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CAT24C128LI

产品描述16KX8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.300 INCH, ROHS COMPLIANT, PLASTIC, MS-001, DIP-8
产品类别存储    存储   
文件大小178KB,共16页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
下载文档 详细参数 选型对比 全文预览

CAT24C128LI概述

16KX8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.300 INCH, ROHS COMPLIANT, PLASTIC, MS-001, DIP-8

CAT24C128LI规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
零件包装代码DIP
包装说明0.300 INCH, PLASTIC, MS-001, DIP-8
针数8
Reach Compliance Codenot_compliant
ECCN代码EAR99
最大时钟频率 (fCLK)0.4 MHz
数据保留时间-最小值100
耐久性1000000 Write/Erase Cycles
I2C控制字节1010DDDR
JESD-30 代码R-PDIP-T8
JESD-609代码e3
长度9.27 mm
内存密度131072 bit
内存集成电路类型EEPROM
内存宽度8
功能数量1
端子数量8
字数16384 words
字数代码16000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织16KX8
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装等效代码DIP8,.3
封装形状RECTANGULAR
封装形式IN-LINE
并行/串行SERIAL
峰值回流温度(摄氏度)NOT SPECIFIED
电源2/5 V
认证状态Not Qualified
座面最大高度4.57 mm
串行总线类型I2C
最大待机电流0.000001 A
最大压摆率0.003 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)1.8 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级INDUSTRIAL
端子面层MATTE TIN
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度7.62 mm
最长写入周期时间 (tWC)5 ms
写保护HARDWARE
Base Number Matches1

文档预览

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CAT24C128
128 kb I
2
C CMOS Serial
EEPROM
Description
The CAT24C128 is a 128 kb Serial CMOS EEPROM, internally
organized as 16,384 words of 8 bits each.
It features a 64−byte page write buffer and supports both the
Standard (100 kHz), Fast (400 kHz) and Fast−Plus (1 MHz) I
2
C
protocol.
Write operations can be inhibited by taking the WP pin High (this
protects the entire memory).
On−Chip ECC (Error Correction Code) makes the device suitable
for high reliability applications.*
Features
http://onsemi.com
PDIP−8
L SUFFIX
CASE 646AA
UDFN−8
HU4 SUFFIX
CASE 517AZ
TSSOP−8
Y SUFFIX
CASE 948AL
Supports Standard, Fast and Fast−Plus I
2
C Protocol
1.8 V to 5.5 V Supply Voltage Range
64−Byte Page Write Buffer
Hardware Write Protection for Entire Memory
Schmitt Triggers and Noise Suppression Filters on I
2
C Bus Inputs
(SCL and SDA)
Low Power CMOS Technology
1,000,000 Program/Erase Cycles
100 Year Data Retention
Industrial and Extended Temperature Range
8−lead PDIP, SOIC, TSSOP, MSOP and UDFN Packages
This Device is Pb−Free, Halogen Free/BFR Free and RoHS
Compliant**
V
CC
SOIC−8
W SUFFIX
CASE 751BD
MSOP−8
Z SUFFIX
CASE 846AD
UDFN−8***
HU3 SUFFIX
CASE 517AX
PIN CONFIGURATION
A
0
A
1
A
2
V
SS
1
V
CC
WP
SCL
SDA
PDIP (L), SOIC (W), TSSOP (Y), MSOP
(Z), UDFN (HU3***), UDFN (HU4)
For the location of Pin 1, please consult the
corresponding package drawing.
*** Not recommended for new design.
SCL
CAT24C128
SDA
A
2
, A
1
, A
0
WP
PIN FUNCTION
Pin Name
A
0
, A
1
, A
2
SDA
SCL
WP
V
CC
V
SS
Function
Device Address Inputs
Serial Data Input/Output
Serial Clock Input
Write Protect Input
Power Supply
Ground
V
SS
Figure 1. Functional Symbol
*Available for New Product (Rev. C)
** For additional information on our Pb−Free strategy and soldering details,
please download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
†The exposed pad for the TDFN/UDFN packages can
be left floating or connected to Ground.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 16 of this data sheet.
©
Semiconductor Components Industries, LLC, 2013
August, 2013
Rev. 15
1
Publication Order Number:
CAT24C128/D

