HIGH FREQUENCY DEVICES
MICROWAVE ISOLATOR–SURFACE MOUNT
CE073 Series
FEATURES
I
800 ~ 2000MHz frequency is available
I
Miniature, low profile
and light weight, low IL
I
Reflow solderable
I
Low price by reducing the parts
APPLICATIONS
I
Hand held telephone
I
Cordless telephone
I
Interstage matching in microwave circuits
PART NUMBERING
CE 073 R836 D
C B
001 – TA1
DIMENSIONS: mm
7
1
4.5
0.4
1
±
0.1
Series Name
Model Number
Center Frequency (In GHz, R : Decimal point)
Band Width
Rated Power
Signal Direction (Specify A or B in Fig. 1. B is standard.)
Standard type has no number. (Additional numbers for special specification)
Packaging Type TA1 : 178mm Dia. reel taping (250 pcs/reel)
TA2 : 330mm Dia. reel taping (1000 pcs/reel)
nothing : bulk
5.0
A
B
7
4.75
1.5
±
0.1
H
: Input or Output
: GROUND
H: CE073 2.3mm
CE074 1.8 mm
Signal Direction Marking: IN
ON
0.45
Fig. 1.
Terminal Location and Signal Direction (A or B)
SPECIFICATIONS – CE073 Series
Application
PDC
EPDC
CDMA
PDC
PCS
Part Number
CE073R950CCB
CE073R942DCB
CE073R836DCB
CE0731R44CCB
CE0731R88DCB
Frequency
Range (MHz)
940 ~ 960
925 ~ 960
824 ~ 849
1429 ~ 1453
1850 ~ 1910
Insertion Loss
(dB)
0.7 max.
0.7 max.
0.65 max.
0.6 max.
0.6 max.
Isolation
(dB)
13 min.
13 min.
15 min.
15 min.
15 min.
VSWR
1.6 max.
1.6 max.
1.5 max.
1.5 max.
1.6 max.
Rated Power
(W)
2.5
2.5
2.5
2.5
2.5
Reflection Power
(W)
0.6
0.6
0.6
0.6
0.6
Note:
Operating temperature range : –35°C ~ +85°C. At this temperature the isolator shall satisfy the above specification.
ISOLATION
0
10
INSERTION LOSS
0
10
Isolation (dB)
20
30
40
Isolation (dB)
20
30
40
736
836
936
736
836
936
Frequency (MHz)
Frequency (MHz)
306
CG01-J
HIGH FREQUENCY DEVICES
MICROWAVE ISOLATOR–SURFACE MOUNT
DIMENSIONS
LAND DIMENSIONS: mm
CE052 Series Land Pattern
0.00
a.
0.5
0T
2.50
LAND DIMENSIONS: mm
CE073 Series
Land Pattern
/H
5.00
4.5
3.4
3.4
4.5
3.45
3.00
2.50
2.05
3.9
2.8
2.8
Di
Slit width 0.25
4.25
3.75
1.75
0.00
0.54 (Z0=50 Ohm)
1.00
4.50
0.70
3.50
2.50
6.00
3.9
All slot
width 0.3mm
0
5
4.00
5.6
4.5
3.9
2.00
0.00
0
2.5
2.5
1.6
1.16
0.6
0.16
2.00
5
4.5
2.8
2.5
1.8
CE052 Series Solder Resist
CE073 Solder Resist
4.65
2.65
0
4.65
5.75
3.75
2.65
4.60
3.40
2.60
1.50
0.60
0.00
0.60
4.94
4.94
0.70
0.70
1.8
2.5
2.8
0.70
3.45
2.05
0.00
0.70
4.5
5
0
HIGH FREQUENCY
DEVICES
0.6
0
0.6
3.55
1.95
0.00
1.95
3.55
4.5
2.8
Note:
1. PCB Material; FR-4 Glass-Epoxy, h=0.30mm (or 0.10mmx3 Layers).
2. Hatched sections show the circuit patterns or the solder-masking pattern.
3. The bottom surface is a ground plane.
4. To place a ground plane at 0.3mm from the top surface is recommended.
Less distance may result in variation of the operating frequency due to stray capacitance.
Note:
Impedance of both input and output lines should be 50 ohms including land
pattern. This is the land pattern which applies t=0.2mm glass epoxy board (dielectric
constant=4.8, copper metalized on both surfaces). The stray capacitance should be
reduced as much as possible by removing the ground layer under the I/O land to secure
the isolator performance.
TAPE DIMENSIONS: mm
PO
P2
E
DO
T
TAPE DIMENSIONS: mm
PO
P2
E
DO
T
Max 7°
2.8
4.5
0
F
Max 7°
F
Max 7°
W
B
Max 7°
D1
P1
A
K
P1
A
K
CE052 SERIES
A
5.8 ± 0.1
F
7.5 ± 0.1
B
5.4 ± 0.1
K
2.0
+0.2
–0
W
16 ± 0.2
P0
4 ± 0.1
D0
1.55 ± 0.05
P2
2 ± 0.1
E
1.75 ± 0.1
T
0.3 ± 0.05
CE073 SERIES
A
7.4 ± 0.1
F
7.5 ± 0.1
B
7.4 ± 0.1
K
2.5
+0.2
–0
W
16 ± 0.2
P0
4 ± 0.1
D0
1.55 ± 0.05
P1
12 ± 0.1
D1
1.5 min.
P2
2 ± 0.1
E
1.75 ± 0.1
T
0.3 ± 0.05
P1
12 ± 0.1
Note:
A and B are the bottom of dimensions of the cavity.
CG01-J
W
B
307
HIGH FREQUENCY DEVICES
MICROWAVE ISOLATOR–SURFACE MOUNT
SOLDERING AND MOUNTING
SOLDERING
1. Reflow Soldering
Soldering must be carried out without exceeding the
approved soldering temperature and time shown within
the shaded area in Fig. 1. When soldering is repeated,
the allowed time should be taken for the accumulated time.
The standard soldering conditions are shown in Fig. 2.
2. Soldering with soldering iron
Soldering with soldering iron should be carried out according
to the following conditions.
Pre-heating
Temperature: 150°C
Time: 60 to 120 sec.
Soldering
Temperature (at the tip of the soldering iron): less than 280°C.
Time: less than 10 sec.
MOUNTING
When mounting the CE073 series isolator with a component
placement machine, a non-magnetic tool should be used since
there is some magnetic leakage from the isolator.
260
250
T
emperature (°C)
240
230
220
210
200
190
180
10
20
30
Time (sec.)
40
50
60
70
80
Solder: Sn60%–Pb40%
90
TERMINAL DIRECTION
GND
GND
GND
Fig. 1.
Allowable temperature and time of reflow soldering
Note:
It is allowed to be reflow soldered up to two times with this condition.
I/O
M
M
I/O
I/O
Peak temperature 225 ± 5°C
T
emperature (°C)
Direction of Feed
220
200
150
100
Pre-heating 150 ± 10°C
REEL DIMENSIONS: mm
W1
25
0
within 60 ~ 120 sec.
10 sec.
max.
D
Time (sec.)
B
B
N
C
W2
A
20 ~ 40 sec. max.
Measuring point of temperature in-out terminals of the device.
Reflow Soldering:
Both convection and infrared rays
Hot air
Hot plate
Part No.
TA1
TA2
Tolerance
A
178
330
±2.0
B
13
13
±0.5
C
21
21
±0.8
D
2
2
±0.5
N min.
50
50
—
W1
17.5
17.5
±1.5
W2 max.
23
23
—
Fig. 2.
Reflow soldering standard condition
TAPING CONDITION
Trailer Tape
Components
Empty Cavities
Leader
Without Sticking
Material
Plastic Tape
30
±
10
Cover Tape Only
No Components 240
±
25
260
±
20
No Components
130
±
20
Components
308
CG01-J
微控制器 MCU
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