Metal Oxide Varistors
SMD Multilayer Varistor with Ni barrier Termination
Data Sheet
CT0603K17LCG
B72500T2170K060
Designation System
CT
0603
K
17
LC
G
=
Chip
with
Three-layer-termination
= Dimensions of the device
06x03
(Length x width in 1/100 inch)
= Tolerance of the varistor voltage (± 10 %)
= Max. RMS operating voltage
=
Lower Capacitance
= Taped version, 7" reel (4000 pcs/reel)
Figure
l
b
l=
b=
s=
k=
1,6 ± 0,15
0,8 ± 0,1
0,9 max.
0,1 - 0,4
s
k
(All dimensions in mm)
ISSUE DATE
11.12.03
ISSUE
c
PUBLISHER
KB VS PE
PAGE
1/6
Metal Oxide Varistors
SMD Multilayer Varistor with Ni barrier Termination
Data Sheet
CT0603K17LCG
B72500T2170K060
V-I-Characteristic
200
V
v
100
80
60
40
VAR9779A
20
10
8
6
4
2
1
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
i
A 10
3
Deratingfield
10
2
A
i
max
10
1
i
max
t
r
5
10
5
0
1x
10
-1
5
10
-2
10
5
100
5
1000
5 µs
10000
t
r
ISSUE DATE
11.12.03
ISSUE
c
PUBLISHER
KB VS PE
PAGE
2/6
Metal Oxide Varistors
SMD Multilayer Varistor with Ni barrier Termination
Data Sheet
CT0603K17LCG
B72500T2170K060
Electrical Data
Max. operating voltage
RMS voltage
DC voltage
Varistor voltage (@ 1 mA)
Max. clamping voltage (@ 1 A)
Max. average power dissipation
Max. surge current (8/20 µs)
Max. energy absorption (2 ms)
Capacitance (@ 1kHz, 1 V; 25°C)
Response time
Operating temperature
Storage temperature (mounted parts)
Veff = 17 V
VDC = 22 V
Vv = 24.3 – 29.7 V
VC = 50 V
Pmax = 1 mW
Îmax = 1 x 10 A
Emax = 1 x 0.1 J
< 50 pF
< 0.5 ns
-40 ... +85 °C
-40 ... +125 °C
Max. current, energy, operating voltage and average power
dissipation depending on ambient temperature
%
100
90
80
70
60
50
40
30
20
10
0
-55
70
80
90
100 110 120
Ambient temperature
130
140
150 °C
ISSUE DATE
11.12.03
ISSUE
c
PUBLISHER
KB VS PE
PAGE
3/6
Metal Oxide Varistors
SMD Multilayer Varistor with Ni barrier Termination
Data Sheet
CT0603K17LCG
B72500T2170K060
Recommended solder pad layout
B
C
B
A
D
A
A = 1,0 mm
B = 1,0 mm
C = 1,0 mm
D = 3,0 mm
Recommended soldering temperature profiles
Wave soldering
300
°C
250
T
200
150
100°C...130°C
100
max. 2°C/s
50
0
0
50
100
150
t
200
s
250
50
0
0
50
100
150
t
200
s
250
100
max 2°C/s
1.Wave
235°C...260°C
10 s
2.Wave
T
200
150
300
°C
250
ca 245 °C
215 °C
180 °C
ca. 40 s
ca. 100 s
Reflow Soldering
IR reflow soldering
with cooling ca. 5°C/s
The components should be soldered within 12 months after delivery from EPCOS. The parts
are to be left in the original packing in order to avoid any soldering problems caused by
oxidized terminals.
Storage temperature: -25 to 45°C
Relative humidity: <75% annual average, <95% on max. 30 days in a year.
The usage of mild, non activated fluxes for soldering is recommended, as well as a proper
cleaning of the PCB.
ISSUE DATE
11.12.03
ISSUE
c
PUBLISHER
KB VS PE
PAGE
4/6
Metal Oxide Varistors
SMD Multilayer Varistor with Ni barrier Termination
Data Sheet
CT0603K17LCG
B72500T2170K060
Taping and Packaging:
Taping:
Tape and reel packing according to IEC 60286-3
Tape material:
Cardboard
T
P
0
D
0
P
2
E
F
B
0
T
1
T
T
2
A
0
1
P
1
Direction of unreeling
Dimensions and tolerances:
Definition
Compartment width
Compartment length
Sprocket hole diameter
Sprocket hole pitch
Distance center hole to center compartment
Pitch of the component compartments
Tape width
Distance edge to center of hole
Distance center hole to center compartment
Distance compartment to edge
Overall thickness
Thickness tape
1)
≤
± 0.2 mm over any 10 pitches
Package: 8 mm tape:
Symbol
A0
B0
D0
P0
P2
P1
W
E
F
G
T2
T
Dimension
[mm]
0.95
1.8
1.5
4.0
2.0
4.0
8.0
1.75
3.5
0.75
1.1
0.9
Tolerance
[mm]
± 0.2
± 0.2
+0.1 /-0
± 0.1 1)
± 0.05
± 0.1
± 0.3
± 0.1
± 0.05
min.
max.
max.
ISSUE DATE
11.12.03
ISSUE
c
PUBLISHER
KB VS PE
PAGE
G
W
5/6
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