C SERIES |
Conductive Epoxy
TDK’s Conductive Epoxy Series is a conductive glue-mounted device
rather than solder-mounted.
In high-temperature environments, the
connectivity reliability is focused on the solder fillet because there are thermal
expansion coefficient differences between the substrate, MLCC, and solder
fillet. A conductive glue-mounted device allows for more “flexibility” during
periods of expansion and contraction because the thermal expansion
differences have been reduced by using a non-solder attachment.
Conductive glue is a common method of mounting components in
applications that demand reliability at high temperatures, particularly in
automotive environments. It's also used in applications that cannot be
subjected to the heat of the solder paste mounting process, such as LCD
panels, organic EL and LED displays, and CCD devices, which are particularly
sensitive to high temperatures.
B
T
L
B
W
L
W
T
B
Body Length
Body Width
Body Height
Terminal Width
Case Code
C1005/0402
C1608/0603
C2012/0805
C3216/1206
C3225/1210
L (mm)
1.00
1.60
2.00
3.20
3.20
W (mm)
0.50
0.80
1.25
1.60
2.50
T (mm)
0.50
0.80
1.25
1.60
2.50
Part Number Description
TEMPERATURE CHARACTERISTICS
RATED VOLTAGE (DC)
PACKAGING STYLE
INTERNAL CODES
C3216
X7R
1E
106
K
T
½½½B
SERIES NAME & DIMENSION CODE
CAPACITANCE TOLERANCE
NOMINAL CAPACITANCE (pF)
Features:
AgPdCu termination for conductive glue mounting
Reduce risk of silver migration
Improved mechanical/thermal strength when use with conductive glue
AEC Q-200 compliant
RoHS, WEE, and REACH compliant
Standard Termination
3
4
5
AgPdCu Termination
3
4
Applications:
Transmission control
Engine sensor module
Automotive power train
Anti-Lock Breaking System
Application requiring conductive glue mounting method
1
No.
(1)
(2)
(3)
(4)
(5)
NAME
Ceramic Dielectric
Internal Electrode
Termination
2
1
2
MATERIAL
Class 1
Class 2
CaZrO
3
BaTiO
3
Nickel (Ni)
Copper (Cu)
Nickel (Ni)
Tin (Sn)
No.
(1)
(2)
(3)
(4)
NAME
Ceramic Dielectric
Internal Electrode
Termination
MATERIAL
Class 1
Class 2
CaZrO
3
BaTiO
3
Nickel (Ni)
Copper (Cu)
AgPdCu
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