Standard SRAM, 512KX8, 12ns, CMOS, PDSO36, 0.400 INCH, LEAD FREE, SOJ-36
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | SOJ |
| 包装说明 | SOJ, SOJ36,.44 |
| 针数 | 36 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.2.A |
| 最长访问时间 | 12 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDSO-J36 |
| JESD-609代码 | e4 |
| 长度 | 23.495 mm |
| 内存密度 | 4194304 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 36 |
| 字数 | 524288 words |
| 字数代码 | 512000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 512KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOJ |
| 封装等效代码 | SOJ36,.44 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.683 mm |
| 最大待机电流 | 0.01 A |
| 最小待机电流 | 2 V |
| 最大压摆率 | 0.085 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 10.16 mm |
| Base Number Matches | 1 |

| CY7C1049DV33-12VXI | CY7C1049DV33-8ZSXI | CY7C1049DV33-8ZSXC | CY7C1049DV33-10VXC | CY7C1049DV33-12VXC | CY7C1049DV33-8VXC | CY7C1049DV33-12ZSXI | CY7C1049DV33-10ZSXC | CY7C1049DV33-12ZSXC | CY7C1049DV33-8VXI | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 512KX8, 12ns, CMOS, PDSO36, 0.400 INCH, LEAD FREE, SOJ-36 | Standard SRAM, 512KX8, 8ns, CMOS, PDSO44, LEAD FREE, TSOP2-44 | Standard SRAM, 512KX8, 8ns, CMOS, PDSO44, LEAD FREE, TSOP2-44 | Standard SRAM, 512KX8, 10ns, CMOS, PDSO36, 0.400 INCH, LEAD FREE, SOJ-36 | Standard SRAM, 512KX8, 12ns, CMOS, PDSO36, 0.400 INCH, LEAD FREE, SOJ-36 | Standard SRAM, 512KX8, 8ns, CMOS, PDSO36, 0.400 INCH, LEAD FREE, SOJ-36 | Standard SRAM, 512KX8, 12ns, CMOS, PDSO44, LEAD FREE, TSOP2-44 | Standard SRAM, 512KX8, 10ns, CMOS, PDSO44, LEAD FREE, TSOP2-44 | Standard SRAM, 512KX8, 12ns, CMOS, PDSO44, LEAD FREE, TSOP2-44 | Standard SRAM, 512KX8, 8ns, CMOS, PDSO36, 0.400 INCH, LEAD FREE, SOJ-36 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOJ | TSOP2 | TSOP2 | SOJ | SOJ | SOJ | TSOP2 | TSOP2 | TSOP2 | SOJ |
| 包装说明 | SOJ, SOJ36,.44 | TSOP2, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 | SOJ, SOJ36,.44 | 0.400 INCH, LEAD FREE, SOJ-36 | SOJ, SOJ36,.44 | TSOP2, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 | 0.400 INCH, LEAD FREE, SOJ-36 |
| 针数 | 36 | 44 | 44 | 36 | 36 | 36 | 44 | 44 | 44 | 36 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 12 ns | 8 ns | 8 ns | 10 ns | 12 ns | 8 ns | 12 ns | 10 ns | 12 ns | 8 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PDSO-J36 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-J36 | R-PDSO-J36 | R-PDSO-J36 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-J36 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 23.495 mm | 18.415 mm | 18.415 mm | 23.495 mm | 23.495 mm | 23.495 mm | 18.415 mm | 18.415 mm | 18.415 mm | 23.495 mm |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 36 | 44 | 44 | 36 | 36 | 36 | 44 | 44 | 44 | 36 |
| 字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C |
| 组织 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOJ | TSOP2 | TSOP2 | SOJ | SOJ | SOJ | TSOP2 | TSOP2 | TSOP2 | SOJ |
| 封装等效代码 | SOJ36,.44 | TSOP44,.46,32 | TSOP44,.46,32 | SOJ36,.44 | SOJ36,.44 | SOJ36,.44 | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 | SOJ36,.44 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.683 mm | 1.194 mm | 1.194 mm | 3.683 mm | 3.683 mm | 3.683 mm | 1.194 mm | 1.194 mm | 1.194 mm | 3.683 mm |
| 最大待机电流 | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A |
| 最小待机电流 | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| 最大压摆率 | 0.085 mA | 0.1 mA | 0.09 mA | 0.08 mA | 0.075 mA | 0.09 mA | 0.085 mA | 0.08 mA | 0.075 mA | 0.1 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | J BEND | GULL WING | GULL WING | J BEND | J BEND | J BEND | GULL WING | GULL WING | GULL WING | J BEND |
| 端子节距 | 1.27 mm | 0.8 mm | 0.8 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.8 mm | 0.8 mm | 0.8 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 20 | 20 | 20 | 40 | 40 | 20 | 40 | 20 | 40 |
| 宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 |
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