2MX36 QDR SRAM, 0.5ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
零件包装代码 | BGA |
包装说明 | 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 |
针数 | 165 |
Reach Compliance Code | unknown |
最长访问时间 | 0.5 ns |
其他特性 | PIPELINED ARCHITECTURE |
JESD-30 代码 | R-PBGA-B165 |
JESD-609代码 | e0 |
长度 | 17 mm |
内存密度 | 75497472 bit |
内存集成电路类型 | QDR SRAM |
内存宽度 | 36 |
湿度敏感等级 | NOT SPECIFIED |
功能数量 | 1 |
端子数量 | 165 |
字数 | 2097152 words |
字数代码 | 2000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 2MX36 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LBGA |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY, LOW PROFILE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 240 |
认证状态 | COMMERCIAL |
座面最大高度 | 1.4 mm |
最大供电电压 (Vsup) | 1.9 V |
最小供电电压 (Vsup) | 1.7 V |
标称供电电压 (Vsup) | 1.8 V |
表面贴装 | YES |
温度等级 | COMMERCIAL |
端子面层 | TIN LEAD |
端子形式 | BALL |
端子节距 | 1 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 15 mm |
Base Number Matches | 1 |
CY7C1515AV18-167BZC | CY7C1515AV18-200BZXI | CY7C1515AV18-200BZC | CY7C1513AV18-250BZC | CY7C1515AV18-250BZC | CY7C1513AV18-200BZC | CY7C1513AV18-200BZI | |
---|---|---|---|---|---|---|---|
描述 | 2MX36 QDR SRAM, 0.5ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 2MX36 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | 2MX36 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 4MX18 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 2MX36 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 4MX18 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 4MX18 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
包装说明 | 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 |
针数 | 165 | 165 | 165 | 165 | 165 | 165 | 165 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
最长访问时间 | 0.5 ns | 0.45 ns | 0.45 ns | 0.45 ns | 0.45 ns | 0.45 ns | 0.45 ns |
其他特性 | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE |
JESD-30 代码 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 |
长度 | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm |
内存密度 | 75497472 bit | 75497472 bit | 75497472 bit | 75497472 bit | 75497472 bit | 75497472 bit | 75497472 bi |
内存集成电路类型 | QDR SRAM | QDR SRAM | QDR SRAM | QDR SRAM | QDR SRAM | QDR SRAM | QDR SRAM |
内存宽度 | 36 | 36 | 36 | 18 | 36 | 18 | 18 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 165 | 165 | 165 | 165 | 165 | 165 | 165 |
字数 | 2097152 words | 2097152 words | 2097152 words | 4194304 words | 2097152 words | 4194304 words | 4194304 words |
字数代码 | 2000000 | 2000000 | 2000000 | 4000000 | 2000000 | 4000000 | 4000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C |
组织 | 2MX36 | 2MX36 | 2MX36 | 4MX18 | 2MX36 | 4MX18 | 4MX18 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
座面最大高度 | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm |
最大供电电压 (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm |
厂商名称 | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
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