CAT24C128LI相似产品对比

CAT24C128LI CAT24C128ZE-GT3 CAT24C128HU3EGT3 CAT24C128HU4E-GT3 CAT24C128HU4I-GT3 CAT24C128LE
描述 16KX8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.300 INCH, ROHS COMPLIANT, PLASTIC, MS-001, DIP-8 IC 16K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3 X 3 MM, HALOGEN FREE, BFR FREE AND ROHS COMPLIANT, MO-187, MSOP-8, Programmable ROM 16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, MO-229, UDFN-8 16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, HALOGEN FREE, BFR FREE AND ROHS COMPLIANT, MO-236/MO-252, UDFN-8 16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, HALOGEN FREE, BFR FREE AND ROHS COMPLIANT, MO-236/MO-252, UDFN-8 16KX8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.300 INCH, ROHS COMPLIANT, PLASTIC, MS-001, DIP-8
是否Rohs认证 不符合 符合 符合 符合 符合 符合
零件包装代码 DIP TSSOP SON SON SON DIP
包装说明 0.300 INCH, PLASTIC, MS-001, DIP-8 3 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, MO-187, MSOP-8 VSON, HVSON, SOLCC8,.11,20 , DIP, DIP8,.3
针数 8 8 8 8 8 8
Reach Compliance Code not_compliant compliant compliant unknown compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
串行总线类型 I2C I2C I2C I2C I2C I2C
最大时钟频率 (fCLK) 0.4 MHz 1 MHz 0.4 MHz 1 MHz - 0.4 MHz
数据保留时间-最小值 100 100 - 100 100 100
耐久性 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles - 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C控制字节 1010DDDR 1010DDDR - 1010DDDR 1010DDDR 1010DDDR
JESD-30 代码 R-PDIP-T8 S-PDSO-G8 R-PDSO-N8 R-PDSO-N8 - R-PDIP-T8
JESD-609代码 e3 e4 - e4 e4 e3
长度 9.27 mm 3 mm 3 mm 3 mm - 9.27 mm
内存密度 131072 bit 131072 bit 131072 bit 131072 bit - 131072 bit
内存集成电路类型 EEPROM EEPROM EEPROM EEPROM - EEPROM
内存宽度 8 8 8 8 - 8
功能数量 1 1 1 1 - 1
端子数量 8 8 8 8 - 8
字数 16384 words 16384 words 16384 words 16384 words - 16384 words
字数代码 16000 16000 16000 16000 - 16000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS
最高工作温度 85 °C 125 °C 125 °C 125 °C - 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C - -40 °C
组织 16KX8 16KX8 16KX8 16KX8 - 16KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 DIP TSSOP VSON HVSON - DIP
封装等效代码 DIP8,.3 TSSOP8,.19 - SOLCC8,.11,20 - DIP8,.3
封装形状 RECTANGULAR SQUARE RECTANGULAR RECTANGULAR - RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE - IN-LINE
并行/串行 SERIAL SERIAL SERIAL SERIAL - SERIAL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 2/5 V 3/5 V - 3/5 V 2/5 V 2/5 V
座面最大高度 4.57 mm 1.1 mm 0.55 mm 0.55 mm - 4.57 mm
最大待机电流 0.000001 A 0.000002 A - 0.000002 A - 0.000002 A
最大压摆率 0.003 mA 0.003 mA - 0.003 mA - 0.003 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V - 5.5 V
最小供电电压 (Vsup) 1.8 V 2.5 V 1.8 V 2.5 V - 1.8 V
标称供电电压 (Vsup) 5 V 5 V 2.5 V 5 V - 5 V
表面贴装 NO YES YES YES - NO
技术 CMOS CMOS CMOS CMOS - CMOS
温度等级 INDUSTRIAL AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE
端子形式 THROUGH-HOLE GULL WING NO LEAD NO LEAD - THROUGH-HOLE
端子节距 2.54 mm 0.65 mm 0.5 mm 0.5 mm - 2.54 mm
端子位置 DUAL DUAL DUAL DUAL - DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 7.62 mm 3 mm 2 mm 2 mm - 7.62 mm
最长写入周期时间 (tWC) 5 ms 5 ms 5 ms 5 ms - 5 ms
写保护 HARDWARE HARDWARE - HARDWARE HARDWARE HARDWARE
Base Number Matches 1 1 1 1 - -

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