电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MAX253C/D

产品描述SPECIALTY INTERFACE CIRCUIT, PDIP8
产品类别模拟混合信号IC    驱动程序和接口   
文件大小277KB,共18页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
下载文档 详细参数 选型对比 全文预览

MAX253C/D概述

SPECIALTY INTERFACE CIRCUIT, PDIP8

专业接口电路, PDIP8

MAX253C/D规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Maxim(美信半导体)
零件包装代码DIE
包装说明DIE
针数7
Reach Compliance Code_compli
ECCN代码EAR99
接口集成电路类型INTERFACE CIRCUIT
JESD-30 代码R-XUUC-N
JESD-609代码e0
湿度敏感等级1
功能数量1
端子数量7
最高工作温度70 °C
最低工作温度
封装主体材料UNSPECIFIED
封装代码DIE
封装等效代码DIE OR CHIP
封装形状RECTANGULAR
封装形式UNCASED CHIP
峰值回流温度(摄氏度)240
电源5 V
认证状态Not Qualified
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN LEAD
端子形式NO LEAD
端子位置UPPER
处于峰值回流温度下的最长时间NOT SPECIFIED

文档预览

下载PDF文档
MAX253
Transformer Driver for
Isolated RS-485 Interface
General Description
The MAX253 monolithic oscillator/power-driver is
specifically designed to provide isolated power for an
isolated RS-485 or RS-232 data interface. The device
drives a center-tapped transformer primary from a 5V
or 3.3V DC power supply. The secondary can be
wound to provide any isolated voltage needed at power
levels up to 1W.
The MAX253 consists of a CMOS oscillator driving a
pair of N-channel power switches. The oscillator runs
at double the output frequency, driving a toggle flip-
flop to ensure 50% duty cycle to each of the switches.
Internal delays are arranged to ensure break-before-
make action between the two switches.
The SD pin puts the entire device into a low-power
shutdown state, disabling both the power switches and
oscillator.
Benefits and Features
Simple Power-Supply Transformer Driver Design for
Isolated RS-485/RS-232 Data-Interface Applications
Single 5V or 3.3V Supply
Low-Current Shutdown Mode: 0.4µA
Pin-Selectable Frequency: 350kHz or 200kHz
8-Pin DIP, SO, and µMAX® Packages Take Minimal
Board Space
Ordering Information
PART
MAX253CPA
MAX253CSA
MAX253CUA
MAX253C/D
MAX253EPA
MAX253ESA
MAX253ESA/V
MAX253MJA
TEMP RANGE
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-55°C to +125°C
PIN-PACKAGE
8 Plastic DIP
8 SO
8 µMAX
Dice*
8 Plastic DIP
8 SO
8 SO
8 CERDIP**
Applications
Isolated RS-485/RS-232 Power-Supply
Transformer Driver
High Noise-Immunity Communications Interface
Isolated and/or High-Voltage Power Supplies
Bridge Ground Differentials
Medical Equipment
Process Control
*Contact
factory for dice specifications.
**Contact
factory for availability and processing to MIL-STD-883.
Devices are also available in a lead(Pb)-free/RoHS-compliant
package. Specify lead-free by adding a (+) to the part number
when ordering.
/V Denotes an automotive qualified part.
Typical Operating Circuit
ON / OFF
4
SD
6
V
CC
D1
1
C3
C2
V
IN
5V
C1
OUTPUT
5V @ 200mA
MAX253
3
FREQUENCY
SWITCH
FS
GND1
2
D2
GND2
7
8
µMAX is a registered trademark of Maxim Integrated Products, Inc.
19-0226; Rev 3; 2/15

MAX253C/D相似产品对比

MAX253C/D MAX253 MAX253_09 MAX253CUA+T MAX253ESA+T MAX253ESA/V+ MAX253ESA/V+T
描述 SPECIALTY INTERFACE CIRCUIT, PDIP8 SPECIALTY INTERFACE CIRCUIT, PDIP8 SPECIALTY INTERFACE CIRCUIT, PDIP8 IC DRVR TRANSFORMER 8-UMAX Interface Circuit, CMOS, PDSO8, ROHS COMPLIANT, SOP-8 Interface Circuit, CMOS, PDSO8, 0.150 INCH, SOP-8
功能数量 1 1 1 1 1 1 1
端子数量 7 8 8 8 8 8 8
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 NO LEAD THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING
端子位置 UPPER DUAL DUAL DUAL DUAL DUAL DUAL
是否无铅 含铅 - - 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 不符合 - - 符合 符合 符合 符合
零件包装代码 DIE - - SOIC SOIC SOIC SOIC
包装说明 DIE - - TSSOP, TSSOP8,.19 SOP, SOP8,.25 SOP, SOP8,.25 SOP, SOP8,.25
针数 7 - - 8 8 8 8
Reach Compliance Code _compli - - compliant compliant compliant compliant
ECCN代码 EAR99 - - EAR99 EAR99 EAR99 EAR99
接口集成电路类型 INTERFACE CIRCUIT - - INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 代码 R-XUUC-N - - S-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
JESD-609代码 e0 - - e3 e3 e3 e3
湿度敏感等级 1 - - 1 1 1 1
最高工作温度 70 °C - - 70 °C 85 °C 85 °C 85 °C
封装主体材料 UNSPECIFIED - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIE - - TSSOP SOP SOP SOP
封装等效代码 DIE OR CHIP - - TSSOP8,.19 SOP8,.25 SOP8,.25 SOP8,.25
封装形状 RECTANGULAR - - SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 UNCASED CHIP - - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
峰值回流温度(摄氏度) 240 - - 260 260 NOT SPECIFIED NOT SPECIFIED
电源 5 V - - 5 V 5 V 5 V 5 V
认证状态 Not Qualified - - Not Qualified Not Qualified Not Qualified Not Qualified
最大供电电压 5.5 V - - 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 4.5 V - - 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 5 V - - 5 V 5 V 5 V 5 V
表面贴装 YES - - YES YES YES YES
技术 CMOS - - CMOS CMOS CMOS CMOS
端子面层 TIN LEAD - - Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
处于峰值回流温度下的最长时间 NOT SPECIFIED - - 30 30 NOT SPECIFIED NOT SPECIFIED
Factory Lead Time - - - 6 weeks 6 weeks 6 weeks 6 weeks
长度 - - - 3 mm 4.9 mm 4.9 mm 4.9 mm
座面最大高度 - - - 1.1 mm 1.75 mm 1.75 mm 1.75 mm
端子节距 - - - 0.65 mm 1.27 mm 1.27 mm 1.27 mm
宽度 - - - 3 mm 3.9 mm 3.9 mm 3.9 mm

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 637  894  713  2866  2785  39  15  38  13  18 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved