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MAX8521EWX+

产品描述SPECIALTY INTERFACE CIRCUIT, PBGA36
产品类别半导体    模拟混合信号IC   
文件大小334KB,共18页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
下载文档 详细参数 选型对比 全文预览

MAX8521EWX+概述

SPECIALTY INTERFACE CIRCUIT, PBGA36

专业接口电路, PBGA36

MAX8521EWX+规格参数

参数名称属性值
功能数量1
端子数量36
最大工作温度85 Cel
最小工作温度-40 Cel
最大供电电压15.5 V
最小供电电压13 V
额定供电电压15 V
加工封装描述3 X 3 MM, MICRO, CSP-36
状态ACTIVE
工艺BICMOS
包装形状SQUARE
包装尺寸GRID ARRAY, VERY THIN PROFILE, FINE PITCH
表面贴装Yes
端子形式BALL
端子间距0.5000 mm
端子涂层NOT SPECIFIED
端子位置BOTTOM
包装材料PLASTIC/EPOXY
温度等级INDUSTRIAL
接口类型INTERFACE CIRCUIT

文档预览

下载PDF文档
19-2586; Rev 1; 12/08
KIT
ATION
EVALU
BLE
AVAILA
Smallest TEC Power Drivers for Optical
Modules
General Description
The MAX8520/MAX8521 are designed to drive thermo-
electric coolers (TECs) in space-constrained optical
modules. Both devices deliver ±1.5A output current
and control the TEC current to eliminate harmful current
surges. On-chip FETs minimize external components
and high switching frequency reduces the size of exter-
nal components.
The MAX8520/MAX8521 operate from a single supply and
bias the TEC between the outputs of two synchronous
buck regulators. This operation allows for temperature
control without “dead zones” or other nonlinearities at
low current. This arrangement ensures that the control
system does not hunt when the set-point is very close
to the natural operating point, requiring a small amount
of heating or cooling. An analog control signal precisely
sets the TEC current.
Both devices feature accurate, individually-adjustable
heating current limit and cooling current limit along with
maximum TEC voltage limit to improve the reliability of
optical modules. An analog output signal monitors the
TEC current. A unique ripple cancellation scheme helps
reduce noise.
The MAX8520 is available in a 5mm x 5mm thin QFN
package and its switching frequency is adjustable up
to 1MHz through an external resistor. The MAX8521 is
also available in a 5mm x 5mm thin QFN as well as
space-saving 3mm x 3mm UCSP™ and 36-bump WLP
(3mm x 3mm) packages, with a pin-selectable switch-
ing frequency of 500kHz or 1MHz.
o
Circuit Footprint 0.31in
2
o
Low Profile Design
o
On-Chip Power MOSFETs
o
High-Efficiency Switch-Mode Design
o
Ripple Cancellation for Low Noise
o
Direct Current Control Prevents TEC Current
Surges
o
5% Accurate Adjustable Heating/Cooling Current
Limits
o
2% Accurate TEC Voltage Limit
o
No Dead Zone or Hunting at Low Output Current
o
ITEC Monitors TEC Current
o
1% Accurate Voltage Reference
o
Switching Frequency up to 1MHz
o
Synchronization (MAX8521)
Features
MAX8520/MAX8521
Ordering Information
PART
MAX8520ETP
MAX8521EBX
MAX8521ETP
MAX8521EWX+
TEMP RANGE
PIN-PACKAGE
-40°C to +85°C 20 Thin QFN-EP* 5mm x 5mm
-40°C to +85°C 6 x 6 UCSP 3mm x 3mm
-40°C to +85°C 20 Thin QFN-EP* 5mm x 5mm
-40°C to +85°C 36 WLP** 3mm x 3mm
Applications
SFF/SFP Modules
Fiber Optic Laser Modules
Fiber Optic Network Equipment
ATE
Biotech Lab Equipment
+Denotes
a lead(Pb)-free/RoHS-compliant package.
*EP
= Exposed pad.
**Four
center bumps depopulated.
Typical Operating Circuit
INPUT
3V TO 5.5V
V
DD
PV
DD
FREQ
ON
OFF
TEC CURRENT
MONITOR
CURRENT-
CONTROL
SIGNAL
SHDN
ITEC
MAX8521
CTLI
COMP
REF
GND
PGND2
OS1
OS2
LX2
TEC
OUTPUT
I
TEC
=
±
1.5A
CS
LX1
PGND1
Pin Configurations appear at end of data sheet
ANALOG /DIGITAL
TEMPERATURE CONTROL
UCSP is a trademark of Maxim Integrated Products, Inc.
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.

MAX8521EWX+相似产品对比

MAX8521EWX+ MAX8521 MAX8520_08
描述 SPECIALTY INTERFACE CIRCUIT, PBGA36 SPECIALTY INTERFACE CIRCUIT, PBGA36 SPECIALTY INTERFACE CIRCUIT, PBGA36
功能数量 1 1 1
端子数量 36 36 36
最大工作温度 85 Cel 85 Cel 85 Cel
最小工作温度 -40 Cel -40 Cel -40 Cel
最大供电电压1 5.5 V 5.5 V 5.5 V
最小供电电压1 3 V 3 V 3 V
额定供电电压1 5 V 5 V 5 V
加工封装描述 3 X 3 MM, MICRO, CSP-36 3 X 3 MM, MICRO, CSP-36 3 X 3 MM, MICRO, CSP-36
状态 ACTIVE ACTIVE ACTIVE
工艺 BICMOS BICMOS BICMOS
包装形状 SQUARE SQUARE SQUARE
包装尺寸 GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
表面贴装 Yes Yes Yes
端子形式 BALL BALL BALL
端子间距 0.5000 mm 0.5000 mm 0.5000 mm
端子涂层 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
端子位置 BOTTOM BOTTOM BOTTOM
包装材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
接口类型 INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT
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