °C | -55 °C | -55 °C | -40 °C |
| 封装等效代码 | DIP8,.3 | DIE OR CHIP | DIP8,.3 | DIP8,.3 | DIP8,.3 | SOP8,.25 |
| 电源 | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | OTHER | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | CERDIP-8 | - | CERDIP-8 | CERDIP-8 | - | SO-8 |
| 最大平均偏置电流 (IIB) | 16 µA | - | 13 µA | 16 µA | - | 13 µA |
| JESD-30 代码 | R-GDIP-T8 | - | R-GDIP-T8 | R-GDIP-T8 | R-XDIP-T8 | R-PDSO-G8 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 |
| 负供电电压上限 | -6 V | - | -6 V | -6 V | - | -6 V |
| 标称负供电电压 (Vsup) | -5.2 V | - | -5.2 V | -5.2 V | - | -5.2 V |
| 功能数量 | 1 | 1 | 1 | 1 | - | 1 |
| 端子数量 | 8 | - | 8 | 8 | 8 | 8 |
| 输出类型 | OPEN-EMITTER | - | OPEN-EMITTER | OPEN-EMITTER | - | OPEN-EMITTER |
| 封装主体材料 | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | DIP | - | DIP | DIP | DIP | SOP |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 标称响应时间 | 6.5 ns | - | 6.5 ns | 6.5 ns | 6.5 ns | 6.5 ns |
| 供电电压上限 | 6.5 V | - | 6.5 V | 6.5 V | - | 6.5 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | - | 5 V |
| 表面贴装 | NO | - | NO | NO | NO | YES |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved