Serial I/O Controller, 1 Channel(s), 0.0625MBps, CMOS, PQCC44, PLASTIC, LCC-44
| 参数名称 | 属性值 |
| 零件包装代码 | LCC |
| 包装说明 | QCCJ, |
| 针数 | 44 |
| Reach Compliance Code | unknown |
| 其他特性 | INTERFACED TO MOST 8, 16 AND 32 BIT MICROPROCESSORS; MODEM CONTROL I/OS USABLE AS GP I/OS |
| 地址总线宽度 | 3 |
| 边界扫描 | NO |
| 最大时钟频率 | 8 MHz |
| 通信协议 | ASYNC, BIT |
| 数据编码/解码方法 | NRZ |
| 最大数据传输速率 | 0.0625 MBps |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | S-PQCC-J44 |
| 长度 | 16.5862 mm |
| 低功率模式 | NO |
| DMA 通道数量 | |
| I/O 线路数量 | |
| 串行 I/O 数 | 1 |
| 端子数量 | 44 |
| 片上数据RAM宽度 | |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 认证状态 | Not Qualified |
| RAM（字数） | 0 |
| 座面最大高度 | 4.57 mm |
| 最大压摆率 | 10 mA |
| 最大供电电压 | 5.25 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 16.5862 mm |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Base Number Matches | 1 |
| CM16C450CQ-44 | CM82C50ACQ-44 | CM16C450CP-40 | CM82C50ACP-40 | |
|---|---|---|---|---|
| 描述 | Serial I/O Controller, 1 Channel(s), 0.0625MBps, CMOS, PQCC44, PLASTIC, LCC-44 | Serial I/O Controller, 1 Channel(s), 0.0625MBps, CMOS, PQCC44, PLASTIC, LCC-44 | Serial I/O Controller, 1 Channel(s), 0.0625MBps, CMOS, PDIP40, DIP-40 | Serial I/O Controller, 1 Channel(s), 0.0625MBps, CMOS, PDIP40, DIP-40 |
| 零件包装代码 | LCC | LCC | DIP | DIP |
| 包装说明 | QCCJ, | QCCJ, | DIP, | DIP, |
| 针数 | 44 | 44 | 40 | 40 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 其他特性 | INTERFACED TO MOST 8, 16 AND 32 BIT MICROPROCESSORS; MODEM CONTROL I/OS USABLE AS GP I/OS | INTERFACED TO MOST 8, 16 AND 32 BIT MICROPROCESSORS; MODEM CONTROL I/OS USABLE AS GP I/OS | INTERFACED TO MOST 8, 16 AND 32 BIT MICROPROCESSORS; MODEM CONTROL I/OS USABLE AS GP I/OS | INTERFACED TO MOST 8, 16 AND 32 BIT MICROPROCESSORS; MODEM CONTROL I/OS USABLE AS GP I/OS |
| 地址总线宽度 | 3 | 3 | 3 | 3 |
| 边界扫描 | NO | NO | NO | NO |
| 最大时钟频率 | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| 通信协议 | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT |
| 数据编码/解码方法 | NRZ | NRZ | NRZ | NRZ |
| 最大数据传输速率 | 0.0625 MBps | 0.0625 MBps | 0.0625 MBps | 0.0625 MBps |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | S-PQCC-J44 | S-PQCC-J44 | R-PDIP-T40 | R-PDIP-T40 |
| 低功率模式 | NO | NO | NO | NO |
| 串行 I/O 数 | 1 | 1 | 1 | 1 |
| 端子数量 | 44 | 44 | 40 | 40 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCJ | DIP | DIP |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 10 mA | 10 mA | 10 mA | 10 mA |
| 最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | QUAD | QUAD | DUAL | DUAL |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| 厂商名称 | - | California Micro Devices | California Micro Devices | California Micro Devices |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
