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MASW-003102-13590

产品描述2000 MHz - 18000 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 1.8 dB INSERTION LOSS
产品类别热门应用    无线/射频/通信   
文件大小148KB,共7页
制造商MACOM
官网地址http://www.macom.com
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MASW-003102-13590概述

2000 MHz - 18000 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 1.8 dB INSERTION LOSS

2000 MHz - 18000 MHz 射频/微波单刀双掷开关, 1.8 dB 插入 损耗

MASW-003102-13590规格参数

参数名称属性值
最大工作温度125 Cel
最小工作温度-65 Cel
最大输入功率2 W
最大工作频率18000 MHz
最小工作频率2000 MHz
加工封装描述ROHS COMPLIANT, DIE-5
无铅Yes
欧盟RoHS规范Yes
状态ACTIVE
结构COMPONENT
端子涂层NOT SPECIFIED
最大插入损耗1.8 dB
微波射频类型SGL POLE DOUBLE THROW SWITCH

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MASW-002102-13580
MASW-003102-13590
HMIC™ Silicon PIN Diode Switches
with Integrated Bias Network
Features







Broad Bandwidth Specified up to 18 GHz
Usable up to 26 GHz
Integrated Bias Network
Low Insertion Loss / High Isolation
Rugged,
Fully Monolithic
Glass Encapsulate Construction
RoHS Compliant
M/A-COM Products
Rev. V3
MASW-002102-13580
Description
The MASW-002102-13580 and MASW-003102-13590
devices are SP2T and SP3T broad band switches with
integrated bias networks utilizing M/A-COM's HMIC
TM
(Heterolithic Microwave Integrated Circuit) process,
US Patent 5,268,310. This process allows the
incorporation of silicon pedestals that form series and
shunt diodes or vias by imbedding them in low loss, low
dispersion glass. By using small spacing between
elements, this combination of silicon and glass gives
HMIC devices low loss and high isolation performance
with exceptional repeatability through low millimeter
frequencies. Large bond pads facilitate the use of low
inductance ribbon bonds, while gold backside
metallization allows for manual or automatic chip
bonding via 80/20 - Au/Sn, 62/36/2 - Sn/Pb/Ag solders
or electrically conductive silver epoxy.
MASW-003102-13590
Parameter
Operating Temperature
Storage Temperature
Junction Temperature
Applied Reverse Voltage
RF Incident Power
Bias Current +25°C
Absolute Maximum
-65
o
C to +125
o
C
-65
o
C to +150
o
C
+175
o
C
50V
+33dBm C.W.
±20mA
Max. operating conditions for a combination
of RF power, D.C. bias and temperature:
+33dBm CW @ 15mA (per diode) @+85°C
Yellow areas denote wire bond pads
1
ADVANCED:
Data Sheets contain information regarding a product MA-COM Technical Solutions is
North America
Tel: 800.366.2266 / Fax: 978.366.2266
considering for development. Performance is based on target specifications, simulated results, and/
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
or prototype measurements. Commitment to develop is not guaranteed.
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product MA-COM Technical Solutions
Visit www.macom.com for additional data sheets and product information.
has under development. Performance is based on engineering tests. Specifications are typical.
Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit-
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
ment to produce in volume is not guaranteed.
product(s) or information contained herein without notice.
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