Bus Driver
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
包装说明 | SOP, |
Reach Compliance Code | compliant |
系列 | CBT/FST/QS/5C/B |
JESD-30 代码 | R-PDSO-G24 |
长度 | 15.4 mm |
逻辑集成电路类型 | BUS DRIVER |
位数 | 5 |
功能数量 | 2 |
端口数量 | 2 |
端子数量 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
传播延迟(tpd) | 0.25 ns |
座面最大高度 | 2.65 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.5 mm |
Base Number Matches | 1 |
CBTD3384D-T | CBTD3384DB | CBTD3384DK | CBTD3384PW | CBTD3384PW-T | CBTD3384DK-T | CBTD3384DB-T | CBTD3384D | |
---|---|---|---|---|---|---|---|---|
描述 | Bus Driver | Bus Driver | Bus Driver | Bus Driver | Bus Driver | Bus Driver | Bus Driver | Bus Driver |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
包装说明 | SOP, | SSOP, | SSOP, | TSSOP, | TSSOP, | SSOP, | SSOP, | SOP, |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
系列 | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | - | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B |
JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | - | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 |
长度 | 15.4 mm | 8.2 mm | 8.7 mm | - | 7.8 mm | 8.7 mm | 8.2 mm | 15.4 mm |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
位数 | 5 | 5 | 5 | - | 5 | 5 | 5 | 5 |
功能数量 | 2 | 2 | 2 | - | 2 | 2 | 2 | 2 |
端口数量 | 2 | 2 | 2 | - | 2 | 2 | 2 | 2 |
端子数量 | 24 | 24 | 24 | - | 24 | 24 | 24 | 24 |
最高工作温度 | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | - | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SSOP | SSOP | - | TSSOP | SSOP | SSOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | 260 | 260 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 260 |
传播延迟(tpd) | 0.25 ns | 0.25 ns | 0.25 ns | - | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns |
座面最大高度 | 2.65 mm | 2 mm | 1.73 mm | - | 1.1 mm | 1.73 mm | 2 mm | 2.65 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | - | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 0.65 mm | 0.635 mm | - | 0.65 mm | 0.635 mm | 0.65 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | 30 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 |
宽度 | 7.5 mm | 5.3 mm | 3.9 mm | - | 4.4 mm | 3.9 mm | 5.3 mm | 7.5 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
厂商名称 | - | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved