EEPROM, 32KX8, 250ns, Parallel, CMOS, PQCC32
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | QCCJ, LDCC32,.5X.6 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 250 ns |
| 命令用户界面 | NO |
| 数据轮询 | YES |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PQCC-J32 |
| JESD-609代码 | e0 |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 端子数量 | 32 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 最高工作温度 | 170 °C |
| 最低工作温度 | |
| 组织 | 32KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC32,.5X.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER |
| 页面大小 | 64 words |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.0003 A |
| 最大压摆率 | 0.03 mA |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 切换位 | YES |
| 最长写入周期时间 (tWC) | 10 ms |
| Base Number Matches | 1 |
| CAT28HT256HN-25 | CAT28HT256HT14-20 | CAT28HT256HT14-25 | CAT28HT256T14-25 | CAT28HT256T14-20 | CAT28HT256T13-25 | CAT28HT256N-25 | CAT28HT256P-20 | CAT28HT256HP-25 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 32KX8, 250ns, Parallel, CMOS, PQCC32 | EEPROM, 32KX8, 200ns, Parallel, CMOS, PDSO32 | EEPROM, 32KX8, 250ns, Parallel, CMOS, PDSO32 | EEPROM, 32KX8, 250ns, Parallel, CMOS, PDSO32 | EEPROM, 32KX8, 200ns, Parallel, CMOS, PDSO32 | EEPROM, 32KX8, 250ns, Parallel, CMOS, PDSO28 | EEPROM, 32KX8, 250ns, Parallel, CMOS, PQCC32 | EEPROM, 32KX8, 200ns, Parallel, CMOS, PDIP28 | EEPROM, 32KX8, 250ns, Parallel, CMOS, PDIP28 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | QCCJ, LDCC32,.5X.6 | TSSOP, TSSOP32,.56,20 | TSSOP, TSSOP32,.56,20 | TSSOP, TSSOP32,.56,20 | TSSOP, TSSOP32,.56,20 | TSSOP, TSSOP28,.53,22 | QCCJ, LDCC32,.5X.6 | DIP, DIP28,.6 | DIP, DIP28,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 250 ns | 200 ns | 250 ns | 250 ns | 200 ns | 250 ns | 250 ns | 200 ns | 250 ns |
| 命令用户界面 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 数据轮询 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PQCC-J32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G28 | R-PQCC-J32 | R-PDIP-T28 | R-PDIP-T28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 28 | 32 | 28 | 28 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 最高工作温度 | 170 °C | 170 °C | 170 °C | 170 °C | 170 °C | 170 °C | 170 °C | 170 °C | 170 °C |
| 组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | QCCJ | DIP | DIP |
| 封装等效代码 | LDCC32,.5X.6 | TSSOP32,.56,20 | TSSOP32,.56,20 | TSSOP32,.56,20 | TSSOP32,.56,20 | TSSOP28,.53,22 | LDCC32,.5X.6 | DIP28,.6 | DIP28,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER | IN-LINE | IN-LINE |
| 页面大小 | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.0003 A | 0.0003 A | 0.0003 A | 0.0003 A | 0.0003 A | 0.0003 A | 0.0003 A | 0.0003 A | 0.0003 A |
| 最大压摆率 | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.55 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL |
| 切换位 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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