IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,DIP,28PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DIP, DIP28,.6 |
| Reach Compliance Code | compliant |
| 位大小 | 8 |
| CPU系列 | COP800 |
| JESD-30 代码 | R-PDIP-T28 |
| JESD-609代码 | e0 |
| 湿度敏感等级 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP28,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM(字节) | 256 |
| ROM(单词) | 8192 |
| ROM可编程性 | MROM |
| 速度 | 1 MHz |
| 最大压摆率 | 10 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| COPEKH984-XXX/N | COPEKH984XXX/WM/NOPB | COPEK888XXX/DWF | COPEKH984-XXX/N/NOPB | |
|---|---|---|---|---|
| 描述 | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,DIP,28PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,SOP,28PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,WAFER | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,DIP,28PIN,PLASTIC |
| 包装说明 | DIP, DIP28,.6 | SOP, SOP28,.4 | , WAFER | DIP, DIP28,.6 |
| Reach Compliance Code | compliant | compliant | unknown | compliant |
| 位大小 | 8 | 8 | 8 | 8 |
| CPU系列 | COP800 | COP800 | COP800 | COP800 |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 70 °C |
| 封装等效代码 | DIP28,.6 | SOP28,.4 | WAFER | DIP28,.6 |
| 电源 | 5 V | 5 V | 3/5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM(字节) | 256 | 256 | 256 | 256 |
| ROM(单词) | 8192 | 8192 | 8192 | 8192 |
| ROM可编程性 | MROM | MROM | MROM | MROM |
| 速度 | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
| 最大压摆率 | 10 mA | 10 mA | 10 mA | 10 mA |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| Base Number Matches | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 不符合 | 符合 | - | 符合 |
| JESD-30 代码 | R-PDIP-T28 | R-PDSO-G28 | - | R-PDIP-T28 |
| JESD-609代码 | e0 | e3 | - | e3 |
| 湿度敏感等级 | 1 | 2A | - | 1 |
| 端子数量 | 28 | 28 | - | 28 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | - | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | - | IN-LINE |
| 标称供电电压 | 5 V | 5 V | - | 5 V |
| 表面贴装 | NO | YES | - | NO |
| 端子面层 | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | - | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE | GULL WING | - | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | - | 2.54 mm |
| 端子位置 | DUAL | DUAL | - | DUAL |
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