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CY7C1371DV25-117BZI

产品描述ZBT SRAM, 512KX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, FBGA-165
产品类别存储    存储   
文件大小725KB,共31页
制造商Cypress(赛普拉斯)
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CY7C1371DV25-117BZI概述

ZBT SRAM, 512KX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, FBGA-165

CY7C1371DV25-117BZI规格参数

参数名称属性值
零件包装代码BGA
包装说明13 X 15 MM, 1.40 MM HEIGHT, FBGA-165
针数165
Reach Compliance Codeunknown
ECCN代码3A991.B.2.A
最长访问时间7.5 ns
其他特性FLOW-THROUGH ARCHITECTURE
JESD-30 代码R-PBGA-B165
长度15 mm
内存密度18874368 bit
内存集成电路类型ZBT SRAM
内存宽度36
功能数量1
端子数量165
字数524288 words
字数代码512000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织512KX36
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE
并行/串行PARALLEL
认证状态Not Qualified
座面最大高度1.4 mm
最大供电电压 (Vsup)2.625 V
最小供电电压 (Vsup)2.375 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式BALL
端子节距1 mm
端子位置BOTTOM
宽度13 mm
Base Number Matches1

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PRELIMINARY
CY7C1371DV25
CY7C1373DV25
18-Mbit (512K x 36/1M x 18) Flow-Through
SRAM with NoBL™ Architecture
Features
No Bus Latency (NoBL) architecture eliminates
dead cycles between write and read cycles
• Can support up to 133-MHz bus operations with zero
wait states
— Data is transferred on every clock
• Pin compatible and functionally equivalent to ZBT™
devices
• Internally self-timed output buffer control to eliminate
the need to use OE
• Registered inputs for flow-through operation
• Byte Write capability
• Single 2.5V power supply
• 2.5V I/O power supply
• Fast clock-to-output times
— 6.5 ns (for 133-MHz device)
— 7.5 ns (for 117-MHz device)
— 8.5 ns (for 100-MHz device)
• Clock Enable (CEN) pin to enable clock and suspend
operation
• Synchronous self-timed writes
• Asynchronous Output Enable
• Offered in JEDEC-standard 100 TQFP, 119-Ball BGA and
165-Ball fBGA packages
• Three chip enables for simple depth expansion
• Automatic Power-down feature available using ZZ
mode or CE deselect
• JTAG boundary scan for BGA and fBGA packages
• Burst Capability—linear or interleaved burst order
• Low standby power
Functional Description
[1]
The CY7C1371DV25/CY7C1373DV25 is a 2.5V, 512K x 36/
1M x 18 Synchronous Flow-through Burst SRAM designed
specifically to support unlimited true back-to-back Read/Write
operations without the insertion of wait states. The
CY7C1371DV25/CY7C1373DV25 is equipped with the
advanced No Bus Latency (NoBL) logic required to enable
consecutive Read/Write operations with data being trans-
ferred on every clock cycle. This feature dramatically improves
the throughput of data through the SRAM, especially in
systems that require frequent Write-Read transitions.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. The clock input is qualified by
the Clock Enable (CEN) signal, which when deasserted
suspends operation and extends the previous clock cycle.
Maximum access delay from the clock rise is 6.5 ns (133-MHz
device).
Write operations are controlled by the two or four Byte Write
Select (BW
X
) and a Write Enable (WE) input. All writes are
conducted with on-chip synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
1
, CE
2
, CE
3
) and an
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. In order to avoid bus
contention, the output drivers are synchronously tri-stated
during the data portion of a write sequence.
Selection Guide
133 MHz
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
6.5
210
70
117 MHz
7.5
190
70
100 MHz
8.5
175
70
Unit
ns
mA
mA
Notes:
1. For best-practices recommendations, please refer to the Cypress application note
System Design Guidelines
on www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05557 Rev. **
3901 North First Street
San Jose
,
CA 95134
408-943-2600
Revised August 12, 2004

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