EEPROM, 512X16, Serial, CMOS, PDSO8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 包装说明 | SON, SOLCC8,.12,25 |
| Reach Compliance Code | unknown |
| 备用内存宽度 | 8 |
| 数据保留时间-最小值 | 100 |
| 耐久性 | 1000000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-N8 |
| 内存密度 | 8192 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 16 |
| 端子数量 | 8 |
| 字数 | 512 words |
| 字数代码 | 512 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 组织 | 512X16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SON |
| 封装等效代码 | SOLCC8,.12,25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 电源 | 2/5 V |
| 认证状态 | Not Qualified |
| 串行总线类型 | MICROWIRE |
| 最大待机电流 | 0.00001 A |
| 最大压摆率 | 0.003 mA |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | NO LEAD |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 写保护 | SOFTWARE |
| Base Number Matches | 1 |

| CAT93C76ZD4E-TE13 | CAT93C76VI-TE13 | CAT93C76VE-TE13 | CAT93C76ZD4I-TE13 | CAT93C76RD4E-TE13 | CAT93C76RD4I-TE13 | CAT93C76SE-TE13 | CAT93C76UI-TE13 | CAT93C76PI | CAT93C76PE | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 512X16, Serial, CMOS, PDSO8 | EEPROM, 512X16, Serial, CMOS, PDSO8 | EEPROM, 512X16, Serial, CMOS, PDSO8 | EEPROM, 512X16, Serial, CMOS, PDSO8 | EEPROM, 512X16, Serial, CMOS, PDSO8 | EEPROM, 512X16, Serial, CMOS, PDSO8 | EEPROM, 512X16, Serial, CMOS, PDSO8 | EEPROM, 512X16, Serial, CMOS, PDSO8 | EEPROM, 512X16, Serial, CMOS, PDIP8 | EEPROM, 512X16, Serial, CMOS, PDIP8 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | SON, SOLCC8,.12,25 | SOP, SOP8,.25 | SOP, SOP8,.25 | SON, SOLCC8,.12,25 | SON, SOLCC8,.12,25 | SON, SOLCC8,.12,25 | SOP, SOP8,.25 | TSSOP, TSSOP8,.25 | DIP, DIP8,.3 | DIP, DIP8,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 数据保留时间-最小值 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
| 耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 |
| 内存密度 | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
| 字数代码 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| 最高工作温度 | 125 °C | 85 °C | 125 °C | 85 °C | 125 °C | 85 °C | 125 °C | 85 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 512X16 | 512X16 | 512X16 | 512X16 | 512X16 | 512X16 | 512X16 | 512X16 | 512X16 | 512X16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SON | SOP | SOP | SON | SON | SON | SOP | TSSOP | DIP | DIP |
| 封装等效代码 | SOLCC8,.12,25 | SOP8,.25 | SOP8,.25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOP8,.25 | TSSOP8,.25 | DIP8,.3 | DIP8,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | IN-LINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 电源 | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 串行总线类型 | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
| 最大待机电流 | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A |
| 最大压摆率 | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE |
| 端子形式 | NO LEAD | GULL WING | GULL WING | NO LEAD | NO LEAD | NO LEAD | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 0.635 mm | 1.27 mm | 1.27 mm | 0.635 mm | 0.635 mm | 0.635 mm | 1.27 mm | 0.635 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 写保护 | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE |
| 厂商名称 | - | - | - | - | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst |
| JESD-609代码 | - | - | - | - | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子面层 | - | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved