I2C-Interfaced Key-Switch Controller and LED Driver/GPIOs with Integrated ESD Protection
MAX7360 | MAX7360EWX+ | MAX7360ETL+ | |
---|---|---|---|
描述 | I2C-Interfaced Key-Switch Controller and LED Driver/GPIOs with Integrated ESD Protection | I2C-Interfaced Key-Switch Controller and LED Driver/GPIOs with Integrated ESD Protection | I2C-Interfaced Key-Switch Controller and LED Driver/GPIOs with Integrated ESD Protection |
是否Rohs认证 | - | 符合 | 符合 |
零件包装代码 | - | BGA | QFN |
包装说明 | - | VFBGA, | HVQCCN, |
针数 | - | 36 | 40 |
Reach Compliance Code | - | compli | compli |
ECCN代码 | - | EAR99 | EAR99 |
Factory Lead Time | - | 1 week | 6 weeks |
模拟集成电路 - 其他类型 | - | SWITCHING REGULATOR | SWITCHING REGULATOR |
控制技术 | - | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION |
最大输入电压 | - | 3.6 V | 3.6 V |
最小输入电压 | - | 1.62 V | 1.62 V |
标称输入电压 | - | 3.3 V | 3.3 V |
JESD-30 代码 | - | S-PBGA-B36 | S-XQCC-N40 |
长度 | - | 2.57 mm | 5 mm |
湿度敏感等级 | - | 1 | 1 |
功能数量 | - | 1 | 1 |
端子数量 | - | 36 | 40 |
最高工作温度 | - | 85 °C | 85 °C |
最低工作温度 | - | -40 °C | -40 °C |
封装主体材料 | - | PLASTIC/EPOXY | UNSPECIFIED |
封装代码 | - | VFBGA | HVQCCN |
封装形状 | - | SQUARE | SQUARE |
封装形式 | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | - | 260 | NOT SPECIFIED |
认证状态 | - | Not Qualified | Not Qualified |
座面最大高度 | - | 0.69 mm | 0.8 mm |
表面贴装 | - | YES | YES |
切换器配置 | - | SINGLE | SINGLE |
最大切换频率 | - | 164 kHz | 164 kHz |
温度等级 | - | INDUSTRIAL | INDUSTRIAL |
端子形式 | - | BALL | NO LEAD |
端子节距 | - | 0.4 mm | 0.4 mm |
端子位置 | - | BOTTOM | QUAD |
处于峰值回流温度下的最长时间 | - | 30 | NOT SPECIFIED |
宽度 | - | 2.57 mm | 5 mm |
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